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Cannon Lake µarch
General Info
Arch Type	CPU
Designer	Intel
Manufacturer	Intel
Introduction	May 15, 2018
Process	10 nm
Core Configs	2
Pipeline
Type	Superscalar
OoOE	Yes
Speculative	Yes
Reg Renaming	Yes
Stages	14-19
Decode	5-way?
Instructions
ISA	x86-64
Extensions	MOVBE, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, POPCNT, AVX, AVX2, AES, PCLMUL, FSGSBASE, RDRND, FMA3, F16C, BMI, BMI2, VT-x, VT-d, TXT, TSX, RDSEED, ADCX, PREFETCHW, CLFLUSHOPT, XSAVE, SGX, MPX, AVX-512, AVX-512F, AVX-512CD, AVX-512BW, AVX-512DQ, AVX-512VL, AVX-512IFMA, AVX-512VBMI, SHA, UMIP
Cache
L1I Cache	32 KiB/core 8-way set associative
L1D Cache	32 KiB/core 8-way set associative
L2 Cache	256 KiB/core 4-way set associative
L3 Cache	2 MiB/core Up to 16-way set associative
Cores
Core Names	Cannon Lake Y, Cannon Lake U
Succession
Kaby Lake Ice Lake
Contemporary
Coffee Lake

Cannon Lake (CNL) (formerly Skymont) is a planned microarchitecture by Intel as a successor to Kaby Lake. Cannon Lake is expected to be fabricated using a 10 nm process and is set to be introduced in the second half of 2018. Cannon Lake is the "Process" microarchitecture as part of Intel's PAO model.

For mobile, Cannon Lake is expected to be branded as 8th Generation Intel Core i3, Core i5. and Core i7 processors.

Codenames

Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.

Core	Abbrev	Description	Graphics	Target
Cannon Lake Y	CNL-Y	Extremely low power	GT2	2-in-1s detachable, tablets, and computer sticks
Cannon Lake U	CNL-U	Ultra-low Power	GT2/GT3	Light notebooks, portable All-in-Ones (AiOs), Minis, and conference room
Cannon Lake H	CNL-H	High-performance Graphics	GT2/GT3	Ultimate mobile performance, mobile workstations
Cannon Lake S	CNL-S	Performance-optimized lifestyle	GT2/GT3	Desktop performance to value, AiOs, and minis
Cannon Lake DT	CNL-DT	Workstation	GT2	Workstations & entry-level servers

Release Dates

Initial Cannon Lake models were introduced in May 2018 with additional models planned throughout the year.

Process Technology

Cannon Lake is manufactured on Intel's 10 nm process (P1274). Intel's 10 nm process is among the first high-volume manufacturing processes to employ Self-Aligned Quad Patterning (SAQP) (goes under the "Hyper-Scaling" marketing name). Intel's 10nm features a 0.0367 µm² SRAM bit cell.

Scaling:

	Broadwell	Cannon Lake	Δ
	14 nm	10 nm
Fin Pitch	42 nm	34 nm	0.81x
Fin Width​	8 nm	7 nm	0.88x
Fin Height​	42 nm	53 nm	1.24x
Gate Pitch	70 nm	54 nm	0.77x
Interconnect Pitch	52 nm	36 nm	0.69x
Cell Height	399 nm	272 nm	0.68x

Compiler support

Support for Cannon Lake was added in GCC 8.1 and LLVM 6.0.

Compiler	Arch-Specific	Arch-Favorable
ICC	-march=cannonlake	-mtune=cannonlake
GCC	-march=cannonlake	-mtune=cannonlake
LLVM	-march=cannonlake	-mtune=cannonlake
Visual Studio	?	?

CPUID

Core	Extended Family	Family	Extended Model	Model
Y, U	0	0x6	0x6	0x6
	Family 6 Model 102

Architecture

This section is empty; you can help add the missing info by editing this page.

Key changes from Skylake

• 10 nm process (from 14 nm)
• Mainstream chipset
  • 200 Series chipset → 300 Series chipset

• Mobile Processors
  • LPDDR4/LPDDR4X memory support (from LPDDR3)
    • Rates up to 2400 MT/s

• Gen9.5 → Gen10 graphics
• Gen10 GPUs
  • HD Graphics 6xx (GT1) → UHD Graphics 7xx (GT1) (24 Execution Units, 2x EUs from Skylake)
  • HD Graphics 6xx (GT2) → UHD Graphics 7xx (GT2) (40 Execution Units, 1.7x EUs from Skylake)

New instructions

Cannon Lake introduced a number of new instructions. See Palm Cove § New Instructions for details.

Block Diagram

Entire SoC Overview (dual)

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Individual Core

See Palm Cove § Block Diagram.

Gen11 Graphics

See Gen10 Graphics § Block Diagram.

Block Diagram

Entire SoC Overview (dual)

Individual Core

This section is empty; you can help add the missing info by editing this page.

Gen10

See Gen10#Gen10.

Die

Dual-core

• 10 nm process
• 13 metal layers
• ~8.2 mm x ~8.6 mm
• ~70.52 mm² die size
• 2 CPU cores + 40 GPU EUs

All Cannon Lake Chips

	Cannon Lake Chips
	Main processor													IGP			Major Feature Diff
Model	Launched	Price	Family	Platform	Core	C	T	L3$	L4$	TDP	Freq	Turbo	Max Mem	Name	Freq	Turbo	TBT	HT	AVX2	TXT	TSX	vPro	VT-d
M3-8114Y			Core M3		Cannon Lake Y	2	4				1.5 GHz 1,500 MHz 1,500,000 kHz		16 GiB 16,384 MiB 16,777,216 KiB 17,179,869,184 B 0.0156 TiB	UHD Graphics ?	300 MHz 0.3 GHz 300,000 KHz		✔	✔	✔	✘	✘	✘	✔
i3-8121U	15 May 2018		Core i3		Cannon Lake U	2	4	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB		15 W 15,000 mW 0.0201 hp 0.015 kW	2.2 GHz 2,200 MHz 2,200,000 kHz	3.2 GHz 3,200 MHz 3,200,000 kHz	32 GiB 32,768 MiB 33,554,432 KiB 34,359,738,368 B 0.0313 TiB				✔	✔	✔	✘	✘	✘	✔
Count: 2

References

• Mark Bohr, Intel. Intel Technology and Manufacturing Day. Mar 28, 2017.

See also

• AMD's Zen