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Die
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IBM Power9 die.
A waffle pack with 36 dies.

A die is the actual bare IC chip and is the final product of the fabrication process. It is the individual chip made following the singulation of a wafer. Dies typically undergo packaging before being sold to the customer as a final product.

Overview[edit]

The die is the final product of the fabrication process. A fully processed wafer will under singulation following probing. Depending on the application, the die may be shipped to an assembly/packaging plant where it will undergo encapsulation, producing the final chip that ships to customers.

Known good die[edit]

Main article: Known Good Die (KGD)

A known good die is a special type of bare die that underwent additional testing and screening post-singulation. KGD testing ensures the die meets the required specification prior to getting packaged. KGDs are especially important in multi-chip packages where multiple dies in a single package must function correctly to produce the required product.

Die size[edit]

Main article: die size

Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single wafer, the die size is a strong indicator of cost.

Select Large Dies
GPU Server Desktop Mobile
  • 826 mm² (GA100)
  • 815 mm² (GV100)
  • 754 mm² (TU102)
  • 610 mm² (GP100)
  • 601 mm² (GM200)
  • 596 mm² (Fiji)
  • 576 mm² (GT200)
  • 56 mm²1 (GK110)
  • 545 mm² (TU104)
  • 510 mm² (Vega 10)
  • 484 mm² (G80)
  • 471 mm² (GP102)
  • 445 mm² (TU106)
  • 8x 74 mm² + 1x 416 mm² (Rome)
  • 4x 213 mm² (Naples)
  • 720 mm² (Knights Corner)
  • 694 mm² (SKL LCC)
  • 693 mm² (Power9)
  • 662 mm² (HSW HCC)
  • 649 mm² (Power8)
  • 637 mm² (SPARC64 X)
  • 600 mm² (SPARC64 X+)
  • 567 mm² (Power7)
  • 513 mm² (SPARC64 VIIIfx)
  • 492 mm² (HSW MCC)
  • 485 mm² (SKL LCC)
  • 456 mm² (BDW HCC)
  • 444 mm² (SPARC64 VII)
  • 421 mm² (SPARC64 VI)
  • 412 mm² (Power4)
  • 389 mm² (Power5)
  • 380 mm² (SPARC64 V)
  • 362 mm² (Power8 6C)
  • 354 mm² (HSW LCC)
  • 341 mm² (Power6)
  • 325 mm² (SKL LCC)
  • 306 mm² (BDW MCC)
  • 270 mm² (Power3)
  • 246 mm² (BDW LCC)
  • 163 mm² (A5X)
  • 147 mm² (A9X)
  • 128 mm² (A8X)
  • 125 mm² (A10)
  • 123 mm² (A6X)
  • 122 mm² (A12X)
  • 122 mm² (A12)
  • 122 mm² (A5)
  • 104 mm² (A9)
  • 102 mm² (A7)
  • 96 mm² (A10X)
  • 95 mm² (A6)
  • 89 mm² (A8)
  • 88 mm² (A11)
  • 53 mm² (A4)

This list is incomplete; you can help by expanding it.

See also[edit]