Kunpeng
Hi1616 Chip
Developer	HiSilicon, ARM Holdings
Manufacturer	TSMC
Type	System on chips
Introduction	2014 (announced)
ISA	ARM
Word size	64 bit 8 octets 16 nibbles
Technology	CMOS

Kunpeng (Hi16xx) is a family of 64-bit ARM multi-core server SoCs designed for Huawei line of enterprise ARM servers.

Overview

Roadmap

Kunpeng, also known as Hi16xx, is a series of 64-bit ARM server microprocessors designed by Huawei. First introduced in 2015, those processors are geared towards highly-threaded or high-throughput applications. Those processors were only found in the HiSilicon evaluation development boards and in a few limited series of Huawei servers. Huawei expanded their server offerings in 2018 and 2019 with the TaiShan line of servers. In early 2019, with the introduction of the 920 series, Huawei rebranded the series as the Kunpeng.

Naming scheme

Models

Older models

Older models were based on Arm's mobile Cortex cores. Those models range from 16 to 32 cores and offer up to four memory channels.

	List of Older Hi16xx Processors
	Main processor
Model	Launched	Cores	Arch	Frequency	L3
Hi1610	2015	16	Cortex-A57	2.1 GHz 2,100 MHz 2,100,000 kHz	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB
Hi1612	4 June 2016	32	Cortex-A57	2.1 GHz 2,100 MHz 2,100,000 kHz	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB
Hi1616	August 2017	32	Cortex-A72	2.4 GHz 2,400 MHz 2,400,000 kHz	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB
Count: 3

920 Series

See also: Taishan v110 microarchitecture

Hi1620 on exhibit.

In late 2018, Huawei announced the Kunpeng 920 series, also known as the Hi1620. Manufactured on TSMC's 7 nm process, those processors are based on the company's custom-designed Taishan v110 ARMv 8.2 cores operating at up to 2.6 GHz. All models support up to eight channels of DDR4 memory and up to four-way SMP.

• Proc: 7 nm process
• ISA: ARMv8.2
• TDP: 100 W - 200 W
• Mem: Octa-channel DDR4-2933 memory
• I/O: x40 PCIe Gen 4 with CCIX support, 2x 100GbE, RoCEv2, 4x USB 3.0, x16 SAS 3.0, 2x SATA 3.0

	List of Hi1620 Processors
Model	Launched	Cores	Arch	Frequency	L3	TDP
920-3226	26 April 2019	32	TaiShan v110	2.6 GHz 2,600 MHz 2,600,000 kHz	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	120 W 120,000 mW 0.161 hp 0.12 kW
920-4826	26 April 2019	48	TaiShan v110	2.6 GHz 2,600 MHz 2,600,000 kHz	48 MiB 49,152 KiB 50,331,648 B 0.0469 GiB	158 W 158,000 mW 0.212 hp 0.158 kW
920-6426	7 January 2019	64	TaiShan v110	2.6 GHz 2,600 MHz 2,600,000 kHz	64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB	195 W 195,000 mW 0.261 hp 0.195 kW
Count: 3

930 Series

Kunpeng 930 Roadmap

Next-generation SoCs are the Hi1630 which are branded as Kunpeng 930 series. Those chips are expected to feature a higher-performance core with higher frequencies, simultaneous multithreading support, and Arm’s Scalable Vector Extension (SVE) extension. Those chips will are also planned to move to DDR5 memory.

950 Series

The Kunpeng 950 series will be the follow-up to the 930 and are planned for the 2023 timeframe.

See also

• Cavium's ThunderX2
• Qualcomm's Centriq
• Intel's Xeon Scalable