MediaTek Helio | |
Developer | MediaTek, Arm Holdings |
Manufacturer | TSMC |
Type | System on chips |
Introduction | March 30, 2015 (announced) |
Architecture | Multicore 64-bit ARM SoCs |
ISA | ARMv8 |
µarch | Cortex-A53, Cortex-A72 |
Word size | 64 bit 8 octets
16 nibbles |
Process | 28 nm 0.028 μm , 16 nm2.8e-5 mm 0.016 μm , 10 nm1.6e-5 mm 0.01 μm
1.0e-5 mm |
Technology | CMOS |
Clock | 1,000 MHz-2,800 MHz |
Package | MWPOP-1108 |
Helio is a family of 64-bit multi-core ARM system on chips developed by MediaTek and launched in 2015. Helio is MediaTek's flagship family of SoCs presenting their highest-performance and largest selection of features.
Overview
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Members
Helio X Series
Renowned for its multi-threaded capability and performance, the Helio X (eXtreme Performance) series is designed for top-of-the-line multimedia-oriented performance. For the same generation, the only difference is the operating frequency of the CPU cores and the GPU.
List of Sandy Bridge-based Processors | ||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Main processor | Max Memory | GPU | ||||||||||
Model | Launched | Process | ISA | Cores | Cores | Threads | Frequency | Max Mem | Mem Type | Designer | Name | Frequency |
Helio X10 | 27 March 2015 | 28 nm 0.028 μm 2.8e-5 mm | ARMv8 | Cortex-A53 | 8 | 8 | 2 GHz 2,000 MHz 2,000,000 kHz | 4 GiB 4,096 MiB 4,194,304 KiB 4,294,967,296 B 0.00391 TiB | LPDDR3-1866 | Imagination Technologies | PowerVR G6200 | 700 MHz 0.7 GHz 700,000 KHz |
Helio X10 M | 27 March 2015 | 28 nm 0.028 μm 2.8e-5 mm | ARMv8 | Cortex-A53 | 8 | 8 | 2 GHz 2,000 MHz 2,000,000 kHz | 4 GiB 4,096 MiB 4,194,304 KiB 4,294,967,296 B 0.00391 TiB | LPDDR3-1866 | Imagination Technologies | PowerVR G6200 | 550 MHz 0.55 GHz 550,000 KHz |
Helio X10 T | 27 March 2015 | 28 nm 0.028 μm 2.8e-5 mm | ARMv8 | Cortex-A53 | 8 | 8 | 2.2 GHz 2,200 MHz 2,200,000 kHz | 4 GiB 4,096 MiB 4,194,304 KiB 4,294,967,296 B 0.00391 TiB | LPDDR3-1866 | Imagination Technologies | PowerVR G6200 | 700 MHz 0.7 GHz 700,000 KHz |
Helio X20 | 16 March 2016 | 20 nm 0.02 μm 2.0e-5 mm | ARMv8 | Cortex-A53, Cortex-A72 | 10 | 10 | 1.85 GHz 1,850 MHz , 1.4 GHz1,850,000 kHz 1,400 MHz , 2.1 GHz1,400,000 kHz 2,100 MHz 2,100,000 kHz | LPDDR3-1600 | ARM Holdings | Mali-T880 | 780 MHz 0.78 GHz 780,000 KHz | |
Helio X20 M | 16 March 2016 | 20 nm 0.02 μm 2.0e-5 mm | ARMv8 | Cortex-A53, Cortex-A72 | 10 | 10 | 2 GHz 2,000 MHz , 1.85 GHz2,000,000 kHz 1,850 MHz , 1.4 GHz1,850,000 kHz 1,400 MHz 1,400,000 kHz | 6 GiB 6,144 MiB 6,291,456 KiB 6,442,450,944 B 0.00586 TiB | LPDDR3-1866 | ARM Holdings | Mali-T880 | 780 MHz 0.78 GHz 780,000 KHz |
Helio X23 | 2 December 2016 | 20 nm 0.02 μm 2.0e-5 mm | ARMv8 | Cortex-A53, Cortex-A72 | 10 | 10 | 2.3 GHz 2,300 MHz , 1.85 GHz2,300,000 kHz 1,850 MHz , 1.4 GHz1,850,000 kHz 1,400 MHz 1,400,000 kHz | 4 GiB 4,096 MiB 4,194,304 KiB 4,294,967,296 B 0.00391 TiB | LPDDR3-1600 | ARM Holdings | Mali-T880 | 780 MHz 0.78 GHz 780,000 KHz |
Helio X25 | 16 March 2016 | 20 nm 0.02 μm 2.0e-5 mm | ARMv8 | Cortex-A53, Cortex-A72 | 10 | 10 | 2.5 GHz 2,500 MHz , 2 GHz2,500,000 kHz 2,000 MHz , 1.55 GHz2,000,000 kHz 1,550 MHz 1,550,000 kHz | 6 GiB 6,144 MiB 6,291,456 KiB 6,442,450,944 B 0.00586 TiB | LPDDR3-1600 | ARM Holdings | Mali-T880 | 850 MHz 0.85 GHz 850,000 KHz |
Helio X27 | 2 December 2016 | 20 nm 0.02 μm 2.0e-5 mm | ARMv8 | Cortex-A53, Cortex-A72 | 10 | 10 | 2.6 GHz 2,600 MHz , 2 GHz2,600,000 kHz 2,000 MHz , 1.6 GHz2,000,000 kHz 1,600 MHz 1,600,000 kHz | LPDDR3-1600 | ARM Holdings | Mali-T880 | 875 MHz 0.875 GHz 875,000 KHz | |
Helio X30 | 27 February 2017 | 10 nm 0.01 μm 1.0e-5 mm | ARMv8 | Cortex-A35, Cortex-A53, Cortex-A73 | 10 | 10 | 2.5 GHz 2,500 MHz , 2.2 GHz2,500,000 kHz 2,200 MHz , 1.9 GHz2,200,000 kHz 1,900 MHz 1,900,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | LPDDR4X-3732 | Imagination Technologies | PowerVR GT7400 Plus | 800 MHz 0.8 GHz 800,000 KHz |
Count: 9 |
Helio P Series
The Helio P (Premium Performance) series has a more efficiency focus than the X series, they are also cheaper so are found in cheaper chinese phones. The P20 and P25 were designed to compete with the Snapdragon 625, 626 and 630, with the P25 offering Dual rear camera support, and a marginal GPU clock speed bump, the CPU is higher in frequency however.
Helio P Series Models | ||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Main processor | IGP | |||||||||||
Model | ISA | µarch | process | Launched | Cores | Threads | L2$ | Frequency | Max Mem | Mem Type | Name | Frequency |
P10 | ARMv8 | Cortex-A53 | 28 nm 0.028 μm 2.8e-5 mm | January 2016 | 8 | 8 | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB | 2 GHz 2,000 MHz 1.2 GHz2,000,000 kHz 1,200 MHz 1,200,000 kHz | 4 GiB 4,096 MiB 4,194,304 KiB 4,294,967,296 B 0.00391 TiB | LPDDR3-1866 | Mali-T860 | 700 MHz 0.7 GHz 700,000 KHz |
P10 M | ARMv8 | Cortex-A53 | 28 nm 0.028 μm 2.8e-5 mm | January 2016 | 8 | 8 | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB | 1.8 GHz 1,800 MHz 1.2 GHz1,800,000 kHz 1,200 MHz 1,200,000 kHz | 4 GiB 4,096 MiB 4,194,304 KiB 4,294,967,296 B 0.00391 TiB | LPDDR3-1866 | Mali-T860 | 650 MHz 0.65 GHz 650,000 KHz |
P15 | ARMv8 | Cortex-A53 | 28 nm 0.028 μm 2.8e-5 mm | April 2017 | 8 | 8 | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB | 2.2 GHz 2,200 MHz 1.2 GHz2,200,000 kHz 1,200 MHz 1,200,000 kHz | 4 GiB 4,096 MiB 4,194,304 KiB 4,294,967,296 B 0.00391 TiB | LPDDR3-1866 | Mali-T860 | 800 MHz 0.8 GHz 800,000 KHz |
P20 | ARMv8 | Cortex-A53 | 16 nm 0.016 μm 1.6e-5 mm | November 2016 | 8 | 8 | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB | 2.3 GHz 2,300 MHz 2,300,000 kHz | 6 GiB 6,144 MiB 6,291,456 KiB 6,442,450,944 B 0.00586 TiB | LPDDR4X-3200 | Mali-T880 | 900 MHz 0.9 GHz 900,000 KHz |
P22 | ARMv8 | Cortex-A53 | 12 nm 0.012 μm 1.2e-5 mm | 22 May 2018 | 8 | 8 | 2 GHz 2,000 MHz 2,000,000 kHz | 6 GiB 6,144 MiB 6,291,456 KiB 6,442,450,944 B 0.00586 TiB | LPDDR4X-3200 LPDDR3-1866 | PowerVR GE8320 | 650 MHz 0.65 GHz 650,000 KHz | |
P23 | ARMv8 | Cortex-A53 | 16 nm 0.016 μm 1.6e-5 mm | 28 August 2017 | 8 | 8 | 1.65 GHz 1,650 MHz 1,650,000 kHz | 6 GiB 6,144 MiB 6,291,456 KiB 6,442,450,944 B 0.00586 TiB | LPDDR4X-3200 LPDDR3-1866 | Mali-G71 | 770 MHz 0.77 GHz 770,000 KHz | |
P25 | ARMv8 | Cortex-A53 | 16 nm 0.016 μm 1.6e-5 mm | 8 February 2017 | 8 | 8 | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB | 2.6 GHz 2,600 MHz 2,600,000 kHz | 6 GiB 6,144 MiB 6,291,456 KiB 6,442,450,944 B 0.00586 TiB | LPDDR4X-3200 | Mali-T880 | 1,000 MHz 1 GHz 1,000,000 KHz |
P30 | ARMv8 | Cortex-A53 | 16 nm 0.016 μm 1.6e-5 mm | 28 August 2017 | 8 | 8 | 1.65 GHz 1,650 MHz 2.3 GHz1,650,000 kHz 2,300 MHz 2,300,000 kHz | 6 GiB 6,144 MiB 6,291,456 KiB 6,442,450,944 B 0.00586 TiB | LPDDR4X-3200 | Mali-G71 | 950 MHz 0.95 GHz 950,000 KHz | |
P60 | ARMv8 | Cortex-A53 Cortex-A73 | 12 nm 0.012 μm 1.2e-5 mm | 26 February 2018 | 8 | 8 | 2 GHz 2,000 MHz 2,000,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | LPDDR3-1866 LPDDR4X-3600 | Mali-G72 | 800 MHz 0.8 GHz 800,000 KHz | |
P65 | ARMv8.2 | Cortex-A75 Cortex-A55 | 12 nm 0.012 μm 1.2e-5 mm | 25 June 2019 | 8 | 8 | 2 GHz 2,000 MHz 2,000,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | LPDDR3-1866 LPDDR4X-3600 | Mali-G52 | 820 MHz 0.82 GHz 820,000 KHz | |
P70 | ARMv8 | Cortex-A73 Cortex-A53 | 12 nm 0.012 μm 1.2e-5 mm | 24 October 2018 | 8 | 8 | 2.1 GHz 2,100 MHz 2 GHz2,100,000 kHz 2,000 MHz 2,000,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | LPDDR4X-3600 LPDDR3-1866 | Mali-G72 | 900 MHz 0.9 GHz 900,000 KHz | |
P90 | ARMv8.2 | Cortex-A75 Cortex-A55 | 12 nm 0.012 μm 1.2e-5 mm | 13 December 2018 | 8 | 8 | 2.2 GHz 2,200 MHz 2 GHz2,200,000 kHz 2,000 MHz 2,000,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | LPDDR4X-3732 | PowerVR GM 9446 | 970 MHz 0.97 GHz 970,000 KHz | |
Count: 12 |
designer | MediaTek + and Arm Holdings + |
first announced | March 30, 2015 + |
full page name | mediatek/helio + |
instance of | system on a chip family + |
instruction set architecture | ARMv8 + |
main designer | MediaTek + |
manufacturer | TSMC + |
microarchitecture | Cortex-A53 + and Cortex-A72 + |
name | MediaTek Helio + |
package | MWPOP-1108 + |
process | 28 nm (0.028 μm, 2.8e-5 mm) +, 16 nm (0.016 μm, 1.6e-5 mm) + and 10 nm (0.01 μm, 1.0e-5 mm) + |
technology | CMOS + |
word size | 64 bit (8 octets, 16 nibbles) + |