Socket S1g4 - AMD

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	Socket S1g4
	General Info
Designer	AMD
Introduction	May 12, 2010 (launched)
Market	Mobile
Microarchitecture	K10
TDP	45 W 45,000 mW ; 0.0603 hp ; 0.045 kW ;
	Package
Name	OPGA-638
Type	Organic Micro Pin Grid Array
Contacts	638
Dimension	35.0 mm 3.5 cm ; 1.378 in ; × 35.0 mm 3.5 cm ; 1.378 in ;
Pitch	1.27 mm 0.05 in ;
	Socket
Name	Socket S1g4
Type	PGA

Socket S1g4 was the fourth and last socket for OPGA-638-packaged AMD mobile microprocessors with an integrated DDR2 and DDR3 memory controller, and the successor to Socket S1g3. Its counterparts for desktop processors are Socket AM3 and Socket AM3+, for servers Socket C32 and Socket G34. For the small form factor desktop, mobile and embedded market AMD developed package ASB2. Socket S1g4 was superseded by Socket FS1 supporting mobile processors with integrated graphics.

The main improvement of Socket S1g4 over S1g3 is support for DDR3 memory. As the number of CPU cores in the package grew to three and four, voltage regulators were integrated on the chip and support for two core power planes was dropped.

Socket S1g4 was used in AMD's "Danube" mobile platform. All processors for Socket S1g4, codename "Champlain", are members of AMD's Family 10h with CPU cores based on the K10 microarchitecture and were fabricated on a 45 nm SOI process.

All revisions of Socket S1 have the same dimensions, however processors for Socket S1g4 appear to be electrically incompatible with Socket S1g1 and vice versa. Processors for Socket S1g2 have a DDR2 memory controller and will not work in Socket S1g4. To which extent Socket S1g4 processors are compatible with Socket S1g2 and S1g3, in DDR2 mode and with a suitable BIOS, is unclear.

Chipsets

AMD 880M
AMD SB820 southbridge

Processors using Socket S1g4

AMD Phenom II Quad-Core Mobile
AMD Phenom II Triple-Core Mobile
AMD Phenom II Dual-Core Mobile
AMD Turion II Dual-Core Mobile
AMD Athlon II Dual-Core Mobile
AMD V-Series

	List of all Socket S1g4-based Processors
Model	Price	Process	Launched	µarch	Family	Core	C	T	Freq	Turbo	TDP
Count: 0

Package Diagram

No data available. Dimensions should be similar to those of the OPGA-638 package shown on the Socket S1g1 page.

Socket Outline

Socket S1 limits as specified in AMD Publ. #31839. Depicted is Foxconn Interconnect Technology Part No. PZ6382A-284S-01F. All dimensions in millimeters.

Pin Map

Differences between Socket S1 revisions

Pin	S1g1	S1g2/S1g3	S1g4	Description
R21	MA_ADD[0]	MA_ADD[10]	MA_ADD[10]	DRAM Column/Row Address
N21	MA_ADD[1]	MA_ADD[0]	MA_ADD[0]
M22	MA_ADD[3]	MA_ADD[4]	MA_ADD[4]
M24	MA_ADD[4]	MA_ADD[6]	MA_ADD[6]
M20	MA_ADD[5]	MA_ADD[1]	MA_ADD[1]
M19	MA_ADD[6]	MA_ADD[3]	MA_ADD[3]
L22	MA_ADD[8]	MA_ADD[11]	MA_ADD[11]
L19	MA_ADD[9]	MA_ADD[8]	MA_ADD[8]
R19	MA_ADD[10]	MA_RAS_L	MA_RAS_L
L20	MA_ADD[11]	MA_ADD[5]	MA_ADD[5]
K24	MA_ADD[12]	MA_ADD[14]	MA_ADD[14]
K20	MA_ADD[14]	MA_ADD[12]	MA_ADD[12]
T22	MA_BANK[0]	MA_CAS_L	MA_CAS_L	DRAM Bank Address / Column Address Strobe
R20	MA_BANK[1]	MA_BANK[0]	MA_BANK[0]
R23	RSVD	MA_BANK[1]	MA_BANK[1]
K22	MA_BANK[2]	MA_ADD[9]	MA_ADD[9]
U20	MA_CAS_L	MA1_CS_L[0]	MA1_CS_L[0]	DRAM Column Address Strobe / Chip Select
J21	MA_CKE[0]	MA_BANK[2]	MA_BANK[2]	DRAM Clock Enable / Bank Address
T20	MA_RAS_L	MA0_CS_L[0]	MA0_CS_L[0]	DRAM Row Address Strobe / Chip Select
U21	MA_WE_L	MA1_ODT[0]	MA1_ODT[0]	DRAM Write Enable / Enable Pin for On Die Termination
E16	MA0_CLK_H[1]	MA_CLK_H[1]	MA_CLK_H[1]	DRAM Differential Clock
F16	MA0_CLK_L[1]	MA_CLK_L[1]	MA_CLK_L[1]
P19	RSVD	MA_CLK_H[4]	MA_CLK_H[4]
P20	RSVD	MA_CLK_L[4]	MA_CLK_L[4]
N19	RSVD	MA_CLK_H[5]	MA_CLK_H[5]
N20	RSVD	MA_CLK_L[5]	MA_CLK_L[5]
Y16	MA0_CLK_H[2]	MA_CLK_H[7]	MA_CLK_H[7]
AA16	MA0_CLK_L[2]	MA_CLK_L[7]	MA_CLK_L[7]
T19	MA0_CS_L[0]	MA0_ODT[0]	MA0_ODT[0]
V22	MA0_CS_L[1]	MA0_ODT[1]	MA0_ODT[1]
J22	MA0_CS_L[2]	MA_CKE[0]	MA_CKE[0]
V19	MA0_CS_L[3]	MA1_ODT[1]	MA1_ODT[1]
U19	MA0_ODT[0]	MA0_CS_L[1]	MA0_CS_L[1]
V20	MA0_ODT[1]	MA1_CS_L[1]	MA1_CS_L[1]
H16	RSVD	RSVD_M1	MA_RESET_L	DRAM Reset Pin for Suspend-to-RAM Power Management Mode
T24	MB_ADD[0]	MA_WE_L	MA_WE_L
P26	MB_ADD[1]	MB_ADD[2]	MB_ADD[2]
P24	MB_ADD[2]	MB_ADD[0]	MB_ADD[0]
N26	MB_ADD[3]	MB_ADD[4]	MB_ADD[4]
N25	MB_ADD[4]	MB_ADD[6]	MB_ADD[6]
N24	MB_ADD[5]	MB_ADD[1]	MB_ADD[1]
N23	MB_ADD[6]	MB_ADD[3]	MB_ADD[3]
L26	MB_ADD[7]	MB_ADD[11]	MB_ADD[11]
L24	MB_ADD[9]	MB_ADD[7]	MB_ADD[7]
U25	MB_ADD[10]	MB_RAS_L	MB_RAS_L
L25	MB_ADD[11]	MB_ADD[12]	MB_ADD[12]
L23	MB_ADD[12]	MB_ADD[5]	MB_ADD[5]
W25	MB_ADD[13]	MB0_CS_L[1]	MB0_CS_L[1]
J26	MB_ADD[14]	MB_BANK[2]	MB_BANK[2]
J25	MB_ADD[15]	MB_CKE[0]	MB_CKE[0]
R24	RSVD	MB_BANK[0]	MB_BANK[0]
U26	MB_BANK[0]	MB_BANK[1]	MB_BANK[1]
T26	MB_BANK[1]	MB_ADD[10]	MB_ADD[10]
K26	MB_BANK[2]	MB_ADD[9]	MB_ADD[9]
V26	MB_CAS_L	MB0_CS_L[0]	MB0_CS_L[0]
J23	MB_CKE[0]	MB_ADD[14]	MB_ADD[14]
U24	MB_RAS_L	MB_CAS_L	MB_CAS_L
U22	MB_WE_L	MB1_CS_L[0]	MB1_CS_L[0]
A17	MB0_CLK_H[1]	MB_CLK_H[1]	MB_CLK_H[1]
A18	MB0_CLK_L[1]	MB_CLK_L[1]	MB_CLK_L[1]
R26	RSVD	MB_CLK_H[4]	MB_CLK_H[4]
R25	RSVD	MB_CLK_L[4]	MB_CLK_L[4]
P22	RSVD	MB_CLK_H[5]	MB_CLK_H[5]
R22	RSVD	MB_CLK_L[5]	MB_CLK_L[5]
AF18	MB0_CLK_H[2]	MB_CLK_H[7]	MB_CLK_H[7]
AF17	MB0_CLK_L[2]	MB_CLK_L[7]	MB_CLK_L[7]
U23	MB0_CS_L[0]	MB_WE_L	MB_WE_L
W24	MB0_CS_L[1]	MB_ADD[13]	MB_ADD[13]
J24	MB0_CS_L[2]	MB_ADD[15]	MB_ADD[15]
Y26	MB0_CS_L[3]	MB1_ODT[0]	MB1_ODT[0]
B18	RSVD	RSVD_M2	MB_RESET_L
AA8	RSVD	MEMHOT_L	MEMHOT_L	DRAM Thermal Protection input
A3	PSI_L	RSVD	RSVD	Power Status Indicator (low power mode) for VDD regulator
W8	TEST4	THERMDA	THERMDA	Thermal Diode, Anode
W7	TEST5	THERMDC	THERMDC	Thermal Diode, Cathode
AA7	TEST13	RSVD	RSVD
AE6	TEST26	ALERT_L	ALERT_L	Programmable pin that can indicate different events, including a SB-TSI interrupt
M11	VSS	KEY1	VSS
W18	RSVD	KEY2	RSVD
misc.	VDD	VDD0	VDD	Core power supply
F6	VDD_FB_H	VDD0_FB_H	VDD0_FB_H	Differential feedback to VDD0 regulator
E6	VDD_FB_L	VDD0_FB_L	VDD0_FB_L
misc.	VDD	VDD1	VDD
Y6	TEST3	VDD1_FB_H	VDD1_FB_H	Differential feedback to VDD1 regulator
AB6	TEST2	VDD1_FB_L	VDD1_FB_L
misc.	VDD	VDDNB	VDDNB	Northbridge power supply
H6	RSVD	VDDNB_FB_H	VDDNB_FB_H	Differential feedback to VDDNB regulator
G6	RSVD	VDDNB_FB_L	VDDNB_FB_L
B5	VID[0]	RSVD	RSVD	Voltage ID for VDD regulator
C5	VID[1]	RSVD	RSVD
A4	VID[2]	SVD	SVD	Serial Voltage ID Interface, Data
A6	VID[3]	SVC	SVC	Serial Voltage ID Interface, Clock
C6	VID[4]	LDTREQ_L	LDTREQ_L	HT link is active or requested by a device (HT Gen 3.0)
A5	VID[5]	RSVD	RSVD
misc.	VTT	VTT	VDDR
Y10	VTT_SENSE	VTT_SENSE	VDDR_SENSE	VTT / VDDR monitor pin

References

"Low-Profile Socket S1 Design Specification", AMD Publ. #31839, Rev. 3.01, April 10, 2007
"BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors", AMD Publ. #31116, Rev. 3.62, January 14, 2013
"Revision Guide for AMD Family 10h Processors", AMD Publ. #41322, Rev. 3.92, March 2012
"AMD RS880M Databook Device Specification for the RS880M and RS880MC", AMD Publ. #46113, Rev. 1.30, 2010

designer	AMD +
first launched	May 12, 2010 +
instance of	package +
market segment	Mobile +
microarchitecture	K10 +
name	Socket S1g4 +
package	OPGA-638 +
package contacts	638 +
package length	35 mm (3.5 cm, 1.378 in) +
package pitch	1.27 mm (0.05 in) +
package type	Organic Micro Pin Grid Array +
package width	35 mm (3.5 cm, 1.378 in) +
socket	Socket S1g4 +
tdp	45 W (45,000 mW, 0.0603 hp, 0.045 kW) +

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