Family

• Hi16xx
• Hi3xxx
• K3
• Kirin
• Ascend
• Balong
• Kunpeng
• TaiShan (uarch)

HiSilicon • Huawei

• HiSilicon CPU series
• HiSilicon Kirin
• HiSilicon Kunpeng
• HiSilicon Hydra (uarch)
• HiSilicon TaiShan (uarch)

Server processors

HiSilicon develops server processor SoCs based on the ARM architecture.

See also: HiSilicon and Kunpeng

Hi1610

The Hi1610 is HiSilicon's first generation server processor

announced in 2015. It features:

• 16x ARM Cortex-A57 @ 2.1GHz cores
• 48KB L1-I, 32KB L1-D, 1MB L2/4 cores, 16MB CCN L3
• TSMC 16 nm process
• 2x DDR4-1866 memory
• 16x PCIe 3.0 ports

Hi1612

The Hi1612 is HiSilicon's second generation server processor launched in 2016.

It is the first chiplet-based Kunpeng with two computing dies. It features:

• 32x ARM Cortex-A57 @ 2.1GHz cores
• 48KB L1-I, 32KB L1-D, 1MB L2/4 cores, 32MB CCN L3
• TSMC 16 nm process
• 4x DDR4-2133 memory
• 16x PCIe 3.0 ports

Kunpeng 916 (Hi1616)

The Kunpeng 916 (Hi1616) is HiSilicon's third generation server processor

launched in 2017. It features:

• 32x ARM Cortex-A72 @ 2.4GHz cores
• 48KB L1-I, 32KB L1-D, 1MB L2/4 cores, 32MB CCN L3
• TSMC 16 nm process
• 4x DDR4-2400 memory
• 2-way SMP, Each socket has 2x ports with

96 Gbit/s per port (total of 192 Gbit/s)

• 46x PCIe 3.0 and 8x 10G Ethernet ports
• TDP 85W

Kunpeng 920 (Hi1620)

The Kunpeng 920 (Hi1620) is HiSilicon's fourth generation server processor

announced in 2018, and launched in 2019. It features:

• 32 to 64x custom TaiShan V110 cores @ 2.6GHz cores
• The TaiShan V110 core is a 4-way superscalar, out-of-order

microarchitecture that implements the ARMv8.2-A ISA

• The TaiShan V110 cores are likely a new core not based on ARM designs
• 3x Simple ALUs, 1x Complex MDU, 2x BRUs (sharing ports with ALU2/3),

2x FSUs (ASIMD FPU), 2x LSUs

• 64KB L1-I, 64KB L1-D, 512KB Private L2, 1MB L3/core (shared)
• TSMC 7 nm HPC process
• 8x DDR4-3200 memory
• 2-way and 4-way SMP, Each socket has 3x Hydra ports

with 240 Gbit/s per port (total of 720 Gbit/s)

• 40x PCIe 4.0 with CCIX support, 4x USB 3.0, 2x SATA 3.0,

8x SAS 3.0 and 2x 100G Ethernet ports

• TDP 100W to 200W
• Compression engine (GZIP, LZS, LZ4) capable of up

to 40 Git/s compress and 100 Gbit/s decompress

• Crypto offload engine (for AES, DES, 3DES, SHA1/2)

capable of throughputs up to 100 Gbit/s

Kunpeng 930 (Hi1630)

The Kunpeng 930 (Hi1630) is HiSilicon's fifth-generation server processor

announced in 2019 and scheduled for launch in 2021. It features:

• 80 custom TaiShan V120 cores @ 3GHz frequency, with support

for SMT and ARM's Scalable Vector Extension (SVE)

• 64KB L1-I, 64KB L1-D, 512KB Private L2 and 1MB L3/core (shared)
• TSMC 5 nm process
• 8x DDR5 memory

Kunpeng 950

The Kunpeng 950 is HiSilicon's sixth-generation server processor

announced in 2019 and scheduled for launch in 2023.