Page title matches

• semiconductor manufacturing process
  {{title|Semiconductor Manufacturing Process}} ...he series of steps used to create [[integrated circuits]]. The fabrication process comprises a series of [[chemical]]- and [[lithography]]-related steps where
  1 KB (173 words) - 10:26, 1 February 2019
• semiconductor fabrication process
  49 bytes (4 words) - 23:13, 31 January 2019

Page text matches

• WikiChip
  ...">'''WikiChip''' is the preeminent resource for computer architectures and semiconductor logic engineering, covering historical and contemporary electronic systems, <imagemap>Image:latest process.svg
  4 KB (394 words) - 12:00, 13 February 2020
• intel/mcs-4/4004
  |process=10 µm ...ww.intel.com/Assets/PDF/DataSheet/4004_datasheet.pdf 4004 Datasheet]</ref> process silicon-gate, capable of executing 92,000 instructions per second. The chip
  5 KB (748 words) - 21:37, 21 November 2021
• microprocessor
  [[File:IPO (input-process-output).svg|400px|right]] ...oarchitecture]] of the incorporated [[central processing unit|CPU]], the [[semiconductor]] technology involved, and the properties of the overall system. Some commo
  8 KB (1,149 words) - 00:41, 16 September 2019
• 10 µm lithography process
  ...e and drain (Poly-SI channel implant). The typical [[wafer size]] for this process at companies such as [[Fairchild]] and [[TI]] was 2-inch (51 mm). |Process Name
  2 KB (177 words) - 23:04, 20 May 2018
• 6 µm lithography process
  ...y used by some semiconductor companies during the early to mid 1970s. This process was later superseded by [[5 µm]], [[3 µm]], and [[2 µm]] processes. |Process Name
  1 KB (119 words) - 23:04, 20 May 2018
• 3 µm lithography process
  ...thography process''' was the semiconductor process technology used by some semiconductor companies during the mid 1970s to the mid 1980s. | process 1 fab = [[Hitachi]]
  3 KB (314 words) - 23:04, 20 May 2018
• 2 µm lithography process
  ...some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replaced by [[1.5 µm]], [[1.3 µm]], and [[1.2 µm]] processes. {{#invoke:process nodes
  8 KB (969 words) - 12:31, 22 February 2019
• 1.5 µm lithography process
  ...ngth of roughly 1.5 µm between the source and drain. By the late 80s this process was replaced by [[1.3 µm]], [[1.2 µm]], and [[1 µm]] processes. |Process Name
  3 KB (332 words) - 23:04, 20 May 2018
• 1 µm lithography process
  ...aphy process''' was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990 |Process Name
  1 KB (166 words) - 23:04, 20 May 2018
• 800 nm lithography process
  ...m process"''' refers to a process which has a gate length of 0.8 µm. This process was later replaced by [[650 nm]], [[600 nm]], and [[500 nm]] processes. |Process Name
  3 KB (272 words) - 23:04, 20 May 2018
• novix/nc4016
  |process=3 μm In 1988, the NC4016 design was licensed and improved by Harris Semiconductor which later rebranded the chip as the [[RTX2000]], a radiation hardened ver
  2 KB (257 words) - 16:31, 13 December 2017
• 8 µm lithography process
  ...ess at companies such as [[Fairchild]] and [[TI]] was 2-inch (51 mm). This process was later superseded by [[6 µm]], [[5 µm]], and [[3 µm]] processes. The 8-micron process was used by Intel for many of their memory chips in the early 1970s such as
  5 KB (632 words) - 23:04, 20 May 2018
• fairchild/pps-25
  | developer = Fairchild Semiconductor | manufacturer = Fairchild Semiconductor
  2 KB (291 words) - 23:48, 10 July 2017
• fairchild/f9450
  The '''Fairchild F9450''' is a high-performance 16-bit [[bipolar process|bipolar]] [[microprocessor]] developed by [[Fairchild]] in 1985. The F9450, [[Category:Fairchild Semiconductor microprocessors]]
  2 KB (253 words) - 16:27, 20 December 2015
• mosfet
  {{title|MOSFET - Metal-Oxide-Semiconductor Field-Effect-Transistor}}[[File:Electronic component mosfets.jpg|thumb|[[di ...ly the [[controlling gate|gate]] was made from metal, the name metal-oxide semiconductor (MOS) got stuck. Today, the gates are made of polycrystalline sillicon alth
  8 KB (1,362 words) - 23:38, 17 November 2015
• intel
  '''Intel Corporation''' is an American [[semiconductor]] company. While most notably known for their development of [[microprocess * {{\\|Process-Architecture-Optimization}} (PAO)
  9 KB (1,150 words) - 00:03, 2 October 2022
• national semiconductor/cops i
  | developer = National Semiconductor | manufacturer = National Semiconductor
  2 KB (274 words) - 18:29, 5 February 2016
• national semiconductor/cops ii
  | developer = National Semiconductor | manufacturer = National Semiconductor
  6 KB (685 words) - 22:49, 5 February 2016
• fairchild/9400
  | developer = Fairchild Semiconductor | manufacturer = Fairchild Semiconductor
  2 KB (223 words) - 23:04, 5 October 2017
• fairchild/4700
  | developer = Fairchild Semiconductor | manufacturer = Fairchild Semiconductor
  3 KB (283 words) - 17:18, 12 December 2016

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