From WikiChip
Difference between revisions of "hisilicon/hi16xx"
< hisilicon

(David moved page hisilicon/hi16xx to hisilicon/kunpeng)
 
(add links)
 
Line 1: Line 1:
−
#REDIRECT [[hisilicon/kunpeng]]
+
{{title|HiSilicon Kunpeng}}
 +
<!--#REDIRECT [[hisilicon/kunpeng]]-->
 +
=== Family ===
 +
{{collist
 +
| count = 4
 +
|
 +
* {{hisil|Hi16xx}}
 +
* {{hisil|Hi3xxx}}
 +
* {{hisil|K3}}
 +
* {{hisil|Kirin}}
 +
* {{hisil|Ascend}}
 +
* {{hisil|Balong}}
 +
* {{hisil|Kunpeng}}
 +
* {{hisil|taishan_v110|TaiShan|l=arch}} (uarch)
 +
}}
 +
:;[[HiSilicon]] • [[Huawei]]
 +
* {{hisil|ares|HiSilicon CPU series}}
 +
* {{hisil|kirin|HiSilicon Kirin}}
 +
* {{hisil|Hi16xx|HiSilicon Kunpeng}}
 +
* {{hisil|hydra|HiSilicon Hydra}} (uarch)
 +
* {{hisil|taishan_v110|HiSilicon TaiShan}} (uarch)
 +
<!--
 +
:;[[Kirin]]
 +
:{{hisil|taishan_v110|TaiShan|l=arch}} (uarch)
 +
-->
 +
== Server processors ==
 +
[[HiSilicon]] develops server processor SoCs based on the [[ARM]] architecture.
 +
{{see also|HiSilicon|Kunpeng}}
 +
 
 +
=== [[Hi1610]] ===
 +
The [[Hi1610]] is [[HiSilicon]]'s first generation server processor
 +
:announced in [[2015]]. It features:
 +
* 16x ARM {{armh|Cortex-A57}} @ 2.1GHz cores
 +
* 48KB L1-I, 32KB L1-D, 1MB L2/4 cores, 16MB CCN L3
 +
* [[TSMC]] [[16 nm]] process
 +
* 2x DDR4-1866 memory
 +
* 16x PCIe 3.0 ports
 +
 
 +
=== [[Hi1612]] ===
 +
The [[Hi1612]] is [[HiSilicon]]'s second generation server processor launched in [[2016]].
 +
:It is the first chiplet-based [[Kunpeng]] with two computing dies. It features:
 +
* 32x [[ARM]] {{armh|Cortex-A57}} @ 2.1GHz cores
 +
* 48KB L1-I, 32KB L1-D, 1MB L2/4 cores, 32MB CCN L3
 +
* [[TSMC]] [[16 nm]] process
 +
* 4x DDR4-2133 memory
 +
* 16x PCIe 3.0 ports
 +
 
 +
=== Kunpeng 916 ([[Hi1616]]) ===
 +
The [[Kunpeng 916]] ([[Hi1616]]) is [[HiSilicon]]'s third generation server processor
 +
:launched in [[2017]]. It features: <!--
 +
:The Kunpeng 916 is used in Huawei's TaiShan 2280 Balanced Server, TaiShan 5280 Storage Server,
 +
:TaiShan XR320 High-Density Server Node and TaiShan X6000 High-Density Server. -->
 +
* 32x [[ARM]] [[Cortex-A72]] @ 2.4GHz cores
 +
* 48KB L1-I, 32KB L1-D, 1MB L2/4 cores, 32MB CCN L3
 +
* [[TSMC]] [[16 nm]] process
 +
* 4x DDR4-2400 memory
 +
* 2-way [[SMP]], Each socket has 2x ports with
 +
: 96 Gbit/s per port (total of 192 Gbit/s)
 +
* 46x PCIe 3.0 and 8x 10G Ethernet ports
 +
* [[TDP]] 85W
 +
 
 +
=== Kunpeng 920 ([[Hi1620]]) ===
 +
The [[Kunpeng 920]] ([[Hi1620]]) is [[HiSilicon]]'s fourth generation server processor
 +
:announced in [[2018]], and launched in 2019. <!--
 +
:Huawei claims the Kunpeng 920 CPU scores more than an estimated 930 on SPECint_rate_base2006.
 +
:The Kunpeng 920 is used in Huawei's TaiShan 2280 V2 Balanced Server,
 +
:TaiShan 5280 V2 Storage Server, and TaiShan XA320 V2 High-Density Server Node. --> It features:
 +
* 32 to 64x custom ''{{hisilicon|Taishan v110|TaiShan V110|l=arch}}'' cores @ 2.6GHz cores <ref>{{cite book |url=https://fuse.wikichip.org/news/2274/huawei-expands-kunpeng-server-cpus-plans-smt-sve-for-next-gen/ |title=Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen |last=Schor |first=David |date=3 May 2019 |website=WikiChip Fuse}}</ref>
 +
* The {{hisilicon|Taishan v110|TaiShan V110|l=arch}} core is a 4-way superscalar, out-of-order
 +
:microarchitecture that implements the [[ARMv8]].2-A ISA <!-- Huawei reports the core supports almost all
 +
:the ARMv8.4-A ISA features with a few exceptions, including the [[dot product]] and FP16 FML extensions.-->
 +
* The {{hisilicon|Taishan v110|TaiShan V110|l=arch}} cores are likely a new core not based on ARM designs
 +
* 3x Simple ALUs, 1x Complex MDU, 2x BRUs (sharing ports with ALU2/3),
 +
: 2x FSUs (ASIMD FPU), 2x LSUs
 +
* 64KB L1-I, 64KB L1-D, 512KB Private L2, 1MB L3/core (shared)
 +
* [[TSMC]] [[7 nm]] HPC process
 +
* 8x DDR4-3200 memory
 +
* 2-way and 4-way [[SMP]], Each socket has 3x Hydra ports
 +
: with 240 Gbit/s per port (total of 720 Gbit/s)
 +
* 40x PCIe 4.0 with [[CCIX]] support, 4x USB 3.0, 2x SATA 3.0,
 +
: 8x SAS 3.0 and 2x 100G Ethernet ports
 +
* [[TDP]] 100W to 200W
 +
* Compression engine (GZIP, LZS, LZ4) capable of up
 +
: to 40 Git/s compress and 100 Gbit/s decompress
 +
* Crypto offload engine (for AES, DES, 3DES, SHA1/2)
 +
: capable of throughputs up to 100 Gbit/s
 +
 
 +
=== Kunpeng 930 ([[Hi1630]]) ===
 +
The [[Kunpeng 930]] ([[Hi1630]]) is [[HiSilicon]]'s fifth-generation server processor
 +
:announced in [[2019]] and scheduled for launch in [[2021]]. It features:
 +
* 80 custom {{hisilicon|Taishan v110|TaiShan V120|l=arch}} cores @ 3GHz frequency, with support
 +
: for [[SMT]] and ARM's Scalable Vector Extension ([[SVE]])
 +
* 64KB L1-I, 64KB L1-D, 512KB Private L2 and 1MB L3/core (shared)
 +
* [[TSMC]] [[5 nm]] process
 +
* 8x DDR5 memory
 +
 
 +
=== Kunpeng 950 ===
 +
The [[Kunpeng 950]] is [[HiSilicon]]'s sixth-generation server processor
 +
:announced in [[2019]] and scheduled for launch in [[2023]].
 +
 
 +
== References ==

Latest revision as of 19:22, 27 March 2025

Family[edit]

HiSilicon • Huawei

Server processors[edit]

HiSilicon develops server processor SoCs based on the ARM architecture.

See also: HiSilicon and Kunpeng


Hi1610[edit]

The Hi1610 is HiSilicon's first generation server processor

announced in 2015. It features:
  • 16x ARM Cortex-A57 @ 2.1GHz cores
  • 48KB L1-I, 32KB L1-D, 1MB L2/4 cores, 16MB CCN L3
  • TSMC 16 nm process
  • 2x DDR4-1866 memory
  • 16x PCIe 3.0 ports

Hi1612[edit]

The Hi1612 is HiSilicon's second generation server processor launched in 2016.

It is the first chiplet-based Kunpeng with two computing dies. It features:
  • 32x ARM Cortex-A57 @ 2.1GHz cores
  • 48KB L1-I, 32KB L1-D, 1MB L2/4 cores, 32MB CCN L3
  • TSMC 16 nm process
  • 4x DDR4-2133 memory
  • 16x PCIe 3.0 ports

Kunpeng 916 (Hi1616)[edit]

The Kunpeng 916 (Hi1616) is HiSilicon's third generation server processor

launched in 2017. It features:
  • 32x ARM Cortex-A72 @ 2.4GHz cores
  • 48KB L1-I, 32KB L1-D, 1MB L2/4 cores, 32MB CCN L3
  • TSMC 16 nm process
  • 4x DDR4-2400 memory
  • 2-way SMP, Each socket has 2x ports with
96 Gbit/s per port (total of 192 Gbit/s)
  • 46x PCIe 3.0 and 8x 10G Ethernet ports
  • TDP 85W

Kunpeng 920 (Hi1620)[edit]

The Kunpeng 920 (Hi1620) is HiSilicon's fourth generation server processor

announced in 2018, and launched in 2019. It features:
microarchitecture that implements the ARMv8.2-A ISA
  • The TaiShan V110 cores are likely a new core not based on ARM designs
  • 3x Simple ALUs, 1x Complex MDU, 2x BRUs (sharing ports with ALU2/3),
2x FSUs (ASIMD FPU), 2x LSUs
  • 64KB L1-I, 64KB L1-D, 512KB Private L2, 1MB L3/core (shared)
  • TSMC 7 nm HPC process
  • 8x DDR4-3200 memory
  • 2-way and 4-way SMP, Each socket has 3x Hydra ports
with 240 Gbit/s per port (total of 720 Gbit/s)
  • 40x PCIe 4.0 with CCIX support, 4x USB 3.0, 2x SATA 3.0,
8x SAS 3.0 and 2x 100G Ethernet ports
  • TDP 100W to 200W
  • Compression engine (GZIP, LZS, LZ4) capable of up
to 40 Git/s compress and 100 Gbit/s decompress
  • Crypto offload engine (for AES, DES, 3DES, SHA1/2)
capable of throughputs up to 100 Gbit/s

Kunpeng 930 (Hi1630)[edit]

The Kunpeng 930 (Hi1630) is HiSilicon's fifth-generation server processor

announced in 2019 and scheduled for launch in 2021. It features:
  • 80 custom TaiShan V120 cores @ 3GHz frequency, with support
for SMT and ARM's Scalable Vector Extension (SVE)
  • 64KB L1-I, 64KB L1-D, 512KB Private L2 and 1MB L3/core (shared)
  • TSMC 5 nm process
  • 8x DDR5 memory

Kunpeng 950[edit]

The Kunpeng 950 is HiSilicon's sixth-generation server processor

announced in 2019 and scheduled for launch in 2023.

References[edit]

  1. ↑ Schor, David (3 May 2019). Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen.
Retrieved from "https://en.wikichip.org/w/index.php?title=hisilicon/hi16xx&oldid=103083"