Page title matches

• ASIC Design Center of Huawei Technologies Co., Ltd.
  23 bytes (2 words) - 02:02, 5 September 2017
• ASIC Design Center of Huawei Technologies Co
  23 bytes (2 words) - 02:02, 5 September 2017
• ASIC Design Center of Huawei Technologies
  23 bytes (2 words) - 02:02, 5 September 2017
• Huawei Kirin
  29 bytes (3 words) - 21:13, 6 September 2017
• huawei kirin
  29 bytes (3 words) - 21:13, 6 September 2017

Page text matches

• 7 nm lithography process
  * HiSilicon (Huawei)
  13 KB (1,941 words) - 02:40, 5 November 2022
• qualcomm/msm6xxx/msm6250
  * [[used by::Huawei U636]]
  5 KB (489 words) - 16:49, 2 February 2021
• qualcomm/msm6xxx/msm6280
  * [[used by::Huawei E226]]
  5 KB (500 words) - 18:03, 8 February 2023
• china
  * [[Huawei]]
  770 bytes (78 words) - 12:16, 16 December 2018
• intel/xeon platinum/8180
  ...0:02-0400|chip_count=2|core_count=56|copies_count=112|vendor=Huawei|system=Huawei 2288H V5 (Intel Xeon Platinum 8180)|SPECrate2017_int_base=302|SPECrate2017_ ...9:13-0400|chip_count=2|core_count=56|copies_count=112|vendor=Huawei|system=Huawei 2288H V5 (Intel Xeon Platinum 8180)|SPECrate2017_fp_base=252|SPECrate2017_f
  24 KB (3,386 words) - 02:38, 29 December 2019
• arm holdings/microarchitectures/cortex-a55
  * [[Huawei]]
  4 KB (603 words) - 04:23, 27 April 2023
• hisilicon
  ...Co., Ltd.''', HiSilicon became an independent, wholly owned subsidiary of Huawei in 2004. HiSilicon is one of China's largest integrated circuit design firm
  1,000 bytes (112 words) - 09:13, 11 March 2019
• hisilicon/k3
  ...ily. Most of those chips were used heavily, although not exclusively, by [[Huawei]] own consumer electronics. K3 was HiSilicon's first series to directly tar
  2 KB (296 words) - 13:48, 6 September 2017
• hisilicon/k3/k3v2
  * [[used by::Huawei Ascend D1 Quad XL]] (T9510E) * [[used by::Huawei Ascend D2]] (D2‐6114 HW‐03E/U9701L)
  3 KB (467 words) - 04:41, 21 July 2018
• hisilicon/k3/k3v2e
  * [[used by::Huawei HN3-U01]] * [[used by::Huawei Ascend P6]] (P6-C00)
  2 KB (334 words) - 16:13, 13 December 2017
• hisilicon/kirin
  HiSilicon has always been the [[integrated circuit]] arm of [[Huawei]], developing various ICs and embedded [[microprocessors]] for their consum
  3 KB (316 words) - 06:18, 3 October 2023
• hisilicon/kirin/970
  * [[used by::Huawei Mate 10]] * [[used by::Huawei Mate 10 Pro]]
  6 KB (824 words) - 17:25, 1 January 2022
• neural processor
  * [[Huawei]]: Ascend
  5 KB (640 words) - 16:27, 26 September 2023
• 2019
  * January 7: Huawei unveils HiSilicon's [[Kunpeng 920]] high-performance [[ARM]] server chip
  1 KB (166 words) - 11:05, 1 February 2020
• hisilicon/kirin/980
  * [[used by::Huawei P30]] * [[used by::Huawei P30 Pro]]
  4 KB (600 words) - 22:53, 9 December 2022
• qualcomm/snapdragon 600/632
  * [[used by::Huawei Honor 8C]]
  3 KB (404 words) - 10:23, 2 April 2021
• mediatek/helio/mt6762m
  * [[used by::Huawei Y5 2019]]
  3 KB (359 words) - 00:19, 14 March 2023
• hisilicon/kirin/710
  * [[used by::Huawei nova 3i]] * [[used by::Huawei Mate 20 Lite]]
  2 KB (320 words) - 04:44, 18 August 2021
• hisilicon/kunpeng
  ...) is a family of {{arch|64}} [[ARM]] multi-core server SoCs designed for [[Huawei]] line of enterprise ARM servers. ...n line of servers. In early 2019, with the introduction of the 920 series, Huawei rebranded the series as the Kunpeng.
  5 KB (656 words) - 05:07, 13 October 2019
• hisilicon/kunpeng/hi1612
  * [[used by::Huawei Taishan 2180]]
  2 KB (282 words) - 20:49, 5 May 2019

View (previous 20 | next 20) (20 | 50 | 100 | 250 | 500)