• c/complex.h
  ...complex arithmetic implementation conforms to Annex G of the C standard ([[IEEE 754|IEC 60559 standard]]).
  13 KB (1,987 words) - 20:46, 7 January 2015
• arduino
  ...]].<ref>[http://spectrum.ieee.org/geek-life/hands-on/the-making-of-arduino IEEE Spectrum], accessed on December 24, 2013</ref> Unfortunately their dwindlin
  3 KB (520 words) - 16:56, 19 December 2015
• 3 µm lithography process
  ** Minato, O., et al. "A Hi-CMOSII 8Kx8 bit static RAM." IEEE Journal of Solid-State Circuits 17.5 (1982): 793-798. ...l. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.
  3 KB (314 words) - 23:04, 20 May 2018
• 2 µm lithography process
  * Minato, O., et al. "A Hi-CMOSII 8Kx8 bit static RAM." IEEE Journal of Solid-State Circuits 17.5 (1982): 793-798. ...l. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.
  8 KB (969 words) - 12:31, 22 February 2019
• 8 µm lithography process
  ...V. Leo. "One-device cells for dynamic random-access memories: A tutorial." IEEE Transactions on Electron Devices 26.6 (1979): 839-852.</ref>.
  5 KB (632 words) - 23:04, 20 May 2018
• inverter
  library ieee; use ieee.std_logic_1164.all;
  6 KB (983 words) - 04:50, 8 November 2015
• logic gate
  * [[ANSI/IEEE Std 91-1984]] (MIL/ANSI)
  5 KB (838 words) - 11:19, 10 February 2020
• 28 nm lithography process
  ...using dual/tripe gate oxide process." VLSI Technology, 2009 Symposium on. IEEE, 2009. ...ow power mobile applications." VLSI Technology (VLSIT), 2012 Symposium on. IEEE, 2012.
  6 KB (711 words) - 17:01, 26 March 2019
• 32 nm lithography process
  ...ack end with eleven levels of copper." VLSI Technology, 2009 Symposium on. IEEE, 2009. ...t applications." Electron Devices Meeting (IEDM), 2009 IEEE International. IEEE, 2009.
  10 KB (1,090 words) - 19:14, 8 July 2021
• 14 nm lithography process
  ...SRAM cell size." Electron Devices Meeting (IEDM), 2014 IEEE International. IEEE, 2014. ...metallization." Electron Devices Meeting (IEDM), 2014 IEEE International. IEEE, 2014.
  17 KB (2,243 words) - 19:32, 25 May 2023
• 45 nm lithography process
  ...packaging." Electron Devices Meeting, 2007. IEDM 2007. IEEE International. IEEE, 2007.
  5 KB (602 words) - 05:51, 20 July 2018
• intel/microarchitectures/bonnell
  ...IA processor for mobile internet devices in 45 nm high-k metal gate CMOS." IEEE Journal of Solid-State Circuits 44.1 (2009): 73-82. ...ference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International. IEEE, 2008.
  38 KB (5,468 words) - 20:29, 23 May 2019
• intel/microarchitectures/haswell (client)
  ...arlund, Per, et al. "Haswell: The fourth-generation intel core processor." IEEE Micro 34.2 (2014): 6-20.
  27 KB (3,750 words) - 06:57, 18 November 2023
• 16 nm lithography process
  ...28 Mebibit [[SRAM]] wafer from their 16 nm HKMG FinFET process at the 2014 IEEE ISSCC. TSMC followed their 16FF process by the 16FF+ which provided roughly ...FinFET Technology With Write-Assist Circuitry for Low-VMIN Applications." IEEE Journal of Solid-State Circuits 50.1 (2015): 170-177.
  4 KB (580 words) - 17:00, 26 March 2019
• 20 nm lithography process
  ...their 112 Mebibit [[SRAM]] wafer from their 20 nm HKMG process at the 2013 IEEE ISSCC. ...ts Conference Digest of Technical Papers (ISSCC), 2013 IEEE International. IEEE, 2013.
  4 KB (483 words) - 23:04, 20 May 2018
• intel/microarchitectures/sandy bridge (client)
  ...State Circuits Conference]]. A copy of the paper can be [http://ieeexplore.ieee.org/abstract/document/5746311/ found here]. ...ily: Intel® Core i7, i5 and i3." Hot Chips 23 Symposium (HCS), 2011 IEEE. IEEE, 2011.
  84 KB (13,075 words) - 00:54, 29 December 2020
• intel/microarchitectures/p6
  ...its Conference, 1998. Digest of Technical Papers. 1998 IEEE International. IEEE, 1998.
  3 KB (325 words) - 21:34, 22 February 2020
• intel/microarchitectures/skylake (client)
  ...rmance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
  79 KB (11,922 words) - 06:46, 11 November 2022
• intel/microarchitectures/kaby lake
  * IEEE Hot Chips 30 Symposium (HCS) 2018.
  38 KB (5,431 words) - 10:41, 8 April 2024
• 130 nm lithography process
  ...Electron Devices Meeting, 2000. IEDM'00. Technical Digest. International. IEEE, 2000.
  5 KB (500 words) - 16:02, 13 May 2020

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