Semiconductor & Computer Engineering
From WikiChip
Difference between revisions of "2019"
| Line 12: | Line 12: | ||
* May 7: DoE announces {{sc|Frontier}} contract has been awarded to [[Cray]] and [[AMD]]. | * May 7: DoE announces {{sc|Frontier}} contract has been awarded to [[Cray]] and [[AMD]]. | ||
* September 12: [[IBM]] introduces the {{ibm|z15|l=arch}} | * September 12: [[IBM]] introduces the {{ibm|z15|l=arch}} | ||
| + | * October 8: Arm announces {{armh|Matterhorn|l=arch}} with {{arm|MatMUL}} extension. | ||
| + | * October 24: Intel unveils the {{intel|Tremont|l=arch}} | ||
Revision as of 19:14, 27 October 2019
| 2019 | |
|---|---|
| Unix Time | 1546300800 - 1577836799 |
| Years | |
In 2019:
- January 3: Arm announces the Mali-C52 and Mali-C32 ISPs.
- January 6: AMD introduces 2nd generation Zen+ mobile processor, codename Picasso
- January 7: Intel unveils Lakefield SoC, Snow Ridge, and Ice Lake (Client)
- January 7: Huawei unveils HiSilicon's Kunpeng 920 high-performance ARM server chip
- February 20: Arm introduces the Neoverse E1 and Neoverse N1 server platforms
- April 2: Intel introduces Cascade Lake servers
- April 16: Intel exists the modem market and the development of their 5G modem
- April 16: AMD introduces ultra-low power embedded Ryzen, codename Banded Kestrel
- May 7: DoE announces Frontier contract has been awarded to Cray and AMD.
- September 12: IBM introduces the z15
- October 8: Arm announces Matterhorn with MatMUL extension.
- October 24: Intel unveils the Tremont