• intel/microarchitectures/bonnell
  ...IA processor for mobile internet devices in 45 nm high-k metal gate CMOS." IEEE Journal of Solid-State Circuits 44.1 (2009): 73-82. ...ference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International. IEEE, 2008.
  38 KB (5,468 words) - 20:29, 23 May 2019
• 16 nm lithography process
  ...bibit [[SRAM]] wafer from their 16 nm HKMG FinFET process at the 2014 IEEE ISSCC. TSMC followed their 16FF process by the 16FF+ which provided roughly 10-15 ...FinFET Technology With Write-Assist Circuitry for Low-VMIN Applications." IEEE Journal of Solid-State Circuits 50.1 (2015): 170-177.
  4 KB (580 words) - 17:00, 26 March 2019
• 20 nm lithography process
  ...112 Mebibit [[SRAM]] wafer from their 20 nm HKMG process at the 2013 IEEE ISSCC. ...ts Conference Digest of Technical Papers (ISSCC), 2013 IEEE International. IEEE, 2013.
  4 KB (483 words) - 23:04, 20 May 2018
• intel/microarchitectures/sandy bridge (client)
  ...ments.png|right|300px|thumb|The graph which was provided by Intel during [[ISSCC]] demonstrates the [[Vcc]] min reduction after those technique have been ap ...State Circuits Conference]]. A copy of the paper can be [http://ieeexplore.ieee.org/abstract/document/5746311/ found here].
  84 KB (13,075 words) - 00:54, 29 December 2020
• intel/microarchitectures/skylake (client)
  ...rmance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
  79 KB (11,922 words) - 06:46, 11 November 2022
• 10 nm lithography process
  '''^*''' - Value reported from IEEE ISSCC/IEDM/VLSI Conference. * [https://fuse.wikichip.org/news/525/iedm-2017-isscc-2018-intels-10nm-switching-to-cobalt-interconnects/ In-depth analysis for I
  14 KB (1,903 words) - 06:52, 17 February 2023
• 2016
  * February 5-9: [[IEEE]] [[International Solid-State Circuits Conference]] (ISSCC) * December 3-7: [[IEEE]] [[International Electron Devices Meeting]] (IEDM)
  5 KB (593 words) - 01:28, 5 August 2018
• amd/microarchitectures/zen
  * IEEE Hot Chips 28 Symposium (HCS) 2016 * IEEE ISSCC 2017
  79 KB (12,095 words) - 15:27, 9 June 2023
• amd/microarchitectures/zen 2
  ...sses per core from L2 to L3, 96 from L3 to memory.<!-- EPYC Tech Day 2017, ISSCC 2018. --> ...7nm Energy-Efficient High-Performance x86-64 Microprocessor Core</i>. 2020 IEEE International Solid-State Circuits Conference. pp. 42-44. doi:[https://doi.
  57 KB (8,701 words) - 22:11, 9 October 2022
• arm holdings/microarchitectures/cortex-a53
  ...cessor." Solid-State Circuits Conference-(ISSCC), 2015 IEEE International. IEEE, 2015 ...rmance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
  6 KB (758 words) - 13:01, 6 March 2022
• mediatek/helio/mt6797
  ...rmance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
  6 KB (713 words) - 21:16, 2 May 2021
• mediatek/helio/mt6799
  ...rmance." Solid-State Circuits Conference (ISSCC), 2017 IEEE International. IEEE, 2017.
  4 KB (549 words) - 16:22, 29 December 2018
• 2017
  * February 5-9: IEEE international Solid-State Circuits Conference (ISSCC) 2017 * December 2-6: IEEE IEDM 2017
  8 KB (999 words) - 11:04, 3 January 2019
• dec/microarchitectures/alpha 21164
  ...ce, 1995. Digest of Technical Papers. 41st ISSCC, 1995 IEEE International. IEEE, 1995.
  2 KB (206 words) - 11:52, 27 November 2020
• amd/infinity fabric
  ...p.org/news/1064/isscc-2018-amds-zeppelin-multi-chip-routing-and-packaging/ ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging], WikiChip Fuse * IEEE ISSCC 2018
  8 KB (1,271 words) - 21:50, 18 August 2020
• intel/microarchitectures/skylake (server)
  * IEEE Hot Chips (HC28) 2017. * IEEE ISSCC 2018
  52 KB (7,651 words) - 00:59, 6 July 2022
• renesas/r-car/h3
  ...bility." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016. ...m FinFET Heterogeneous Nona-Core SoC Supporting ISO26262 ASIL B Standard." IEEE Journal of Solid-State Circuits 52.1 (2017): 77-88.
  4 KB (571 words) - 15:43, 29 December 2018
• renesas/r-car/h3 (sip)
  ...bility." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
  4 KB (495 words) - 16:32, 13 December 2017
• microsoft/scorpio engine
  ...e:ISSCC2021 3.1 XSX Paternoster slides.pdf|date=2021-02-15|conference=IEEE ISSCC 2021|session=3.1}}
  15 KB (2,390 words) - 02:54, 17 May 2023
• intel/mesh interconnect architecture
  * IEEE Hot Chips 27 Symposium (HCS) 2015. * IEEE ISSCC 2018
  7 KB (1,071 words) - 12:59, 2 November 2021

View (previous 20 | next 20) (20 | 50 | 100 | 250 | 500)