Difference between revisions of "intel/atom"

Latest revision as of 08:32, 16 July 2019

Intel Atom

Intel Atom (2015 logo)
Developer	Intel
Manufacturer	Intel
Type	system on chips, microprocessors
Introduction	March 2, 2008 (announced) April 2, 2008 (launch)
ISA	IA-32, x86-64
µarch	Bonnell
Word size	32 32 bit 4 octets 8 nibbles , 64 64 bit 8 octets 16 nibbles
Process	45 nm 0.045 μm 4.5e-5 mm , 32 nm 0.032 μm 3.2e-5 mm , 22 nm 0.022 μm 2.2e-5 mm , 14 nm 0.014 μm 1.4e-5 mm
Technology	CMOS
Clock	500 MHz-2400 MHz
Package	FCBGA-437, PBGA-441
Socket	BGA

Atom is an family of ultra-low-voltage 32 and 64-bit microprocessors and system on chips designed by Intel since 2008.

Models[edit]

Bonnell[edit]

Main article: Bonnell Microarchitecture

Bonnell was the first microarchitecture designed specifically for the ultra-low power microprocessor market. Introduced in 2008, it featured fully x86-compatible cores with a TDP of only 500 mW to 2 W, less than any other x86 processor available at the time. Bonnell's low-power came from its simplicity, being an in-order dual-issue pipelined CPU. All Bonnell-based processors were manufactured on Intel's 45 nm process.

Silverthorne (MIDs, 1st Gen)[edit]

See also: Silverthorne Core

The first series of Bonnell processors were introduced during the 2008 Intel Developer Forum (IDF) in Shanghai, China. Those 32-bit processors were based on the Silverthorne core which were designed for the Mobile Internet Devices (MID) market. Silverthorne processors have 56 KiB of L1$ and 512 KiB of L2. Silverthorne has support for the traditional AGTL+-based FSB as well as a new low power CMOS FSB specifically introduced to reduce power.

Silverthorne chips consist of 47 million transistors on a 24.2 mm² die. All processors are a single core. Additionally all models support every x86 extension up to SSSE3 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3). The original series of chips that were introduced in 2008 featured a tiny FCBGA-437 package measuring just 13 mm x 14 mm. Intel introduced a set of new models in a much bigger 22x22 mm² FCBGA-441 package. Models ending in P use those large packages. A couple of models (those ending with 'T') also support industrial temperature ranges.

Silverthorne chips have an incredibly simple design featuring only the CPU itself on-die. The southbridge and northbridge are integrated on a secondary Poulsbo chipset which features the memory controller, an integrated graphics, and the various I/O ports.

	List of Silverthorne-based Atom Processors
	Main processor								Bus		Features
Model	Price	Process	Launched	C	T	Freq	TDP	SDP	Speed	Rate	Package	HT	VT-x
Z500	$ 45.00 € 40.50 £ 36.45 ¥ 4,649.85	45 nm 0.045 μm 4.5e-5 mm	2 April 2008	1	2	0.8 GHz 800 MHz 800,000 kHz	650 mW 0.65 W 8.7165e-4 hp 6.5e-4 kW	960 mW 0.96 W 0.00129 hp 9.6e-4 kW	100 MHz 0.1 GHz 100,000 kHz	400 MT/s 0.4 GT/s 400,000 kT/s	FCBGA-441	✔	✘
Z510	$ 45.00 € 40.50 £ 36.45 ¥ 4,649.85	45 nm 0.045 μm 4.5e-5 mm	2 April 2008	1	1	1.1 GHz 1,100 MHz 1,100,000 kHz	2,000 mW 2 W 0.00268 hp 0.002 kW	960 mW 0.96 W 0.00129 hp 9.6e-4 kW	100 MHz 0.1 GHz 100,000 kHz	400 MT/s 0.4 GT/s 400,000 kT/s	FCBGA-441	✘	✘
Z510P		45 nm 0.045 μm 4.5e-5 mm	2 March 2009	1	2	1.1 GHz 1,100 MHz 1,100,000 kHz	2,000 mW 2 W 0.00268 hp 0.002 kW		100 MHz 0.1 GHz 100,000 kHz	400 MT/s 0.4 GT/s 400,000 kT/s	FCBGA-437	✔	✘
Z510PT		45 nm 0.045 μm 4.5e-5 mm	2 March 2009	1	2	1.1 GHz 1,100 MHz 1,100,000 kHz	2,000 mW 2 W 0.00268 hp 0.002 kW		100 MHz 0.1 GHz 100,000 kHz	400 MT/s 0.4 GT/s 400,000 kT/s	FCBGA-437	✔	✘
Z515		45 nm 0.045 μm 4.5e-5 mm	8 April 2009	1	2	1.2 GHz 1,200 MHz 1,200,000 kHz	650 mW 0.65 W 8.7165e-4 hp 6.5e-4 kW		100 MHz 0.1 GHz 100,000 kHz	400 MT/s 0.4 GT/s 400,000 kT/s	FCBGA-441	✔	✘
Z520	$ 65.00 € 58.50 £ 52.65 ¥ 6,716.45	45 nm 0.045 μm 4.5e-5 mm	2 April 2008	1	2	1.333 GHz 1,333.33 MHz 1,333,330 kHz	2,000 mW 2 W 0.00268 hp 0.002 kW	960 mW 0.96 W 0.00129 hp 9.6e-4 kW	133.33 MHz 0.133 GHz 133,330 kHz	533.33 MT/s 0.533 GT/s 533,330 kT/s	FCBGA-441	✔	✔
Z520PT		45 nm 0.045 μm 4.5e-5 mm	2 March 2009	1	2	1.333 GHz 1,333.33 MHz 1,333,330 kHz	2,000 mW 2 W 0.00268 hp 0.002 kW		133.33 MHz 0.133 GHz 133,330 kHz	533.33 MT/s 0.533 GT/s 533,330 kT/s	FCBGA-437	✔	✘
Z530	$ 95.00 € 85.50 £ 76.95 ¥ 9,816.35	45 nm 0.045 μm 4.5e-5 mm	2 April 2008	1	2	1.6 GHz 1,599.99 MHz 1,599,990 kHz	2,200 mW 2.2 W 0.00295 hp 0.0022 kW		133.33 MHz 0.133 GHz 133,330 kHz	533.33 MT/s 0.533 GT/s 533,330 kT/s	FCBGA-441	✔	✔
Z530P		45 nm 0.045 μm 4.5e-5 mm	2 March 2009	1	2	1.6 GHz 1,599.99 MHz 1,599,990 kHz	2,000 mW 2 W 0.00268 hp 0.002 kW		133.33 MHz 0.133 GHz 133,330 kHz	533.33 MT/s 0.533 GT/s 533,330 kT/s	FCBGA-437	✔	✔
Z540	$ 160.00 € 144.00 £ 129.60 ¥ 16,532.80	45 nm 0.045 μm 4.5e-5 mm	2 April 2008	1	2	1.867 GHz 1,866.66 MHz 1,866,660 kHz	2,400 mW 2.4 W 0.00322 hp 0.0024 kW	960 mW 0.96 W 0.00129 hp 9.6e-4 kW	133.33 MHz 0.133 GHz 133,330 kHz	533.33 MT/s 0.533 GT/s 533,330 kT/s	FCBGA-441	✔	✔
Z550		45 nm 0.045 μm 4.5e-5 mm	8 April 2009	1	2	2 GHz 1,999.99 MHz 1,999,990 kHz	2,400 mW 2.4 W 0.00322 hp 0.0024 kW		133.33 MHz 0.133 GHz 133,330 kHz	533.33 MT/s 0.533 GT/s 533,330 kT/s	FCBGA-441	✔	✔
Z560		45 nm 0.045 μm 4.5e-5 mm	June 2010	1	2	2.133 GHz 2,133.33 MHz 2,133,330 kHz	2,500 mW 2.5 W 0.00335 hp 0.0025 kW		133.33 MHz 0.133 GHz 133,330 kHz	533.33 MT/s 0.533 GT/s 533,330 kT/s	FCBGA-441	✔	✔
Count: 12

Lincroft (MIDs, 2nd Gen)[edit]

See also: Lincroft Core

Lincroft is the second generation Bonnell-based models, a successor to Silverthorne. Lincroft is drastically different to Silverthorne. It's a complete system on a chip solution, incorporating most of the functionality of the chipset on-die, including the memory controller, display controller, and integrated graphics. Lincroft, along with the Moorestown, models were introduced on May 4, 2010.

Lincroft SoCs where also fabricated on a 45 nm process but incorporate a large part of the southbridge. For those reasons the die is considerably larger, 65.25 mm² incorporating 140,000,000 transistors. As with Silverthorne, all models support every x86 extension up to SSSE3 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3). Lincroft integrates the same Imagination Technologies PowerVR SGX 535 IGP as Silverthorne but operating at double the frequency. Lincroft chips are packaged in an FCBGA-518.

In mid-2011 Intel introduce a number of new chips, as part of the Oak Trail platform, utilizing the SM35 Express chipset.

	List of Lincroft-based Atom Processors
	Main processor									Memory		IGP		Features
Model	Family	Price	Process	Launched	C	T	Freq	Burst	TDP	Type	Mem	Name	Frequency	Package	HT	Burst
Z600	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	800 MHz 0.8 GHz 800,000 kHz	1.2 GHz 1,200 MHz 1,200,000 kHz	1,300 mW 1.3 W 0.00174 hp 0.0013 kW	DDR-400	1 GiB 1,024 MiB 1,048,576 KiB 1,073,741,824 B 9.765625e-4 TiB	PowerVR SGX535	200 MHz 0.2 GHz 200,000 KHz	FCBGA-518	✔	✔
Z605	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	1,000 MHz 1 GHz 1,000,000 kHz		2,200 mW 2.2 W 0.00295 hp 0.0022 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z610	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	800 MHz 0.8 GHz 800,000 kHz	1.2 GHz 1,200 MHz 1,200,000 kHz	1,300 mW 1.3 W 0.00174 hp 0.0013 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z612	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	900 MHz 0.9 GHz 900,000 kHz	1.5 GHz 1,500 MHz 1,500,000 kHz	1,300 mW 1.3 W 0.00174 hp 0.0013 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z615	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	1,200 MHz 1.2 GHz 1,200,000 kHz	1.6 GHz 1,600 MHz 1,600,000 kHz	2,200 mW 2.2 W 0.00295 hp 0.0022 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z620	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	900 MHz 0.9 GHz 900,000 kHz	1.6 GHz 1,600 MHz 1,600,000 kHz	1,300 mW 1.3 W 0.00174 hp 0.0013 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z625	Atom		45 nm 0.045 μm 4.5e-5 mm	4 May 2010	1	2	1,500 MHz 1.5 GHz 1,500,000 kHz	1.9 GHz 1,900 MHz 1,900,000 kHz	2,200 mW 2.2 W 0.00295 hp 0.0022 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✔
Z650	Atom		45 nm 0.045 μm 4.5e-5 mm	11 April 2011	1	2	1,200 MHz 1.2 GHz 1,200,000 kHz		3,000 mW 3 W 0.00402 hp 0.003 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✘
Z670	Atom	$ 75.00 € 67.50 £ 60.75 ¥ 7,749.75	45 nm 0.045 μm 4.5e-5 mm	11 April 2011	1	2	1,500 MHz 1.5 GHz 1,500,000 kHz		3,000 mW 3 W 0.00402 hp 0.003 kW	DDR-400 DDR2-800	2 GiB 2,048 MiB 2,097,152 KiB 2,147,483,648 B 0.00195 TiB	PowerVR SGX535	400 MHz 0.4 GHz 400,000 KHz	FCBGA-518	✔	✘
Count: 9

Diamondville (Nettops)[edit]

See also: Diamondville Core

Diamondville-based processors were introduced in mid-2008. Those single-core chips were designed for more complex devices such as light-weight notebooks and various nettops. One dual-core model was also introduced which featured two identical Diamondville in a single package. Diamondville processors have 56 KiB of L1$ and 512 KiB of L2 (twice as much for the dual-core variant).

Diamondville chips consist of 47 million transistors on a 25.96 mm² die. All processors are a single core (except for the 330 which features two 230 dies). Additionally all models support every x86 extension up to SSSE3 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3). These chips utilize the bigger 22x22 mm² FCBGA-441 package.

As with the Silverthorne chips, Diamondville models only incorporate the CPU therefore they must make use of the Calistoga chipset for the memory controller, integrated graphics, and I/O functionality.

	List of Diamondville-based Atom Processors
	Main processor								Bus		Features
Model	Family	Price	Process	Launched	C	T	Freq	TDP	Speed	Rate	Package	ISA	EIST	HT
230	Atom	$ 29.00 € 26.10 £ 23.49 ¥ 2,996.57	45 nm 0.045 μm 4.5e-5 mm	3 June 2008	1	2	1.6 GHz 1,599.99 MHz 1,599,990 kHz	4 W 4,000 mW 0.00536 hp 0.004 kW	133.33 MHz 0.133 GHz 133,330 kHz	533.33 MT/s 0.533 GT/s 533,330 kT/s	FCBGA-437	x86-64	✘	✔
330	Atom	$ 43.00 € 38.70 £ 34.83 ¥ 4,443.19	45 nm 0.045 μm 4.5e-5 mm	21 September 2008	2	4	1.6 GHz 1,599.99 MHz 1,599,990 kHz	8 W 8,000 mW 0.0107 hp 0.008 kW	133.33 MHz 0.133 GHz 133,330 kHz	533.33 MT/s 0.533 GT/s 533,330 kT/s	FCBGA-437	x86-64	✘	✔
N270	Atom	$ 44.00 € 39.60 £ 35.64 ¥ 4,546.52	45 nm 0.045 μm 4.5e-5 mm	3 June 2008	1	2	1.6 GHz 1,599.99 MHz 1,599,990 kHz	2.5 W 2,500 mW 0.00335 hp 0.0025 kW	133.33 MHz 0.133 GHz 133,330 kHz	533.33 MT/s 0.533 GT/s 533,330 kT/s	FCBGA-437	x86-32	✔	✔
N280	Atom		45 nm 0.045 μm 4.5e-5 mm	7 February 2009	1	2	1.667 GHz 1,666.66 MHz 1,666,660 kHz	2.5 W 2,500 mW 0.00335 hp 0.0025 kW	166.66 MHz 0.167 GHz 166,660 kHz	666.66 MT/s 0.667 GT/s 666,660 kT/s	FCBGA-437	x86-32	✔	✔
Count: 4

Silvermont[edit]

Main article: Silvermont Microarchitecture

Introduced in 2013, Silvermont-based processors are manufactured on a 22 nm process and introduced OoOE to the Atom line of cores.

Goldmont[edit]

Main article: Goldmont Microarchitecture

Introduced in late 2016, Goldmont-based processors which are manufactured on a 14 nm process and provider considerable improvement in performance, power, and capabilities over its predecessors. Goldmont also doubled the highest count of integrated ultra-low power cores.

Denverton (Servers)[edit]

See also: Denverton Core

Denverton-based chips are a complete system on a chip for dense ultra-low power servers, network devices, storage, and internet of things (IoT). Manufactured on a 14 nm process, those chips over up to double the cores as the previous generation as well as higher integration and more I/O capabilities. Models support up to dual-channel DDR4 ECC memory and either 128 GiB or 256 GiB of memory. All models support everything up to SSE4.2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES) as well as VT-x, VT-d, EPT, and Secure Boot. Models vary from 2 cores up to 16 cores and without Hyper-Threading support. Those SoCs come with 6 to 20 High-Speed Input/Output (HSIO) lanes which are highly configurable lanes that allow their intended purpose (e.g., SATA, PCIe, USB) to be setup by the user in the BIOS. The exact amount of each that can be allocated is model-dependent. Additionally, each model have two to four dedicated integrated Ethernet adapters supporting up 10 GbE. Depending on the exact model, some also have integrated QuickAssist Technology which offers the ability to off-load cryptography and compression tasks to a separate dedicated engine on-die.

	List of Denverton Processors
	Main processor									Cache		Memory		Configurable I/O				Feature Diff
Model	Price	Family	Process	Launched	Cores	Threads	TDP	Frequency	Turbo	L1	L2	Memory Type	Max Mem	HS I/O	PCIe	USB	SATA	ECC	TBT	QAT
	Server and Cloud Storage SKUs
C3750	$ 171.00 € 153.90 £ 138.51 ¥ 17,669.43	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	8	8	21 W 21,000 mW 0.0282 hp 0.021 kW	2,200 MHz 2.2 GHz 2,200,000 kHz	2,400 MHz 2.4 GHz 2,400,000 kHz	448 KiB 458,752 B 0.438 MiB	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	DDR3L-1600, DDR4-2133	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	12		8		✔	✔	✘
C3830	$ 289.00 € 260.10 £ 234.09 ¥ 29,862.37	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	12	12	21 W 21,000 mW 0.0282 hp 0.021 kW	1,900 MHz 1.9 GHz 1,900,000 kHz	2,300 MHz 2.3 GHz 2,300,000 kHz	672 KiB 688,128 B 0.656 MiB	12 MiB 12,288 KiB 12,582,912 B 0.0117 GiB	DDR3L-1600, DDR4-2133	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	12		8		✔	✔	✘
C3850	$ 323.00 € 290.70 £ 261.63 ¥ 33,375.59	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	12	12	25 W 25,000 mW 0.0335 hp 0.025 kW	2,100 MHz 2.1 GHz 2,100,000 kHz	2,400 MHz 2.4 GHz 2,400,000 kHz	672 KiB 688,128 B 0.656 MiB	12 MiB 12,288 KiB 12,582,912 B 0.0117 GiB	DDR3L-1600, DDR4-2133	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	20		8		✔	✔	✘
C3950	$ 389.00 € 350.10 £ 315.09 ¥ 40,195.37	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	16	16	24 W 24,000 mW 0.0322 hp 0.024 kW	1,700 MHz 1.7 GHz 1,700,000 kHz	2,200 MHz 2.2 GHz 2,200,000 kHz	896 KiB 917,504 B 0.875 MiB	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	DDR3L-1600, DDR4-2400	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	20		8		✔	✔	✘
C3955	$ 434.00 € 390.60 £ 351.54 ¥ 44,845.22	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	16	16	32 W 32,000 mW 0.0429 hp 0.032 kW	2,100 MHz 2.1 GHz 2,100,000 kHz	2,400 MHz 2.4 GHz 2,400,000 kHz	896 KiB 917,504 B 0.875 MiB	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	DDR3L-1600, DDR4-2400	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	20		8		✔	✔	✘
	Network and Enterprise Storage SKUs
C3338	$ 27.00 € 24.30 £ 21.87 ¥ 2,789.91	Atom	14 nm 0.014 μm 1.4e-5 mm	22 February 2017	2	2	9 W 9,000 mW 0.0121 hp 0.009 kW	1,500 MHz 1.5 GHz 1,500,000 kHz	2,200 MHz 2.2 GHz 2,200,000 kHz	112 KiB 114,688 B 0.109 MiB	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	DDR3L-1600, DDR4-1866	128 GiB 131,072 MiB 134,217,728 KiB 137,438,953,472 B 0.125 TiB	10		8	10	✔	✔	✘
C3538	$ 75.00 € 67.50 £ 60.75 ¥ 7,749.75	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	4	4	15 W 15,000 mW 0.0201 hp 0.015 kW	2,100 MHz 2.1 GHz 2,100,000 kHz		224 KiB 229,376 B 0.219 MiB	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	DDR3L-1600, DDR4-2133	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	12		8	12	✔	✘	✔
C3558	$ 86.00 € 77.40 £ 69.66 ¥ 8,886.38	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	4	4	16 W 16,000 mW 0.0215 hp 0.016 kW	2,200 MHz 2.2 GHz 2,200,000 kHz		224 KiB 229,376 B 0.219 MiB	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	DDR3L-1600, DDR4-1866	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	12		8	12	✔	✘	✔
C3758	$ 193.00 € 173.70 £ 156.33 ¥ 19,942.69	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	8	8	25 W 25,000 mW 0.0335 hp 0.025 kW	2,200 MHz 2.2 GHz 2,200,000 kHz		448 KiB 458,752 B 0.438 MiB	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	DDR3L-1600, DDR4-2400	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	20		8	16	✔	✘	✔
C3858	$ 332.00 € 298.80 £ 268.92 ¥ 34,305.56	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	12	12	25 W 25,000 mW 0.0335 hp 0.025 kW	2,000 MHz 2 GHz 2,000,000 kHz		672 KiB 688,128 B 0.656 MiB	12 MiB 12,288 KiB 12,582,912 B 0.0117 GiB	DDR3L-1600, DDR4-2400	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	20		8	16	✔	✘	✔
C3958	$ 449.00 € 404.10 £ 363.69 ¥ 46,395.17	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	16	16	31 W 31,000 mW 0.0416 hp 0.031 kW	2,000 MHz 2 GHz 2,000,000 kHz		896 KiB 917,504 B 0.875 MiB	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	DDR3L-1600, DDR4-2400	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	20		8	16	✔	✘	✔
	Internet of Things and eTEMP SKUs
C3308	$ 32.00 € 28.80 £ 25.92 ¥ 3,306.56	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	2	2	9.5 W 9,500 mW 0.0127 hp 0.0095 kW	1,600 MHz 1.6 GHz 1,600,000 kHz	2,100 MHz 2.1 GHz 2,100,000 kHz	112 KiB 114,688 B 0.109 MiB	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	DDR3L-1600, DDR4-1866	128 GiB 131,072 MiB 134,217,728 KiB 137,438,953,472 B 0.125 TiB	6		8	6	✔	✔	✔
C3508		Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	4	4	11.25 W 11,250 mW 0.0151 hp 0.0113 kW	1,600 MHz 1.6 GHz 1,600,000 kHz		224 KiB 229,376 B 0.219 MiB	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	DDR3L-1600, DDR4-1866	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	8		8	8	✔	✘	✔
C3708	$ 209.00 € 188.10 £ 169.29 ¥ 21,595.97	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	8	8	17 W 17,000 mW 0.0228 hp 0.017 kW	1,700 MHz 1.7 GHz 1,700,000 kHz		448 KiB 458,752 B 0.438 MiB	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	DDR3L-1600, DDR4-2133	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	20		8	16	✔	✘	✔
C3808	$ 369.00 € 332.10 £ 298.89 ¥ 38,128.77	Atom	14 nm 0.014 μm 1.4e-5 mm	15 August 2017	12	12	25 W 25,000 mW 0.0335 hp 0.025 kW	2,000 MHz 2 GHz 2,000,000 kHz		672 KiB 688,128 B 0.656 MiB	12 MiB 12,288 KiB 12,582,912 B 0.0117 GiB	DDR3L-1600, DDR4-2133	256 GiB 262,144 MiB 268,435,456 KiB 274,877,906,944 B 0.25 TiB	20		8	16	✔	✘	✔
Count: 15

SoCs[edit]

Atom x3, 2015
Atom x5, 2015
Atom x7, 2015

Microarchitectures[edit]

T/T	Process	µarch	Intro Date	Cores
Tick	45 nm	Bonnell	2008	Silverthorne, Diamondville
Tock	45 nm	Bonnell	2010	Lincroft, Pineview, Tunnel Creek, Stellarton, Sodaville, Groveland
Tick	32 nm	Saltwell	2011	Clover Trail, Cedar Trail
Tick	22 nm	Silvermont	2013	Bay Trail
Tock	14 nm	Airmont	2015	Cherry Trail, Braswell
Tick	14 nm	Goldmont	2016

@@ Line 33: / Line 33: @@
 == Models ==
 === Bonnell ===
-{{main|intel/microarchitectures/bonnell|l1=Bonnel Microarchitecture}}
+{{main|intel/microarchitectures/bonnell|l1=Bonnell Microarchitecture}}
-'''Bonnell''' was the first microarchitecture designed specifically for the ultra-low power microprocessor market. Introduced in 2008, it featured fully [[x86]]-compatible cores with a TDP of only 500 mW to 2 W, less than any other x86 processor available that the time. Bonnell's low-power came from its simplicity, being an [[in-order]] dual-issue piplined CPU. All Bonnell-based processors were manufactured on Intel's [[45 nm process]].
+'''Bonnell''' was the first microarchitecture designed specifically for the ultra-low power microprocessor market. Introduced in 2008, it featured fully [[x86]]-compatible cores with a TDP of only 500 mW to 2 W, less than any other x86 processor available at the time. Bonnell's low-power came from its simplicity, being an [[in-order]] dual-issue pipelined CPU. All Bonnell-based processors were manufactured on Intel's [[45 nm process]].
 ==== Silverthorne (MIDs, 1st Gen) ====
 [[File:intel atom logo (2008-2009).png|right|100px]]
 {{see also|intel/cores/silverthorne|l1=Silverthorne Core}}
-The first series of Bonnell processors were introduced during the [[2008]] Intel Developer Forum (IDF) in Shanghai, China. Those {{arch|32}} processors were based on the the {{intel|Silverthorne|l=core}} core which were designed for the [[Mobile Internet Devices]] (MID) market. Silverthorne processors have 56 [[KiB]] of L1$ and 512 KiB of L2. Silverthorne has support for the traditional [[GTL|AGTL+]]-based [[FSB]] as well as a new low power [[CMOS]] FSB specifically introduced to reduce power.
+The first series of Bonnell processors were introduced during the [[2008]] Intel Developer Forum (IDF) in Shanghai, China. Those {{arch|32}} processors were based on the {{intel|Silverthorne|l=core}} core which were designed for the [[Mobile Internet Devices]] (MID) market. Silverthorne processors have 56 [[KiB]] of L1$ and 512 KiB of L2. Silverthorne has support for the traditional [[GTL|AGTL+]]-based [[FSB]] as well as a new low power [[CMOS]] FSB specifically introduced to reduce power.
-Silverthorne chips consist of 47 million [[transistors]] on a 24.2 mm² die. All processors are a [[single core]]. Additionally all models support every [[x86]] extension up to {{intel|SSSE3}} ({{intel|SMM}}, {{intel|FPU}}, {{intel|NX}}, {{intel|MMX}}, {{intel|SSE}}, {{intel|SSE2}}, {{intel|SSE3}}, {{intel|SSSE3}}). The original series of chips that were introduced in 2008 featured a tiny {{intel|FCBGA-437}} package measuring just 13 mm x 14 mm. Intel introduced an set of new models in a much bigger 22x22 mm² {{intel|FCBGA-441}} package. Models ending in ''P'' use those large packages. A couple of models (those ending with 'T') also support industrial temperature ranges.
+Silverthorne chips consist of 47 million [[transistors]] on a 24.2 mm² die. All processors are a [[single core]]. Additionally all models support every [[x86]] extension up to {{intel|SSSE3}} ({{intel|SMM}}, {{intel|FPU}}, {{intel|NX}}, {{intel|MMX}}, {{intel|SSE}}, {{intel|SSE2}}, {{intel|SSE3}}, {{intel|SSSE3}}). The original series of chips that were introduced in 2008 featured a tiny {{intel|FCBGA-437}} package measuring just 13 mm x 14 mm. Intel introduced a set of new models in a much bigger 22x22 mm² {{intel|FCBGA-441}} package. Models ending in ''P'' use those large packages. A couple of models (those ending with 'T') also support industrial temperature ranges.
 Silverthorne chips have an incredibly simple design featuring only the CPU itself on-die. The [[southbridge]] and [[northbridge]] are integrated on a secondary {{intel|Poulsbo|l=chipset}} chipset which features the [[memory controller]], an [[integrated graphics]], and the various [[I/O]] ports.
@@ Line 174: / Line 174: @@
 </table>
 {{comp table end}}
+=== Silvermont ===
+{{main|intel/microarchitectures/silvermont|l1=Silvermont Microarchitecture}}
+Introduced in 2013, Silvermont-based processors are manufactured on a [[22 nm process]] and introduced OoOE to the Atom line of cores.
 === Goldmont ===
 {{main|intel/microarchitectures/goldmont|l1=Goldmont Microarchitecture}}
-Introduced in 2017, Goldmont-based processors which are manufactured on a [[14 nm process]] and provider considerable improvement in performance, power, and capabilities over its predecessors. Goldmont also doubled the highest count of integrated ultra-low power cores.
+Introduced in late 2016, Goldmont-based processors which are manufactured on a [[14 nm process]] and provider considerable improvement in performance, power, and capabilities over its predecessors. Goldmont also doubled the highest count of integrated ultra-low power cores.
 ==== Denverton (Servers) ====
@@ Line 192: / Line 195: @@
 -->
 {{comp table start}}
-<table class="comptable sortable tc6 tc7 tc8 tc15 tc16">
+<table class="comptable sortable tc6 tc7 tc8 tc15 tc16 tc17 tc18 tc19 tc20 tc21">
-<tr class="comptable-header"><th>&nbsp;</th><th colspan="15">List of Denverton-based Atom Processors</th></tr>
+<tr class="comptable-header"><th>&nbsp;</th><th colspan="20">List of Denverton Processors</th></tr>
-<tr class="comptable-header"><th>&nbsp;</th><th colspan="9">Main processor</th><th colspan="2">Cache</th><th colspan="2">Memory</th><th colspan="2">Feature Diff</th></tr>
+<tr class="comptable-header"><th>&nbsp;</th><th colspan="9">Main processor</th><th colspan="2">Cache</th><th colspan="2">Memory</th><th colspan="4">Configurable I/O</th><th colspan="3">Feature Diff</th></tr>
-{{comp table header 1|cols=Price, Family, Process, Launched, Cores, Threads, %TDP, %Frequency, %Turbo, %L1, %L2, Memory Type, Max Mem, ECC, {{intel|Turbo Boost|TBT}}}}
+{{comp table header 1|cols=Price, Family, Process, Launched, Cores, Threads, %TDP, %Frequency, %Turbo, %L1, %L2, Memory Type, Max Mem, HS I/O, PCIe, USB, SATA, ECC, {{intel|Turbo Boost|TBT}}, {{intel|quickassist technology|QAT}}}}
-<tr class="comptable-header comptable-header-sep"><th>&nbsp;</th><th colspan="15">Server and Cloud Storage SKUs</th></tr>
+<tr class="comptable-header comptable-header-sep"><th>&nbsp;</th><th colspan="20">Server and Cloud Storage SKUs</th></tr>
 {{#ask: [[Category:microprocessor models by intel]] [[core name::Denverton]] [[part of::Server and Cloud Storage SKUs]]
   |?full page name
@@ Line 213: / Line 216: @@
   |?supported memory type
   |?max memory#GiB
+ |?max hsio lanes
+ |?Has subobject.max pcie lanes
+ |?max usb ports
+ |?max sata ports
   |?has ecc memory support
   |?has intel turbo boost technology 2 0
+ |?has integrated intel quickassist technology
   |format=template
   |template=proc table 3
-  |userparam=17:16
+  |userparam=22:20
   |mainlabel=-
   |valuesep=,
 }}
-<tr class="comptable-header comptable-header-sep"><th>&nbsp;</th><th colspan="15">Network and Enterprise Storage SKUs</th></tr>
+<tr class="comptable-header comptable-header-sep"><th>&nbsp;</th><th colspan="20">Network and Enterprise Storage SKUs</th></tr>
 {{#ask: [[Category:microprocessor models by intel]] [[core name::Denverton]] [[part of::Network and Enterprise Storage SKUs]]
   |?full page name
@@ Line 238: / Line 246: @@
   |?supported memory type
   |?max memory#GiB
+ |?max hsio lanes
+ |?Has subobject.max pcie lanes
+ |?max usb ports
+ |?max sata ports
   |?has ecc memory support
   |?has intel turbo boost technology 2 0
+ |?has integrated intel quickassist technology
   |format=template
   |template=proc table 3
-  |userparam=17:16
+  |userparam=22:20
   |mainlabel=-
   |valuesep=,
 }}
-<tr class="comptable-header comptable-header-sep"><th>&nbsp;</th><th colspan="15">Internet of Things and eTEMP SKUs</th></tr>
+<tr class="comptable-header comptable-header-sep"><th>&nbsp;</th><th colspan="20">Internet of Things and eTEMP SKUs</th></tr>
 {{#ask: [[Category:microprocessor models by intel]] [[core name::Denverton]] [[part of::Internet of Things and eTEMP SKUs]]
   |?full page name
@@ Line 263: / Line 276: @@
   |?supported memory type
   |?max memory#GiB
+ |?max hsio lanes
+ |?Has subobject.max pcie lanes
+ |?max usb ports
+ |?max sata ports
   |?has ecc memory support
   |?has intel turbo boost technology 2 0
+ |?has integrated intel quickassist technology
   |format=template
   |template=proc table 3
-  |userparam=17:16
+  |userparam=22:20
   |mainlabel=-
   |valuesep=,
 }}
-{{comp table count|col=10|ask=[[Category:microprocessor models by intel]][[core name::Denverton]]}}
+{{comp table count|col=20|ask=[[Category:microprocessor models by intel]][[core name::Denverton]]}}
 </table>
 {{comp table end}}

designer	Intel +
first announced	March 2, 2008 +
first launched	April 2, 2008 +
full page name	intel/atom +
instance of	system on a chip family + and microprocessor family +
instruction set architecture	IA-32 + and x86-64 +
main designer	Intel +
manufacturer	Intel +
microarchitecture	Bonnell +
name	Intel Atom +
package	FCBGA-437 + and PBGA-441 +
process	45 nm (0.045 μm, 4.5e-5 mm) +, 32 nm (0.032 μm, 3.2e-5 mm) +, 22 nm (0.022 μm, 2.2e-5 mm) + and 14 nm (0.014 μm, 1.4e-5 mm) +
socket	BGA +
technology	CMOS +
word size	32 bit (4 octets, 8 nibbles) + and 64 bit (8 octets, 16 nibbles) +

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