Edit Values | |
Socket AM2+ | |
General Info | |
Designer | AMD |
Introduction | November 19, 2007 (launched) |
Market | Desktop |
Microarchitecture | K10 |
TDP | 140 W 140,000 mW 0.188 hp 0.14 kW |
Package | |
Name | OPGA-940 (AM2) |
Type | Organic Micro Pin Grid Array |
Contacts | 940 |
Dimension | 40.0 mm 4 cm × 40.0 mm1.575 in 4 cm 1.575 in |
Pitch | 1.27 mm 0.05 in |
Socket | |
Name | Socket AM2+ |
Type | PGA |
Socket AM2+, also known as AM2r2, was the second socket for OPGA-940 and OPGA-938-packaged AMD microprocessors with an integrated DDR2 memory controller and the successor to Socket AM2. Socket AM2+ targets the desktop segment. Its contemporaries are Socket S1 for mobile processors and Socket F for the server and workstation market. For the small form factor desktop, mobile and embedded market AMD developed package ASB1. Socket AM2+ was superseded by Socket AM3.
The main improvements of Socket AM2+ over AM2 are support for HyperTransport generation 3.0 and separate core and northbridge power planes, a power saving feature. Socket AM2+ processors are compatible with the earlier Socket AM2, subject to the motherboard recognizing the CPU, limiting its HT link to generation 1.0 mode, and using a single power plane. The OPGA-940 package for Socket AM2+ has the same dimensions but is mechanically, due to keying, and electrically incompatible with Socket 939 for processors with a DDR memory controller, Socket 940 for first generation Opteron processors, and Socket AM3 and AM3+ for processors with a DDR3 memory controller.
Socket AM2 processors in the OPGA-940 package and Socket AM3 processors in the OPGA-938 package are compatible with Socket AM2+, subject to the motherboard recognizing the CPU and the limitations of Socket AM2+.
All processors for Socket AM2+ belong to AMD's Family 10h based on the K10 microarchitecture.
Contents
Features
- 940-pin lidded micro pin grid array package, 1.27 mm pitch, 31 × 31 pins, 40 × 40 mm, organic substrate
- 16 bit HyperTransport 3.0 interface up to 2.2 GHz, 4400 MT/s, 8.8 Gbyte/s in each direction
- 2 × 64/72 bit DDR2 SDRAM interface (ganged or unganged) up to 533 MHz, PC-8500 (DDR2-1066), 17.0 Gbyte/s
- Up to 4 UDIMMs (2 per channel), up to 4 Gbyte per UDIMM, SEC-DED ECC
- JEDEC SSTL_1.8
- P-States; ACPI C1, C1E, C2, C3, S1, S3, S5; dual power planes
- Thermal diode, overtemperature protection
Chipsets
- AMD 700 series
- Nvidia nForce 700 series, GeForce 8000 series
Processors using Socket AM2+
- AMD Phenom X4 "Agena", X3 "Toliman"
- AMD Athlon X2 "Kuma"
- AMD Athlon "Lima"
- AMD Sempron "Sparta"
List of all Socket AM2+-based Processors | |||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Model | Price | Process | Launched | µarch | Family | Core | C | T | Freq | Turbo | TDP | ||||||||
Count: 0 |
Package Diagram
No data available. Presumably same dimensions as the OPGA-940 package for Socket AM2.
Socket Outline
No data available. Presumably same dimensions as Socket AM2.
Pin Map
Socket AM2/AM2+ Differences
Pin | Socket AM2 | Socket AM2+ |
---|---|---|
AL4 | RSVD | ALERT_L |
G5 | RSVD | CORE_TYPE |
AE9 | VSS | KEY/VSS |
H22 | VSS | KEY/VSS |
F2 | RSVD | PLATFORM_TYPE |
AK4 | RSVD | SA[0] |
E2 | VID[1] | PVIEN/VID[1] |
E3 | VID[2] | SVD/VID[2] |
C1 | VID[3] | SVC/VID[3] |
A4 | VDD | VDDNB |
A6 | VDD | VDDNB |
B5 | VDD | VDDNB |
B7 | VDD | VDDNB |
C6 | VDD | VDDNB |
C8 | VDD | VDDNB |
D7 | VDD | VDDNB |
D9 | VDD | VDDNB |
E10 | VDD | VDDNB |
E8 | VDD | VDDNB |
F11 | VDD | VDDNB |
F9 | VDD | VDDNB |
G10 | VDD | VDDNB |
G12 | VDD | VDDNB |
G4 | RSVD | VDDNB_FB_H |
G3 | RSVD | VDDNB_FB_L |
Pin Description
Signal | Description |
---|---|
ALERT_L | Programmable pin that can indicate different events, including a SB-TSI interrupt |
CLKIN_H/L | 200 MHz Differential PLL Reference Clock |
CORE_TYPE | Indicates that the processor is capable of split core and northbridge voltage plane operation |
CPU_PRESENT_L | Processor is present |
DBREQ_L, DBRDY | Debug Request/Ready |
HTREF0, HTREF1 | HyperTransport Compensation Resistor to VSS, VLDT |
L0_CADIN/OUT_H/L[15:0] | HT Link 0 Differential Command/Address/Data Input/Output |
L0_CLKIN/OUT_H/L[1:0] | HT Link 0 Differential Clock Input/Output |
L0_CTLIN_H/L[1:0] | HT Link 0 Differential Control Input/Output |
LDTSTOP_L | HT Stop Control Input for power management and link width and frequency change |
MA0/MA1/MB0/MB1_CLK_H/L[2:0] | DRAM Differential Clock |
MA0/MA1/MB0/MB1_CS_L[1:0] | DRAM Chip Select |
MA0/MA1/MB0/MB1_ODT[0] | DRAM Enable Pin for On Die Termination |
MA/MB_ADD[15:0] | DRAM Column/Row Address |
MA/MB_BANK[2:0] | DRAM Bank Address |
MA/MB_CAS_L | DRAM Column Address Strobe |
MA/MB_CHECK[7:0] | DRAM ECC Bits |
MA/MB_CKE[1:0] | DRAM Clock Enable |
MA/MB_DATA[63:0] | DRAM Data Bus |
MA/MB_DM[8:0] | DRAM Data Mask |
MA/MB_DQS_H/L[8:0] | DRAM Differential Data Strobe |
MA/MB_RAS_L | DRAM Row Address Strobe |
MA/MB_WE_L | DRAM Write Enable |
M_VREF | DRAM Interface Voltage Reference |
M_ZP, M_ZN | Compensation Resistor to VSS, VDDIO |
PLATFORM_TYPE | ? |
PROCHOT_L | Processor in HTC-active state input/output |
PSI_L | Power Status Indicator (low power state) for VDD regulator |
PVIEN/VID[1] | Prior to PWROK assertion signals to the processor whether the platform supports PVI or SVI operation |
PWROK | Voltages and CLKIN have reached specified operation |
RESET_L | Processor Reset |
RSVD | Reserved |
SA[0] | Sideband interface (APML/SBI/SMBus) address selection |
SIC, SID | Sideband Temperature Sensor Interface Clock, Data |
SVD/VID[2] | Serial VID Interface Data |
SVC/VID[3] | Serial VID Interface Clock |
TCK, TDI, TDO, TMS, TRST_L | JTAG interface |
TEST* | Test signal |
THERMDA, THERMDC | Thermal Diode Anode, Cathode |
THERMTRIP_L | Thermal Sensor Trip output |
VDD | Core power supply |
VDD_FB_H/L | Differential feedback to VDD regulator |
VDDA | Filtered PLL supply voltage |
VDDIO | DRAM I/O ring power supply |
VDDIO_FB_H/L | Differential feedback to VDDIO regulator |
VDDNB | Northbridge power supply |
VDDNB_FB_H/L | Differential feedback to VDDNB regulator |
VID[5:0] | Voltage ID (PVI) for VDD regulator |
VLDT_A/B | HyperTransport I/O ring power supply |
VSS | Ground |
VTT | DRAM Termination voltage |
VTT_SENSE | VTT monitor pin |
References
- "Socket AM2 Design Specification", AMD Publ. #31875, Rev. 3.00, May 2008
- "BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors", AMD Publ. #31116, Rev. 3.48, April 2010
- "Family 10h AMD Phenom™ Processor Product Data Sheet", AMD Publ. #44109, Rev. 3.00, November 2007
- "Revision Guide for AMD Family 10h Processors", AMD Publ. #41322, Rev. 3.92, March 2012
See also
designer | AMD + |
first launched | November 19, 2007 + |
instance of | package + |
market segment | Desktop + |
microarchitecture | K10 + |
name | Socket AM2+ + |
package | OPGA-940 (AM2) + |
package contacts | 940 + |
package length | 40 mm (4 cm, 1.575 in) + |
package pitch | 1.27 mm (0.05 in) + |
package type | Organic Micro Pin Grid Array + |
package width | 40 mm (4 cm, 1.575 in) + |
socket | Socket AM2+ + |
tdp | 140 W (140,000 mW, 0.188 hp, 0.14 kW) + |