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23 bytes (2 words) - 02:02, 5 September 2017
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23 bytes (2 words) - 02:02, 5 September 2017
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23 bytes (2 words) - 02:02, 5 September 2017
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29 bytes (3 words) - 21:13, 6 September 2017
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29 bytes (3 words) - 21:13, 6 September 2017
Page text matches
- * HiSilicon (Huawei)13 KB (1,941 words) - 02:40, 5 November 2022
- * [[used by::Huawei U636]]5 KB (489 words) - 16:49, 2 February 2021
- * [[used by::Huawei E226]]5 KB (500 words) - 18:03, 8 February 2023
- * [[Huawei]]770 bytes (78 words) - 12:16, 16 December 2018
- ...0:02-0400|chip_count=2|core_count=56|copies_count=112|vendor=Huawei|system=Huawei 2288H V5 (Intel Xeon Platinum 8180)|SPECrate2017_int_base=302|SPECrate2017_ ...9:13-0400|chip_count=2|core_count=56|copies_count=112|vendor=Huawei|system=Huawei 2288H V5 (Intel Xeon Platinum 8180)|SPECrate2017_fp_base=252|SPECrate2017_f24 KB (3,386 words) - 02:38, 29 December 2019
- * [[Huawei]]4 KB (603 words) - 04:23, 27 April 2023
- ...Co., Ltd.''', HiSilicon became an independent, wholly owned subsidiary of Huawei in 2004. HiSilicon is one of China's largest integrated circuit design firm1,000 bytes (112 words) - 09:13, 11 March 2019
- ...ily. Most of those chips were used heavily, although not exclusively, by [[Huawei]] own consumer electronics. K3 was HiSilicon's first series to directly tar2 KB (296 words) - 13:48, 6 September 2017
- * [[used by::Huawei Ascend D1 Quad XL]] (T9510E) * [[used by::Huawei Ascend D2]] (D2‐6114 HW‐03E/U9701L)3 KB (467 words) - 04:41, 21 July 2018
- * [[used by::Huawei HN3-U01]] * [[used by::Huawei Ascend P6]] (P6-C00)2 KB (334 words) - 16:13, 13 December 2017
- HiSilicon has always been the [[integrated circuit]] arm of [[Huawei]], developing various ICs and embedded [[microprocessors]] for their consum3 KB (316 words) - 06:18, 3 October 2023
- * [[used by::Huawei Mate 10]] * [[used by::Huawei Mate 10 Pro]]6 KB (824 words) - 17:25, 1 January 2022
- * [[Huawei]]: Ascend5 KB (640 words) - 16:27, 26 September 2023
- * January 7: Huawei unveils HiSilicon's [[Kunpeng 920]] high-performance [[ARM]] server chip1 KB (166 words) - 11:05, 1 February 2020
- * [[used by::Huawei P30]] * [[used by::Huawei P30 Pro]]4 KB (600 words) - 22:53, 9 December 2022
- * [[used by::Huawei Honor 8C]]3 KB (404 words) - 10:23, 2 April 2021
- * [[used by::Huawei Y5 2019]]3 KB (359 words) - 00:19, 14 March 2023
- * [[used by::Huawei nova 3i]] * [[used by::Huawei Mate 20 Lite]]2 KB (320 words) - 04:44, 18 August 2021
- ...) is a family of {{arch|64}} [[ARM]] multi-core server SoCs designed for [[Huawei]] line of enterprise ARM servers. ...n line of servers. In early 2019, with the introduction of the 920 series, Huawei rebranded the series as the Kunpeng.5 KB (656 words) - 05:07, 13 October 2019
- * [[used by::Huawei Taishan 2180]]2 KB (282 words) - 20:49, 5 May 2019