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Difference between revisions of "2019"

 
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* January 7: Huawei unveils HiSilicon's [[Kunpeng 920]] high-performance [[ARM]] server chip
 
* January 7: Huawei unveils HiSilicon's [[Kunpeng 920]] high-performance [[ARM]] server chip
 
* February 20: [[Arm]] introduces the [[Neoverse E1]] and [[Neoverse N1]] server platforms
 
* February 20: [[Arm]] introduces the [[Neoverse E1]] and [[Neoverse N1]] server platforms
* April 16: Intel exists the modem market and the development of their 5G modem
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* April 2: [[Intel]] introduces {{intel|Cascade Lake|l=arch}} servers
 +
* April 16: Intel exits the modem market and the development of their 5G modem
 
* April 16: AMD introduces ultra-low power embedded Ryzen, codename {{amd|Banded Kestrel|l=core}}
 
* April 16: AMD introduces ultra-low power embedded Ryzen, codename {{amd|Banded Kestrel|l=core}}
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* May 7: DoE announces {{sc|Frontier}} contract has been awarded to [[Cray]] and [[AMD]].
 +
* September 10: [[Apple]] announces the {{apple|ax|A13}} Bionic.
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* September 12: [[IBM]] introduces the {{ibm|z15|l=arch}}
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* October 8: Arm announces {{armh|Matterhorn|l=arch}} with {{arm|MatMUL}} extension.
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* October 14: {{sc|ARCHER 2}} is announced
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* October 24: Intel unveils the {{intel|Tremont|l=arch}}
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* November 12: Intel launches the [[Nervana]] {{nervana|NNP}} family of [[neural processors]]

Latest revision as of 10:05, 1 February 2020

2019
Unix Time1546300800 - 1577836799
Years

In 2019: