Edit Values
TaiShan v110 µarch
General Info
Arch Type	CPU
Designer	HiSilicon
Manufacturer	TSMC
Introduction	2019
Process	7 nm
Core Configs	32, 48, 64
Pipeline
Type	Superscalar, Superpipeline
OoOE	Yes
Speculative	Yes
Reg Renaming	Yes
Decode	4-way
Instructions
ISA	ARMv8.2-A
Extensions	NEON
Cache
L1I Cache	64 KiB/core
L1D Cache	64 KiB/core
L2 Cache	512 KiB/core
L3 Cache	1 MiB/core
Succession
TaiShan v100

TaiShan v110 is the successor to the TaiShan v100, a high-performance ARM server microarchitecture designed by HiSilicon for Huawei's own TaiShan servers.

Brands

TaiShan-based CPUs are branded as the Kunpeng 920 series.

Release Dates

Kunpeng 920 CPUs were officially launched in early 2019.

Architecture

• TSMC 7 nm HPC process

This list is incomplete; you can help by expanding it.

Block Diagram

Entire Chip

900px

Memory Hierarchy

• Cache
  • L1I Cache
    • 64 KiB/core, private
  • L1D Cache
    • 64 KiB/core, private
  • L2 Cache
    • 512 KiB/core, private
  • L3 Cache
    • 1 MiB/core
    • Shared by all cores
  • System DRAM
    • 1 TiB Max Memory / socket
    • 8 Channels
    • DDR4, up to 2933 MT/s
      • 1 DPC and 2 DPC support
    • 8 B/cycle/channel (@ memory clock)
    • ECC, SDDC, DDDC

Overview

This section is empty; you can help add the missing info by editing this page.

Core

This section is empty; you can help add the missing info by editing this page.

Scalability

Each chip incorporates three Hydra interface ports. The Hydra interface facilitates the cache coherency between the dies on the chip. Every link supports 240 Gb/s (30 GB/s) of peak bandwidth for a total aggregated bandwidth of 720 Gb/s (90 GB/s) in a 2-way symmetric multiprocessing configuration.

With all three links, there is also support for 4-way SMP. In this configuration, one link from each socket is connected to another socket for an all-for-all connection.

Die

• TSMC 7 nm HPC
• 20,000,000,000 transistors
  • 3-4 dies

All TaiShan Chips

This section is empty; you can help add the missing info by editing this page.

Bibliography

• Huawei. Personal Communication. 2019
• Huawei Connect 2018. October 2018
• HiSilicon Event. January 7, 2019