Difference between revisions of "amd/microarchitectures/zen 2"

	Edit Values
	Zen 2 µarch
	General Info
Arch Type	CPU
Designer	AMD
Manufacturer	GlobalFoundries, TSMC
Introduction	2019
Process	14 nm, 7 nm, 12 nm
	Pipeline
Type	Superscalar
OoOE	Yes
Speculative	Yes
Reg Renaming	Yes
Stages	19
Decode	4-way
	Instructions
ISA	x86-64
Extensions	MOVBE, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, POPCNT, AVX, AVX2, AES, PCLMUL, RDRND, F16C, BMI, BMI2, RDSEED, ADCX, PREFETCHW, CLFLUSHOPT, XSAVE, SHA, CLZERO
	Cores
Core Names	Rome
	Succession
	Zen+ Zen 3

Revision as of 22:26, 20 June 2019

Zen 2 is AMD's successor to Zen+, a 7 nm process microarchitecture for mainstream mobile, desktops, workstations, and servers. Zen 2 will eventually be replaced by Zen 3.

For performance desktop and mobile computing, Zen is branded as Ryzen 3, Ryzen 5, Ryzen 7 and Ryzen Threadripper processors. For servers, Zen is branded as EPYC.

This article is a work in progress!

History

Zen 2

Zen 2 is set to succeed Zen in 2019. In February of 2017 Lisa Su, AMD's CEO announced their future roadmap to include Zen 2 and later Zen 3. On Investor's Day May 2017 Jim Anderson, AMD Senior Vice President, confirmed that Zen 2 is set to utilize 7 nm process. Initial details of Zen 2 and Rome were unveiled during AMD's Next Horizon event on November 6 2018.

Codenames

Zen 2 on the roadmap

Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.

Core	C/T	Target
Rome	Up to 64/128	High-end server multiprocessors
Castle Peak	Up to 64/128?	workstation & enthusiasts market processors
Matisse	Up to 16/32	Mainstream to high-end desktops & enthusiasts market processors
Renoir	Up to 4/8?	Mainstream APUs with Navi GPUs
River Hawk	Up to 2/4	Low-power/Cost-sensitive embedded processors with Navi GPU

Process technology

Zen 2 is fabricated on TSMC's 7 nm process. Some components of the chips (e.g., I/O die) are fabricated on GlobalFoundries 12 nm process.

Compiler support

Compiler	Arch-Specific	Arch-Favorable
GCC	`-march=znver2`	`-mtune=znver2`
LLVM	`-march=znver2`	`-mtune=znver2`

Note: Initial support in GCC 9 and LLVM 9.

Architecture

Zen 2 inherits most of the design from Zen+ but improves the instruction stream bandwidth and floating-point throughput performance.

This article is a work in progress!

Key changes from Zen+

7 nm process (from 12 nm)
- I/O die utilizes 12 nm
Core
- Higher IPC (AMD self-reported up to 15% IPC)
- Front-end
  - Improved branch prediction unit
    - Improved prefetcher
  - Improved µOP cache tags
  - Improved µOP cache
    - Larger µOP cache (4096 entries, up from 2048)
  - Increased dispatch bandwidth
- Back-end
  - Increased retire bandwidth (??-wide, up from 8-wide)
  - FPU
    - 2x wider datapath (256-bit, up from 128-bit)
    - 2x wider EUs (256-bit FMAs, up from 128-bit FMAs)
    - 2x wider LSU (2x256-bit L/S, up from 128-bit)
    - Improved mul latency (3 cycles, down from 4)
  - Integer
    - Increased number of registers (180, up from 168)
    - Additional AGU (3, up from 2)
    - Larger scheduler (4x16 ALU + 1x28 AGU, up from 4x14 ALU + 2x14 AGU
    - Larger Reorder Buffer (224, up from 192)
- Memory subsystem
  - 0.5x L1 instruction cache (32 KiB, down from 64 KiB)
  - 8-way associativity (from 4-way)
  - 1.33 larger L2 DTLB (2048-entry, up from 1536)
  - 48 entry store queue (was 44)
CCX
- 2x L3 cache slice (16 MiB, up from 8 MiB)
- Increased L3 latency (~40 cycles, up from ~35 cycles)
Security
- In-silicon Spectre enhancements
- Increase number of keys/VMs supported
I/O
- PCIe 4.0 (from 3.0)
- Infinity Fabric 2
  - 2.3x transfer rate per link (25 GT/s, up from ~10.6 GT/s)
- Decoupling of MemClk from FClk, allowing 2:1 ratio in addition to 1:1
- DDR4-3200 support, up from DDR4-2933

This list is incomplete; you can help by expanding it.

New instructions

Zen 2 introduced a number of new x86 instructions:

CLWB - Write back modified cache line and may retain line in cache hierarchy
WBNOINVD - Write back and do not flush internal caches, initiate same of external caches
RDPID - Read Processor ID

Block Diagram

Individual Core

This section is empty; you can help add the missing info by editing this page.

Memory Hierarchy

This section is empty; you can help add the missing info by editing this page.

Core

Zen 2 largely builds on Zen. Most of the fine details have not been revealed by AMD yet.

This article is a work in progress!

Front End

In order to feed the backend, which has been widened to support 256-bit operation, the front-end throughput was improved. AMD reported that the branch prediction unit has been reworked. This includes improvements to the prefetcher and various undisclosed optimizations to the instruction cache. The µOP cache was also tweaked including changes to the µOP cache tags and the µOP cache itself which has been enlarged to improve the instruction stream throughput.

Execution Engine

AMD stated that both the dispatch bandwidth and the retire bandwidth has been increased.

Floating Point

The floating-point unit underwent major modifications in Zen 2. In Zen, AVX2 256 bit single and double precision vector floating-point data types were supported through the use of two 128 bit micro-ops per instruction. Likewise, the floating-point load and store operations were 128 bits wide. In Zen 2, the datapath and the execution units were widened to 256 bits, doubling the vector throughput of the core.

With two 256-bit FMAs, Zen 2 is capable of 16 FLOPs/cycle.

Rome

Rome is codename for AMD's server chip based on the Zen 2 core. Like prior generation (Naples), Rome utilizes a chiplet multi-chip package design. Each chip comprises of nine dies - one centralized I/O die and eight compute dies. The compute dies are fabricated on TSMC's 7 nm process in order to take advantage of the lower power and higher density. On the other hand, the I/O makes use of GlobalFoundries mature 14 nm process.

The centralized I/O die incorporates eight Infinity Fabric links, 128 PCIe Gen 4 lanes, and eight DDR4 memory channels. The full capabilities of the I/O have not been disclosed yet. Attached to the I/O die are eight compute dies - each with eight Zen 2 core - for a total of 64 cores and 128 threads per chip.

All Zen 2 chips

... further results

	List of Zen 2 Processors
Model	Family	Price	Launched	Cores	Threads	L3$	Base	Turbo	TDP	Mem Type
7232P	EPYC	$ 450.00 € 405.00 £ 364.50 ¥ 46,498.50	7 August 2019	8	16	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	3.1 GHz 3,100 MHz 3,100,000 kHz	3.2 GHz 3,200 MHz 3,200,000 kHz	120 W 120,000 mW 0.161 hp 0.12 kW	DDR4-3200
7252	EPYC	$ 475.00 € 427.50 £ 384.75 ¥ 49,081.75	7 August 2019	8	16	64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB	3.1 GHz 3,100 MHz 3,100,000 kHz	3.2 GHz 3,200 MHz 3,200,000 kHz	120 W 120,000 mW 0.161 hp 0.12 kW	DDR4-3200
7262	EPYC	$ 575.00 € 517.50 £ 465.75 ¥ 59,414.75	7 August 2019	8	16	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	3.2 GHz 3,200 MHz 3,200,000 kHz	3.4 GHz 3,400 MHz 3,400,000 kHz	155 W 155,000 mW 0.208 hp 0.155 kW	DDR4-3200
7272	EPYC	$ 625.00 € 562.50 £ 506.25 ¥ 64,581.25	7 August 2019	12	24	64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB	2.9 GHz 2,900 MHz 2,900,000 kHz	3.2 GHz 3,200 MHz 3,200,000 kHz	120 W 120,000 mW 0.161 hp 0.12 kW	DDR4-3200
7282	EPYC	$ 650.00 € 585.00 £ 526.50 ¥ 67,164.50	7 August 2019	16	32	64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB	2.8 GHz 2,800 MHz 2,800,000 kHz	3.2 GHz 3,200 MHz 3,200,000 kHz	120 W 120,000 mW 0.161 hp 0.12 kW	DDR4-3200
7302	EPYC	$ 978.00 € 880.20 £ 792.18 ¥ 101,056.74	7 August 2019	16	32	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	3 GHz 3,000 MHz 3,000,000 kHz	3.3 GHz 3,300 MHz 3,300,000 kHz	155 W 155,000 mW 0.208 hp 0.155 kW	DDR4-3200
7302P	EPYC	$ 825.00 € 742.50 £ 668.25 ¥ 85,247.25	7 August 2019	16	32	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	3 GHz 3,000 MHz 3,000,000 kHz	3.3 GHz 3,300 MHz 3,300,000 kHz	155 W 155,000 mW 0.208 hp 0.155 kW	DDR4-3200
7352	EPYC	$ 1,350.00 € 1,215.00 £ 1,093.50 ¥ 139,495.50	7 August 2019	24	48	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.3 GHz 2,300 MHz 2,300,000 kHz	3.2 GHz 3,200 MHz 3,200,000 kHz	155 W 155,000 mW 0.208 hp 0.155 kW	DDR4-3200
7402	EPYC	$ 1,783.00 € 1,604.70 £ 1,444.23 ¥ 184,237.39	7 August 2019	24	48	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.8 GHz 2,800 MHz 2,800,000 kHz	3.35 GHz 3,350 MHz 3,350,000 kHz	180 W 180,000 mW 0.241 hp 0.18 kW	DDR4-3200
7402P	EPYC	$ 1,250.00 € 1,125.00 £ 1,012.50 ¥ 129,162.50	7 August 2019	24	48	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.8 GHz 2,800 MHz 2,800,000 kHz	3.35 GHz 3,350 MHz 3,350,000 kHz	180 W 180,000 mW 0.241 hp 0.18 kW	DDR4-3200
7452	EPYC	$ 2,025.00 € 1,822.50 £ 1,640.25 ¥ 209,243.25	7 August 2019	32	64	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.35 GHz 2,350 MHz 2,350,000 kHz	3.35 GHz 3,350 MHz 3,350,000 kHz	155 W 155,000 mW 0.208 hp 0.155 kW	DDR4-3200
7502	EPYC	$ 2,600.00 € 2,340.00 £ 2,106.00 ¥ 268,658.00	7 August 2019	32	64	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.5 GHz 2,500 MHz 2,500,000 kHz	3.35 GHz 3,350 MHz 3,350,000 kHz	180 W 180,000 mW 0.241 hp 0.18 kW	DDR4-3200
7502P	EPYC	$ 2,300.00 € 2,070.00 £ 1,863.00 ¥ 237,659.00	7 August 2019	32	64	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.5 GHz 2,500 MHz 2,500,000 kHz	3.35 GHz 3,350 MHz 3,350,000 kHz	180 W 180,000 mW 0.241 hp 0.18 kW	DDR4-3200
7532	EPYC		19 February 2020	32	64	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2.4 GHz 2,400 MHz 2,400,000 kHz	3.3 GHz 3,300 MHz 3,300,000 kHz	200 W 200,000 mW 0.268 hp 0.2 kW	DDR4-3200
7542	EPYC	$ 3,400.00 € 3,060.00 £ 2,754.00 ¥ 351,322.00	7 August 2019	32	64	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.9 GHz 2,900 MHz 2,900,000 kHz	3.4 GHz 3,400 MHz 3,400,000 kHz	225 W 225,000 mW 0.302 hp 0.225 kW	DDR4-3200
7552	EPYC	$ 4,025.00 € 3,622.50 £ 3,260.25 ¥ 415,903.25	7 August 2019	48	96	192 MiB 196,608 KiB 201,326,592 B 0.188 GiB	2.2 GHz 2,200 MHz 2,200,000 kHz	3.35 GHz 3,350 MHz 3,350,000 kHz	200 W 200,000 mW 0.268 hp 0.2 kW	DDR4-3200
7642	EPYC	$ 4,775.00 € 4,297.50 £ 3,867.75 ¥ 493,400.75	7 August 2019	48	96	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2.3 GHz 2,300 MHz 2,300,000 kHz	3.3 GHz 3,300 MHz 3,300,000 kHz	225 W 225,000 mW 0.302 hp 0.225 kW	DDR4-3200
7662	EPYC		19 February 2020	64	128	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2 GHz 2,000 MHz 2,000,000 kHz	3.3 GHz 3,300 MHz 3,300,000 kHz	225 W 225,000 mW 0.302 hp 0.225 kW	DDR4-3200
7702	EPYC	$ 6,450.00 € 5,805.00 £ 5,224.50 ¥ 666,478.50	7 August 2019	64	128	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2 GHz 2,000 MHz 2,000,000 kHz	3.35 GHz 3,350 MHz 3,350,000 kHz	200 W 200,000 mW 0.268 hp 0.2 kW	DDR4-3200
7702P	EPYC	$ 4,425.00 € 3,982.50 £ 3,584.25 ¥ 457,235.25	7 August 2019	64	128	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2 GHz 2,000 MHz 2,000,000 kHz	3.35 GHz 3,350 MHz 3,350,000 kHz	200 W 200,000 mW 0.268 hp 0.2 kW	DDR4-3200
7742	EPYC	$ 6,950.00 € 6,255.00 £ 5,629.50 ¥ 718,143.50	7 August 2019	64	128	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2.25 GHz 2,250 MHz 2,250,000 kHz	3.4 GHz 3,400 MHz 3,400,000 kHz	225 W 225,000 mW 0.302 hp 0.225 kW	DDR4-3200
7F32	EPYC	$ 2,100.00 € 1,890.00 £ 1,701.00 ¥ 216,993.00	14 April 2020	8	16	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	3.7 GHz 3,700 MHz 3,700,000 kHz	3.9 GHz 3,900 MHz 3,900,000 kHz	180 W 180,000 mW 0.241 hp 0.18 kW	DDR4-3200
7F52	EPYC	$ 3,100.00 € 2,790.00 £ 2,511.00 ¥ 320,323.00	14 April 2020	16	32	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	3.5 GHz 3,500 MHz 3,500,000 kHz	3.9 GHz 3,900 MHz 3,900,000 kHz	240 W 240,000 mW 0.322 hp 0.24 kW	DDR4-3200
7F72	EPYC	$ 2,450.00 € 2,205.00 £ 1,984.50 ¥ 253,158.50	14 April 2020	24	48	192 MiB 196,608 KiB 201,326,592 B 0.188 GiB	3.2 GHz 3,200 MHz 3,200,000 kHz	3.7 GHz 3,700 MHz 3,700,000 kHz	240 W 240,000 mW 0.322 hp 0.24 kW	DDR4-3200
7H12	EPYC		18 September 2019	64	128	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2.6 GHz 2,600 MHz 2,600,000 kHz	3.3 GHz 3,300 MHz 3,300,000 kHz	280 W 280,000 mW 0.375 hp 0.28 kW	DDR4-3200
4300G	Ryzen 3		21 July 2020	4	8	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	3.8 GHz 3,800 MHz 3,800,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	65 W 65,000 mW 0.0872 hp 0.065 kW	DDR4-3200
4300GE	Ryzen 3		21 July 2020	4	8	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	3.5 GHz 3,500 MHz 3,500,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	35 W 35,000 mW 0.0469 hp 0.035 kW	DDR4-3200
4300U	Ryzen 3		6 January 2020	4	4	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	2.7 GHz 2,700 MHz 2,700,000 kHz	3.7 GHz 3,700 MHz 3,700,000 kHz	15 W 15,000 mW 0.0201 hp 0.015 kW	DDR4-3200 LPDDR4x-4266
5300U	Ryzen 3		12 January 2021	4	8	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	2.6 GHz 2,600 MHz 2,600,000 kHz	3.8 GHz 3,800 MHz 3,800,000 kHz	15 W 15,000 mW 0.0201 hp 0.015 kW	DDR4-3200 LPDDR4-4266
PRO 4350G	Ryzen 3		21 July 2020	4	8	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	3.8 GHz 3,800 MHz 3,800,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	65 W 65,000 mW 0.0872 hp 0.065 kW	DDR4-3200
PRO 4350GE	Ryzen 3		21 July 2020	4	8	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	3.5 GHz 3,500 MHz 3,500,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	35 W 35,000 mW 0.0469 hp 0.035 kW	DDR4-3200
PRO 4450U	Ryzen 3		7 May 2020	4	8	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	2.5 GHz 2,500 MHz 2,500,000 kHz	3.7 GHz 3,700 MHz 3,700,000 kHz	15 W 15,000 mW 0.0201 hp 0.015 kW	DDR4-3200 LPDDR4x-4266
3500	Ryzen 5			6	6	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	3.6 GHz 3,600 MHz 3,600,000 kHz	4.1 GHz 4,100 MHz 4,100,000 kHz	65 W 65,000 mW 0.0872 hp 0.065 kW	DDR4-3000
3500X	Ryzen 5			6	6	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	3.6 GHz 3,600 MHz 3,600,000 kHz	4.1 GHz 4,100 MHz 4,100,000 kHz	65 W 65,000 mW 0.0872 hp 0.065 kW	DDR4-3000
3600	Ryzen 5	$ 199.00 € 179.10 £ 161.19 ¥ 20,562.67	7 July 2019	6	12	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	3.6 GHz 3,600 MHz 3,600,000 kHz	4.2 GHz 4,200 MHz 4,200,000 kHz	65 W 65,000 mW 0.0872 hp 0.065 kW	DDR4-3200
3600X	Ryzen 5	$ 249.00 € 224.10 £ 201.69 ¥ 25,729.17	7 July 2019	6	12	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	3.8 GHz 3,800 MHz 3,800,000 kHz	4.4 GHz 4,400 MHz 4,400,000 kHz	95 W 95,000 mW 0.127 hp 0.095 kW	DDR4-3200
3600XT	Ryzen 5	$ 249.00 € 224.10 £ 201.69 ¥ 25,729.17	7 July 2020	6	12	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	3.8 GHz 3,800 MHz 3,800,000 kHz	4.5 GHz 4,500 MHz 4,500,000 kHz	95 W 95,000 mW 0.127 hp 0.095 kW	DDR4-3200
4500U	Ryzen 5		6 January 2020	6	6	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	2.3 GHz 2,300 MHz 2,300,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	15 W 15,000 mW 0.0201 hp 0.015 kW	DDR4-3200 LPDDR4x-4266
4600G	Ryzen 5		21 July 2020	6	12	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	3.7 GHz 3,700 MHz 3,700,000 kHz	4.2 GHz 4,200 MHz 4,200,000 kHz	65 W 65,000 mW 0.0872 hp 0.065 kW	DDR4-3200
4600GE	Ryzen 5		21 July 2020	6	12	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	3.3 GHz 3,300 MHz 3,300,000 kHz	4.2 GHz 4,200 MHz 4,200,000 kHz	35 W 35,000 mW 0.0469 hp 0.035 kW	DDR4-3200
4600H	Ryzen 5		6 January 2020	6	12	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	3 GHz 3,000 MHz 3,000,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	45 W 45,000 mW 0.0603 hp 0.045 kW	DDR4-3200 LPDDR4x-4266
4600HS	Ryzen 5		16 March 2020	6	12	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	3 GHz 3,000 MHz 3,000,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	35 W 35,000 mW 0.0469 hp 0.035 kW	DDR4-3200 LPDDR4x-4266
4600U	Ryzen 5		6 January 2020	6	12	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	2.1 GHz 2,100 MHz 2,100,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	15 W 15,000 mW 0.0201 hp 0.015 kW	DDR4-3200 LPDDR4x-4266
4680U	Ryzen 5		13 April 2021	6	12	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	2.1 GHz 2,100 MHz 2,100,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	15 W 15,000 mW 0.0201 hp 0.015 kW	DDR4-3200 LPDDR4x-4266
5500U	Ryzen 5		12 January 2021	6	12	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	2.1 GHz 2,100 MHz 2,100,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	15 W 15,000 mW 0.0201 hp 0.015 kW	DDR4-3200 LPDDR4-4266
PRO 3600	Ryzen 5		30 September 2019	6	12	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	3.6 GHz 3,600 MHz 3,600,000 kHz	4.2 GHz 4,200 MHz 4,200,000 kHz	65 W 65,000 mW 0.0872 hp 0.065 kW	DDR4-3200
PRO 4650G	Ryzen 5		21 July 2020	6	12	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	3.7 GHz 3,700 MHz 3,700,000 kHz	4.2 GHz 4,200 MHz 4,200,000 kHz	65 W 65,000 mW 0.0872 hp 0.065 kW	DDR4-3200
PRO 4650GE	Ryzen 5		21 July 2020	6	12	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	3.3 GHz 3,300 MHz 3,300,000 kHz	4.2 GHz 4,200 MHz 4,200,000 kHz	35 W 35,000 mW 0.0469 hp 0.035 kW	DDR4-3200
PRO 4650U	Ryzen 5		7 May 2020	6	12	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	2.1 GHz 2,100 MHz 2,100,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz	15 W 15,000 mW 0.0201 hp 0.015 kW	DDR4-3200 LPDDR4x-4266
3700X	Ryzen 7	$ 329.00 € 296.10 £ 266.49 ¥ 33,995.57	7 July 2019	8	16	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	3.6 GHz 3,600 MHz 3,600,000 kHz	4.4 GHz 4,400 MHz 4,400,000 kHz	65 W 65,000 mW 0.0872 hp 0.065 kW	DDR4-3200
Count: 83

Bibliography

AMD 'Tech Day', February 22, 2017
AMD 2017 Financial Analyst Day, May 16, 2017
AMD GCC 9 znver2 enablement patch
AMD 'Next Horizon', November 6, 2018
AMD. Lisa Su Keynote. May 26, 2019
AMD 'Next Horizon Gaming' event at E3, June 10, 2019

@@ Line 105: / Line 105: @@
 ** Higher [[IPC]] (AMD self-reported up to 15% IPC)
 ** Front-end
-*** Improved [[branch prediction unit]] with L2 TAGE-type predictor (perceptron is kept as L1)
+*** Improved [[branch prediction unit]]
-**** Larger BTBs
+**** Improved prefetcher
-***** L1 BTB has 512 entries (was 256)
-***** L2 BTB has 7168 or 7K entries (was 4096 or 4K)
-***** Indirect target array (ITA) has 1024 entries (was 512)
-**** Target address mispredict rate is claimed to be 30% lower
-**** Improved L1I prefetcher
 *** Improved µOP cache tags
 *** Improved µOP cache
-**** µOP cache has 4096 (4K) entries, up from 2048 (2K)
+**** Larger µOP cache (4096 entries, up from 2048)
-**** Improved instruction fusion
-**** Improved effective throughput
 *** Increased dispatch bandwidth
 ** Back-end
-<!-- *** Increased retire bandwidth (??-wide, up from 8-wide) -->
+*** Increased retire bandwidth (??-wide, up from 8-wide)
-*** Larger Reorder Buffer (224, up from 192)
 *** FPU
 **** 2x wider datapath (256-bit, up from 128-bit)
 **** 2x wider EUs (256-bit FMAs, up from 128-bit FMAs)
+**** 2x wider LSU (2x256-bit L/S, up from 128-bit)
 **** Improved mul latency (3 cycles, down from 4)
 *** Integer
@@ Line 129: / Line 122: @@
 **** Additional AGU (3, up from 2)
 **** Larger scheduler (4x16 ALU + 1x28 AGU, up from 4x14 ALU + 2x14 AGU
-**** Improved SMT scheduling fairness
+**** Larger Reorder Buffer (224, up from 192)
-**** Watermarked ALU tokens are added to manage spinlocks (synchronizations with memory locks)
 ** Memory subsystem
-*** 0.5x L1I cache (32 KiB, down from 64 KiB)
+*** 0.5x L1 instruction cache (32 KiB, down from 64 KiB)
-*** 8-way L1I associativity (up from 4-way)
+*** 8-way associativity (from 4-way)
-*** 2x wider LSU and L1D ports (256-bit loads and stores, up from 128-bit)
+*** 1.33 larger L2 DTLB (2048-entry, up from 1536)
-*** 33% larger L2 DTLB (2048-entry, up from 1536), that now includes 1G pages and has less latency
 *** 48 entry store queue (was 44)
-*** Improved L1D and L2 prefetch throttling
-*** Improved L1D write-combining for multiple streams
 * {{amd|CCX}}
 ** 2x L3 cache slice (16 MiB, up from 8 MiB)

codename	Zen 2 +
core count	4 +, 6 +, 8 +, 12 +, 16 +, 24 +, 32 + and 64 +
designer	AMD +
first launched	July 2019 +
full page name	amd/microarchitectures/zen 2 +
instance of	microarchitecture +
instruction set architecture	x86-64 +
manufacturer	GlobalFoundries + and TSMC +
microarchitecture type	CPU +
name	Zen 2 +
pipeline stages	19 +

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Revision as of 22:26, 20 June 2019

Contents

History

Codenames

Process technology

Compiler support

Architecture

Key changes from Zen+

New instructions

Block Diagram

Individual Core

Memory Hierarchy

Core

Front End

Execution Engine

Floating Point

Rome

All Zen 2 chips

Bibliography

See Also