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{{hisilicon title|Hi16xx}}
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{{hisilicon title|Kunpeng (Hi16xx)}}
 
{{ic family
 
{{ic family
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| title            = Hi16xx
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| title            = Kunpeng
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| image            =  
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| image            = hi1616 (front).png
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| caption          =  
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| caption          = Hi1616 Chip
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| no image          = Yes
 
 
| developer        = HiSilicon
 
| developer        = HiSilicon
 
| developer 2      = ARM Holdings
 
| developer 2      = ARM Holdings
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| socket 2          =  
 
| socket 2          =  
 
}}
 
}}
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'''Hi16xx''' is a series of {{arch|64}} [[ARM]] server SoCs designed for [[Huawei]] line of enterprise ARM servers.
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'''Kunpeng''' ('''Hi16xx''') is a family of {{arch|64}} [[ARM]] multi-core server SoCs designed for [[Huawei]] line of enterprise ARM servers.
  
 
== Overview ==
 
== Overview ==
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Hi16xx is a series of {{arch|64}} [[ARM]] server microprocessors designed by [[Huawei]]. First introduced in 2015, those processors are geared towards highly-threaded or high-throughput applications. Those processors are only found in the HiSilicon evaluation development boards and in a few limited series of Huawei servers.
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[[File:kunpeng roadmap (2019).jpeg|right|thumb|Roadmap]]
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Kunpeng, also known as Hi16xx, is a series of {{arch|64}} [[ARM]] server microprocessors designed by [[Huawei]]. First introduced in 2015, those processors are geared towards highly-threaded or high-throughput applications. Those processors were only found in the HiSilicon evaluation development boards and in a few limited series of Huawei servers. Huawei expanded their server offerings in 2018 and 2019 with the TaiShan line of servers. In early 2019, with the introduction of the 920 series, Huawei rebranded the series as the Kunpeng.
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=== Naming scheme ===
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:[[File:huawei kunpeng naming scheme.svg|600px]]
  
 
== Models ==
 
== Models ==
 +
=== Older models ===
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Older models were based on [[Arm's]] mobile [[Cortex]] cores. Those models range from [[16 cores|16]] to [[32 cores]] and offer up to four memory channels.
 
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{{#ask: [[Category:microprocessor models by hisilicon]] [[family::Hi16xx]]
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{{#ask: [[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[first launched::< 2018]]
 
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{{comp table count|ask=[[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[first launched::< 2018]]}}
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=== 920 Series ===
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{{see also|hisilicon/microarchitectures/taishan v110|l1=Taishan v110 microarchitecture}}
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[[File:hi1620 exhibit sign.jpg|right|thumb|Hi1620 on exhibit.]]
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In late 2018, Huawei announced the Kunpeng 920 series, also known as the Hi1620. Manufactured on [[TSMC]]'s [[7 nm process]], those processors are based on the company's custom-designed {{hisilicon|Taishan v110|l=arch}} ARMv 8.2 cores operating at up to 2.6 GHz. All models support up to eight channels of DDR4 memory and up to four-way SMP.
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* '''Proc:''' [[7 nm process]]
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* '''ISA:''' [[ARMv8.2]]
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* '''TDP:''' 100 W - 200 W
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* '''Mem:''' Octa-channel DDR4-2933 memory
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* '''I/O:''' x40 PCIe Gen 4 with [[CCIX]] support, 2x 100GbE, RoCEv2, 4x USB 3.0, x16 SAS 3.0, 2x SATA 3.0
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{{comp table start}}
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<table class="comptable sortable tc4">
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{{comp table header|main|6:List of Hi1620 Processors}}
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{{comp table header|cols|Launched|Cores|Arch|%Frequency|L3|TDP}}
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{{#ask: [[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[series::920]]
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|?full page name
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|?model number
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|?first launched
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|?core count
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|?base frequency#GHz
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|?l3$ size
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{{comp table count|ask=[[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[series::920]]}}
 
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=== 930 Series ===
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[[File:hislicon kunpeng roadmap to 930.png|thumb|right|Kunpeng 930 Roadmap]]
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Next-generation SoCs are the Hi1630 which are branded as Kunpeng 930 series. Those chips are expected to feature a higher-performance core with higher frequencies, simultaneous multithreading support, and Arm’s {{arm|Scalable Vector Extension}} (SVE) extension. Those chips will are also planned to move to DDR5 memory.
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=== 950 Series ===
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The Kunpeng 950 series will be the follow-up to the 930 and are planned for the 2023 timeframe.
  
 
== See also ==
 
== See also ==

Latest revision as of 04:07, 13 October 2019

Kunpeng
hi1616 (front).png
Hi1616 Chip
Developer HiSilicon, ARM Holdings
Manufacturer TSMC
Type System on chips
Introduction 2014 (announced)
ISA ARM
Word size 64 bit
8 octets
16 nibbles
Technology CMOS

Kunpeng (Hi16xx) is a family of 64-bit ARM multi-core server SoCs designed for Huawei line of enterprise ARM servers.

Overview[edit]

Roadmap

Kunpeng, also known as Hi16xx, is a series of 64-bit ARM server microprocessors designed by Huawei. First introduced in 2015, those processors are geared towards highly-threaded or high-throughput applications. Those processors were only found in the HiSilicon evaluation development boards and in a few limited series of Huawei servers. Huawei expanded their server offerings in 2018 and 2019 with the TaiShan line of servers. In early 2019, with the introduction of the 920 series, Huawei rebranded the series as the Kunpeng.

Naming scheme[edit]

huawei kunpeng naming scheme.svg

Models[edit]

Older models[edit]

Older models were based on Arm's mobile Cortex cores. Those models range from 16 to 32 cores and offer up to four memory channels.

 List of Older Hi16xx Processors
 Main processor
ModelLaunchedCoresArchFrequencyL3
Hi1610201516Cortex-A572.1 GHz
2,100 MHz
2,100,000 kHz
16 MiB
16,384 KiB
16,777,216 B
0.0156 GiB
Hi16124 June 201632Cortex-A572.1 GHz
2,100 MHz
2,100,000 kHz
32 MiB
32,768 KiB
33,554,432 B
0.0313 GiB
Hi1616August 201732Cortex-A722.4 GHz
2,400 MHz
2,400,000 kHz
32 MiB
32,768 KiB
33,554,432 B
0.0313 GiB
Count: 3

920 Series[edit]

See also: Taishan v110 microarchitecture
Hi1620 on exhibit.

In late 2018, Huawei announced the Kunpeng 920 series, also known as the Hi1620. Manufactured on TSMC's 7 nm process, those processors are based on the company's custom-designed Taishan v110 ARMv 8.2 cores operating at up to 2.6 GHz. All models support up to eight channels of DDR4 memory and up to four-way SMP.

  • Proc: 7 nm process
  • ISA: ARMv8.2
  • TDP: 100 W - 200 W
  • Mem: Octa-channel DDR4-2933 memory
  • I/O: x40 PCIe Gen 4 with CCIX support, 2x 100GbE, RoCEv2, 4x USB 3.0, x16 SAS 3.0, 2x SATA 3.0
 List of Hi1620 Processors
ModelLaunchedCoresArchFrequencyL3TDP
920-322626 April 201932TaiShan v1102.6 GHz
2,600 MHz
2,600,000 kHz
32 MiB
32,768 KiB
33,554,432 B
0.0313 GiB
120 W
120,000 mW
0.161 hp
0.12 kW
920-482626 April 201948TaiShan v1102.6 GHz
2,600 MHz
2,600,000 kHz
48 MiB
49,152 KiB
50,331,648 B
0.0469 GiB
158 W
158,000 mW
0.212 hp
0.158 kW
920-64267 January 201964TaiShan v1102.6 GHz
2,600 MHz
2,600,000 kHz
64 MiB
65,536 KiB
67,108,864 B
0.0625 GiB
195 W
195,000 mW
0.261 hp
0.195 kW
Count: 3

930 Series[edit]

Kunpeng 930 Roadmap

Next-generation SoCs are the Hi1630 which are branded as Kunpeng 930 series. Those chips are expected to feature a higher-performance core with higher frequencies, simultaneous multithreading support, and Arm’s Scalable Vector Extension (SVE) extension. Those chips will are also planned to move to DDR5 memory.

950 Series[edit]

The Kunpeng 950 series will be the follow-up to the 930 and are planned for the 2023 timeframe.

See also[edit]

Retrieved from "https://en.wikichip.org/w/index.php?title=hisilicon/kunpeng&oldid=93939"
Facts about "Kunpeng (Hi16xx) - HiSilicon"
RDF feed
designerHiSilicon + and ARM Holdings +
first announced2014 +
full page namehisilicon/kunpeng +
instance ofsystem on a chip family +
instruction set architectureARM +
main designerHiSilicon +
manufacturerTSMC +
nameHi16xx +
technologyCMOS +
word size64 bit (8 octets, 16 nibbles) +