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FT1
General Info
Designer	AMD
Introduction	January 4, 2011 (launched)
Market	Mobile
Microarchitecture	Bobcat
TDP	18 W 18,000 mW 0.0241 hp 0.018 kW
Package
Name	FT1
Type	Organic Micro Ball Grid Array
Contacts	413
Dimension	19.0 mm 1.9 cm 0.748 in × 19.0 mm 1.9 cm 0.748 in
Pitch	0.8-1.0 mm "-1.0mm" is not declared as a valid unit of measurement for this property.

FT1 was a BGA-413 package for low power AMD microprocessors with integrated graphics targeting the thin client, embedded and tablet market, the successor to the ASB2 package. Its counterparts for the mainstream mobile and desktop markets are Socket FS1 and Socket FM1, respectively. FT1 was superseded by the FT3 package.

Package FT1 was used in AMD's "Brazos" platform for ultrathin notebooks. All processors in the FT1 package are members of AMD's Family 14h with CPU cores based on the Bobcat microarchitecture, and were manufactured on a 40 nm SOI process.

Features

• 413-pin lidless micro ball grid array package, 0.8-1.0 mm multi-pitch, 19 × 19 mm, organic substrate

• 64 bit DDR3 SDRAM interface up to 667 MHz, PC3-10600 (DDR3-1333), 10.7 GB/s
  • Up to 2 UDIMMs or SODIMMs, no ECC support

• PCIe Gen 1.0 and 2.0 (5 GT/s)
  • Configurable x4 General Purpose Ports (4x1, 2x2, 1x2 + 2x1, 1x4)
  • x4 Unified Media Interface to FCH

• Two independent display controllers
  • Up to 2 × DisplayPort/eDP 1.1a up to 2560 × 1600 at 60 Hz, 30 bpp
  • 2 × Single link DVI up to 1920 × 1200 at 60 Hz, 24 bpp
  • 1 × Single link LVDS up to 1440 × 900 or 1400 × 1050 at 60 Hz, 18 bpp
  • 1 × HDMI up to 1920 × 1080 at 60 Hz, 36 bpp
  • 1 × VGA/DAC
  • 1 × DVO

Chipsets

• AMD FCH A50M/A55E, codename "Hudson"

Processors using package FT1

• AMD C-Series codename "Ontario"
• AMD E-Series "Zacate"
• AMD G-Series
• AMD Z-Series "Desna"

	List of all FT1-based Processors
Model	Price	Process	Launched	µarch	Family	Core	C	T	Freq	Turbo	TDP
T16R		40 nm 0.04 μm 4.0e-5 mm	June 2012	Bobcat	Embedded G-Series	eBrazos	1	1	0.615 GHz 615 MHz 615,000 kHz		4.5 W 4,500 mW 0.00603 hp 0.0045 kW
T24L		40 nm 0.04 μm 4.0e-5 mm	1 March 2011	Bobcat	Embedded G-Series	eBrazos	1	1	1 GHz 1,000 MHz 1,000,000 kHz		5 W 5,000 mW 0.00671 hp 0.005 kW
T30L		40 nm 0.04 μm 4.0e-5 mm	1 March 2011	Bobcat	Embedded G-Series	eBrazos	1	1	1.4 GHz 1,400 MHz 1,400,000 kHz		18 W 18,000 mW 0.0241 hp 0.018 kW
T40E		40 nm 0.04 μm 4.0e-5 mm	23 May 2011	Bobcat	Embedded G-Series	eBrazos	2	2	1 GHz 1,000 MHz 1,000,000 kHz		6.4 W 6,400 mW 0.00858 hp 0.0064 kW
T40N		40 nm 0.04 μm 4.0e-5 mm	19 January 2011	Bobcat	Embedded G-Series	eBrazos	2	2	1 GHz 1,000 MHz 1,000,000 kHz		18 W 18,000 mW 0.0241 hp 0.018 kW
T40R		40 nm 0.04 μm 4.0e-5 mm	23 May 2011	Bobcat	Embedded G-Series	eBrazos	1	1	1 GHz 1,000 MHz 1,000,000 kHz		5.5 W 5,500 mW 0.00738 hp 0.0055 kW
T44R		40 nm 0.04 μm 4.0e-5 mm	19 January 2011	Bobcat	Embedded G-Series	eBrazos	1	1	1.2 GHz 1,200 MHz 1,200,000 kHz		9 W 9,000 mW 0.0121 hp 0.009 kW
T48E		40 nm 0.04 μm 4.0e-5 mm	2012	Bobcat	Embedded G-Series	eBrazos	2	2	1.4 GHz 1,400 MHz 1,400,000 kHz		18 W 18,000 mW 0.0241 hp 0.018 kW
T48L		40 nm 0.04 μm 4.0e-5 mm	1 March 2011	Bobcat	Embedded G-Series	eBrazos	2	2	1.4 GHz 1,400 MHz 1,400,000 kHz		18 W 18,000 mW 0.0241 hp 0.018 kW
T48N		40 nm 0.04 μm 4.0e-5 mm	19 January 2011	Bobcat	Embedded G-Series	eBrazos	2	2	1.4 GHz 1,400 MHz 1,400,000 kHz		18 W 18,000 mW 0.0241 hp 0.018 kW
T52R		40 nm 0.04 μm 4.0e-5 mm	19 January 2011	Bobcat	Embedded G-Series	eBrazos	1	1	1.5 GHz 1,500 MHz 1,500,000 kHz		18 W 18,000 mW 0.0241 hp 0.018 kW
T56E		40 nm 0.04 μm 4.0e-5 mm	2012	Bobcat	Embedded G-Series	eBrazos	2	2	1.65 GHz 1,650 MHz 1,650,000 kHz		18 W 18,000 mW 0.0241 hp 0.018 kW
T56N		40 nm 0.04 μm 4.0e-5 mm	19 January 2011	Bobcat	Embedded G-Series	eBrazos	2	2	1.65 GHz 1,650 MHz 1,650,000 kHz		18 W 18,000 mW 0.0241 hp 0.018 kW
Count: 13

Package Diagram

All dimensions in millimeters.

BGA-413 package ball numbers.

Pin Map

Pin Description

Signal	Description
ALERT_L	Programmable pin that can indicate different events, including a SB-TSI interrupt
CLKIN_H/L	100 MHz PLL Differential Reference Clock
DAC_BLUE, DAC_BLUEB	Blue for Video Monitor Output
DAC_GREEN, DAC_GREENB	Green for Video Monitor Output
DAC_HSYNC, DAC_VSYNC	Display Horizontal, Vertical Sync
DAC_RED, DAC_REDB	Red for Video Monitor Output
DAC_SCL, DAC_SDA	I2C Clock, Data for Display (to video monitor)
DAC_ZVSS	Compensation Resistor to DAC Ground Pin
DBREQ_L/DBRDY	Debug Request/Ready
DISP_CLKIN_H/L	100 MHz Display Controller Reference Clock
DMAACTIVE_L	Indicated System DMA Activity
DP_BLON	Display Panel Backlight Enable
DP_DIGON	Display Panel Power Enable
DP_VARY_BL	Display Backlight Brightness Control
DP_ZVSS	Compensation Resistor to VSS
LTDP0/TDP1_AUXP/N	DisplayPort Auxiliary Channel
LTDP0/TDP1_HPD	DisplayPort Hot Plug Detect
LTDP0/TDP1_TXP/N[3:0]	DisplayPort Differential Transmitter
M0_CS_L[1:0], M1_CS_L[1:0]	DRAM Chip Selects
M0_ODT[1:0], M1_ODT[1:0]	DRAM Enable Pin for On Die Termination
M_ADD[15:0]	DRAM Column/Row Address
M_BANK[2:0]	DRAM Bank Address
M_CAS_L	DRAM Column Address Strobe
M_CKE[1:0]	DRAM Clock Enable
M_CLK_H/L[3:0]	DRAM Differential Clock
M_DATA[63:0]	DRAM Interface Data Bus
M_DM[7:0]	DRAM Data Mask
M_DQS_H/L[7:0]	DRAM Differential Data Strobe
M_EVENT_L	DRAM Thermal Event
M_RAS_L	DRAM Row Address Strobe
M_RESET_L	DRAM Reset Pin for Suspend-to-RAM Power Management Mode
M_VREF	Memory Interface Voltage Reference
M_WE_L	DRAM Write Enable
M_ZVDDIO_MEM_S	Compensation Resistor to VDDIO
PROCHOT_L	Processor in HTC-active state input/output
PWROK	Voltages and CLKIN have reached specified operation
P_GPP_TX/RXP/N[3:0]	General Purpose External PCIe Transmit/Receive Data Differential Pairs
P_UMI_TX/RXP/N[3:0]	Unified Media Interface Transmit/Receive Data Differential Pairs
P_ZVDD_10	Compensation Resistor to P_VDD_10 Power Supply
P_ZVSS	Compensation Resistor to VSS
RESET_L	Processor Reset
RSVD	Reserved
SIC, SID	Sideband Temperature Sensor Interface Clock, Data
SVC, SVD	Serial VID Interface Clock, Data
TCK, TDI, TDO, TMS, TRST_L	JTAG interface
TEST*	Test signal
THERMTRIP_L	Thermal Sensor Trip output
VDDCR_CPU_SENSE	VDDCR_CPU Voltage Monitor Pin
VDDCR_CPU	Core Power Supply
VDDCR_NB_SENSE	VDDCR_NB Voltage Monitor Pin
VDDCR_NB	Northbridge Power Supply
VDDIO_MEM_S_SENSE	VDDIO_MEM_S Voltage Monitor Pin
VDDIO_MEM_S	DDR SDRAM I/O Ring Power Supply
VDDPL_10	1.05 V Supply Pin for System PLL
VDD_10	1.05 V Supply Pins
VDD_18_DAC	1.8 V Supply Pin for DAC
VDD_18	1.8 V Supply Pins
VDD_33	3.3 V Supply Pin
VSSBG_DAC	DAC Ground
VSS_SENSE	VSS Voltage Monitor Pin
VSS	Ground

References

• "FT1 Processor Functional Data Sheet", AMD Publ. #44444, Rev. 2.05, November 2010
• "BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 14h Models 00h-0Fh Processors", AMD Publ. #43170, Rev. 3.13, February 17, 2012
• "Revision Guide for AMD Family 14h Models 00h-0Fh Processors", AMD Publ. #47534, Rev. 3.18, February 26, 2013

See also

• Package ASB2
• Package FT3
• Socket FS1
• Socket FM1