EPYC Embedded - AMD

AMD EPYC Embedded

EPYC Embedded logo
Developer	AMD
Manufacturer	GlobalFoundries
Type	System on chips
Introduction	February 22, 2018 (announced) February 22, 2018 (launch)
Architecture	Embedded x86 SoCs
ISA	x86-64
µarch	Zen
Word size	64 bit 8 octets 16 nibbles
Process	14 nm 0.014 μm 1.4e-5 mm
Technology	CMOS
Clock	1,500 MHz-2,700 MHz
Socket	Socket SP4, Socket SP4r2
Succession
←
Opteron

EPYC Embedded is a family of 64-bit multi-core x86 embedded microprocessors designed and introduced by AMD. Those processors are primarily aimed at networking, storage, and edge computing devices. EPYC Embedded effectively succeeded the Opteron A1100 series of embedded microprocessors (although those were actually based on ARM, not x86).

Overview[edit]

The EPYC Embedded family is a low-power variant of the EPYC line that primarily marketed towards embedded devices such as networking, storage, and edge computing devices. Those parts have lower TDPs and come in a much smaller package allowing for denser integration.

AMD EPYC CPU Generations[edit]

AMD EPYC CPU Generations
Gen	Year	Codename	Product line	Cores	Socket	Memory
Server
1st	2017	Naples	7001 series	32× Zen	Socket SP3 (LGA)	DDR4
2nd	2019	Rome	7002 series	64× Zen 2
3rd	2021	Milan	7003 series	64× Zen 3
3rd	2022	Milan-X	7004 series	64× Zen 3
4th	2022	Genoa	9004 series	96× Zen 4	Socket SP5 (LGA)	DDR5
	2023	Genoa-X		96× Zen 4
		Bergamo		128× Zen 4c
		Siena	8004 series	64× Zen 4c	Socket SP6 (LGA)
	2024	Raphael-X	4004 series	16× Zen 4	Socket AM5 (LGA)
5th	2024	Turin (-X)	9005 series	128× Zen 5	Socket SP5 (LGA)	DDR5
		Turin Dense	9005 series	192× Zen 5c	Socket SP5 (LGA)
		Sorano	8005 series	64× Zen 5c	Socket SP6 (LGA)
	2025	Grado	4005 series	16× Zen 5	Socket AM5 (LGA)
6th	2026	Venice	9006 series (Verona / Murano )	96× Zen 6	Socket SP8 (LGA)	DDR5/6
		Venice Classic		128× Zen 6c	Socket SP7 (LGA)
		Venice Dense		256× Zen 6c	Socket SP7 (LGA)
7st	2027	Verano	9007 series	256× Zen 7	Socket SP7 (LGA)	DDR5/6
Embedded
1st	2018	Snowy Owl	Embedded 3001 series	16× Zen	Package SP4 (BGA)	DDR4
1st	2019	Naples	Embedded 7001 series	32× Zen	Socket SP3 (LGA)
2nd	2021	Rome	Embedded 7002 series	64× Zen 2
3rd	2022	Milan	Embedded 7003 series	64× Zen 3
4th	2023	Genoa	Embedded 9004 series	96× Zen 4	Socket SP5 (LGA)	DDR5
4th	2023	Siena	Embedded 8004 series	64× Zen 4c	Socket SP6 (LGA)
5th	2025	Turin (-X)	Embedded 9005 series	128× Zen 5	Socket SP5 (LGA)
		Turin Dense	Embedded 9005 series	192× Zen 5c	Socket SP5 (LGA)
		Grado	Embedded 4005 series	16× Zen 5	Socket AM5 (LGA)
		Prado	Embedded 2005 series	16× Zen 5	Socket AM5 (LGA)

Members[edit]

EPYC Embedded 3001 Series (Zen)[edit]

See also: Snowy Owl and Zen µarch

Introduced in early 2018, the 3000 embedded series is based on the Zen microarchitecture using the same dies as the server EPYC processors. 3000-series come in anywhere from 4 to 16 cores as well as with and without SMT support. Models with 8 or less cores come in a single-die configuration and uses a single-chip module Package SP4r4 while models with more than eight cores come in a dual-die configuration and use a multi-chip module Package SP4. Both packages are ball grid arrays (BGAs) and are pin-compatible with each other. Geared toward embedded applications means those parts have lower TDP than their server counterparts. Depending on the die configuration, the features of the dual-die config are mostly double that of the single-die config.

Dual-die Models
- Mem: Quad-channel 64-bit DDR4-2666 w/ ECC, up to 1 TiB
- I/O: x64 PCIe lanes MUX'ed with SATA/GbE and can be mixed configured PCIe and up to 16 SATA ports and up to 10 x 10GbE ports
- TDP: 65-100 W
Single-die Models
- Mem: Dual-channel 64-bit DDR4-2666/2133 w/ ECC, up to 512 GiB
- I/O: x32 PCIe lanes MUX'ed with SATA/GbE and can be mixed configured PCIe and up to 8 SATA ports and up to 4 x 10GbE ports
- TDP: 30-50 W

The ISA and Technology applies to all models.

ISA: Everything up to AVX2 (i.e., SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2), and SHA
Tech: Precision Boost, 2-way SMT, AMD-Vi, AMD-V, Secure Memory Encryption (SME), and Secure Encrypted Virtualization (SEV)

	List EPYC Embedded 3000-Series Processors
Model	Price	Launched	Cores	Thread	L2$	L3$	TDP	Base	Turbo (Max)	Memory	PCIe Lanes
	Single-Chip Package (1 die)
3101		21 February 2018	4	4	2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	35 W 35,000 mW 0.0469 hp 0.035 kW	2.1 GHz 2,100 MHz 2,100,000 kHz	2.9 GHz 2,900 MHz 2,900,000 kHz	DDR4-2666
3151		21 February 2018	4	8	2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	45 W 45,000 mW 0.0603 hp 0.045 kW	2.7 GHz 2,700 MHz 2,700,000 kHz	2.9 GHz 2,900 MHz 2,900,000 kHz	DDR4-2666
3201		21 February 2018	8	8	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	30 W 30,000 mW 0.0402 hp 0.03 kW	1.5 GHz 1,500 MHz 1,500,000 kHz	3.1 GHz 3,100 MHz 3,100,000 kHz	DDR4-2133
3251	$ 315.00 € 283.50 £ 255.15 ¥ 32,548.95	21 February 2018	8	16	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	55 W 55,000 mW 0.0738 hp 0.055 kW	2.5 GHz 2,500 MHz 2,500,000 kHz	3.1 GHz 3,100 MHz 3,100,000 kHz	DDR4-2666
3255			8	16	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	55 W 55,000 mW 0.0738 hp 0.055 kW	2.5 GHz 2,500 MHz 2,500,000 kHz	3.1 GHz 3,100 MHz 3,100,000 kHz	DDR4-2666
	Multi-Chip Package (2 dies)
3301	$ 450.00 € 405.00 £ 364.50 ¥ 46,498.50	21 February 2018	12	12	6 MiB 6,144 KiB 6,291,456 B 0.00586 GiB	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	65 W 65,000 mW 0.0872 hp 0.065 kW	2 GHz 2,000 MHz 2,000,000 kHz	3 GHz 3,000 MHz 3,000,000 kHz	DDR4-2666
3351		21 February 2018	12	24	6 MiB 6,144 KiB 6,291,456 B 0.00586 GiB	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	80 W 80,000 mW 0.107 hp 0.08 kW	1.9 GHz 1,900 MHz 1,900,000 kHz	3 GHz 3,000 MHz 3,000,000 kHz	DDR4-2666
3401		21 February 2018	16	16	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	85 W 85,000 mW 0.114 hp 0.085 kW	1.85 GHz 1,850 MHz 1,850,000 kHz	3 GHz 3,000 MHz 3,000,000 kHz	DDR4-2666
3451	$ 880.00 € 792.00 £ 712.80 ¥ 90,930.40	21 February 2018	16	32	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	100 W 100,000 mW 0.134 hp 0.1 kW	2.15 GHz 2,150 MHz 2,150,000 kHz	3 GHz 3,000 MHz 3,000,000 kHz	DDR4-2666
Count: 9

EPYC Embedded 4005 Series[edit]

"Grado" EPYC Embedded (Zen 5)

Model Name  	Cores/Threads	Base/Max Freq.	L3 Cache	TDP

EPYC Embedded 4585PX	16/32	4.3/5.7 GHz	128 MB		170W
EPYC Embedded 4565P	16/32	4.3/5.7 GHz	64 MB		170W
EPYC Embedded 4545P	16/32	3.0/5.4 GHz	64 MB		65W
EPYC Embedded 4465P	12/24	3.4/5.4 GHz	64 MB		65W
EPYC Embedded 4345P	 8/16	3.8/5.5 GHz	32 MB		65W
EPYC Embedded 4245P	 6/12	3.9/5.4 GHz	32 MB		65W

EPYC Embedded 2005 Series[edit]

EPYC Embedded (Zen 5)

Model Name  	Cores/Threads	Base/Max Freq.	L3 Cache	TDP

EPYC Embedded 2875	16/32	3.0/4.5 GHz	64 MB		75 W
EPYC Embedded 2655	12/24	2.7/4.5 GHz	64 MB		55 W
EPYC Embedded 2435	 8/16	2.8/4.5 GHz	32 MB		45 W

Documents[edit]

EPYC 3000 series Product Brief

designer	AMD +
first announced	February 22, 2018 +
first launched	February 22, 2018 +
full page name	amd/epyc embedded +
instance of	system on a chip family +
instruction set architecture	x86-64 +
main designer	AMD +
manufacturer	GlobalFoundries +
microarchitecture	Zen +
name	AMD EPYC Embedded +
process	14 nm (0.014 μm, 1.4e-5 mm) +
socket	Socket SP4 + and Socket SP4r2 +
technology	CMOS +
word size	64 bit (8 octets, 16 nibbles) +

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