Semiconductor & Computer Engineering
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EPYC 7302P - AMD
| Edit Values | |
| EPYC 7302P | |
| General Info | |
| Designer | AMD |
| Manufacturer | TSMC, GlobalFoundries |
| Model Number | 7302P |
| Part Number | 100-000000049 |
| Market | Server |
| Introduction | August 7, 2019 (announced) August 7, 2019 (launched) |
| Shop | Amazon |
| General Specs | |
| Family | EPYC |
| Series | 7002 |
| Locked | Yes |
| Frequency | 2,800 MHz |
| Turbo Frequency | 3,300 MHz |
| Clock multiplier | 28 |
| Microarchitecture | |
| ISA | x86-64 (x86) |
| Microarchitecture | Zen 2 |
| Core Name | Rome |
| Core Family | 23 |
| Process | 7 nm, 14 nm |
| Technology | CMOS |
| MCP | Yes (5 dies) |
| Word Size | 64 bit |
| Cores | 16 |
| Threads | 32 |
| Max Memory | 4 TiB |
| Multiprocessing | |
| Max SMP | 1-Way (Uniprocessor) |
| Electrical | |
| TDP | 155 W |
| Packaging | |
| Package | SP3, FCLGA-4094 (FC-OLGA) |
| Dimension | 75.4 mm × 58.5 mm × 6.26 mm |
| Pitch | 0.87 mm × 1 mm |
| Contacts | 4094 |
| Socket | SP3, LGA-4094 |
EPYC 7302P is a 64-bit octa-core x86 server microprocessor designed and introduced by AMD in mid-2019. This multi-chip processor, which is based on the Zen 2 microarchitecture, incorporates logic fabricated TSMC 7 nm process and I/O fabricated on GlobalFoundries 14 nm process. The 7302P has a TDP of 155 W with a base frequency of 2.8 GHz and a boost frequency of up to 3.3 GHz. This processor supports single-socket configurations only and up to 4 TiB of eight channels DDR4-3200 memory per socket.
Facts about "EPYC 7302P - AMD"
| base frequency | 2,800 MHz (2.8 GHz, 2,800,000 kHz) + |
| clock multiplier | 28 + |
| core count | 16 + |
| core family | 23 + |
| core name | Rome + |
| designer | AMD + |
| die count | 5 + |
| family | EPYC + |
| first announced | August 7, 2019 + |
| first launched | August 7, 2019 + |
| full page name | amd/epyc/7302p + |
| has locked clock multiplier | true + |
| instance of | microprocessor + |
| is multi-chip package | true + |
| isa | x86-64 + |
| isa family | x86 + |
| l1$ size | 1,024 KiB (1,048,576 B, 1 MiB) + |
| l1d$ description | 8-way set associative + |
| l1d$ size | 512 KiB (524,288 B, 0.5 MiB) + |
| l1i$ description | 8-way set associative + |
| l1i$ size | 512 KiB (524,288 B, 0.5 MiB) + |
| l2$ description | 8-way set associative + |
| l2$ size | 8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) + |
| l3$ size | 128 MiB (131,072 KiB, 134,217,728 B, 0.125 GiB) + |
| ldate | August 7, 2019 + |
| manufacturer | TSMC + and GlobalFoundries + |
| market segment | Server + |
| max cpu count | 1 + |
| max memory | 4,194,304 MiB (4,294,967,296 KiB, 4,398,046,511,104 B, 4,096 GiB, 4 TiB) + |
| microarchitecture | Zen 2 + |
| model number | 7302P + |
| name | EPYC 7302P + |
| package | SP3 + and FCLGA-4094 + |
| part number | 100-000000049 + |
| process | 7 nm (0.007 μm, 7.0e-6 mm) + and 14 nm (0.014 μm, 1.4e-5 mm) + |
| series | 7002 + |
| smp max ways | 1 + |
| socket | SP3 + and LGA-4094 + |
| tdp | 155 W (155,000 mW, 0.208 hp, 0.155 kW) + |
| technology | CMOS + |
| thread count | 32 + |
| turbo frequency | 3,300 MHz (3.3 GHz, 3,300,000 kHz) + |
| word size | 64 bit (8 octets, 16 nibbles) + |