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Helio X10 (MT6795) - MediaTek
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MediaTek Helio X10
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio X10
Part NumberMT6795,
MTK6795
MarketMobile, Embedded
IntroductionJuly 15, 2014 (announced)
March 27, 2015 (launched)
General Specs
FamilyHelio
SeriesHelio X
Frequency2,000 MHz
Bus typeAMBA 4 AXI
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53
Core NameCortex-A53
Process28 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Max CPUs1 (Uniprocessor)
Max Memory4 GiB
Electrical
Vcore1 V
VI/O1.8 V, 2.8 V, 3.3 V
OP Temperature-20 °C – 80 °C
Tjunction – 125 °C
Tstorage0 °C – 125 °C

Helio X10 (MT6795) is a 64-bit octa-core ARM LTE system on a chip designed by MediaTek and introduced in early-2015. This SoC, which incorporates eight Cortex-A53 cores and is manufactured on TSMC's 28 nm process, operates at up to 2 GHz and supports dual-channel LPDDR3-1866 memory. This chip incorporates the PowerVR G6200 IGP operating at 700 MHz. This SoC has a modem supporting LTE User Equipment (UE) category 4.

This SoC is made of 2 clusters of 4-core each (Cortex-A53) linked together via a CCI-400, a NEON engine, and Cortex-R4 core for the second MCU subsystem.

Cache[edit]

Main article: Cortex-A53 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
L1I$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
8x32 KiB2-way set associative 
L1D$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
8x32 KiB4-way set associative 

L2$2 MiB
2,048 KiB
2,097,152 B
0.00195 GiB
  2x1 MiB16-way set associative 

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1866
Supports ECCNo
Max Mem4 GiB
Controllers1
Channels2
Width32 bit
Max Bandwidth13.91 GiB/s
Bandwidth
Single 6.95 GiB/s
Double 13.91 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART

GP I/OYes

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR G6200
DesignerImagination Technologies
Max Displays2
Frequency700 MHz
0.7 GHz
700,000 KHz
OutputDSI

Max Resolution
DSI2560x1600

Standards
Direct3D10.0
OpenGL3.2
OpenCL1.2
OpenGL ES3.1
Vulkan1.0
  • OpenGL ES 3.0 3D graphic accelerator capable of processing 175M tri/sec and 2,800M pixel/sec @ 700 MHz
  • OpenVG 1.1 vector graphics accelerator

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
4G
LTE Advanced
E-UTRANYes
UE Cat4

Image[edit]

  • Integrated image signal processor supports 20 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video[edit]

  • HEVC decoder 4k2k @ 30fps
  • H.264 decoder (30fps/40Mbps)
  • Sorenson H.263/H.263 decoder (1080p @ 60fps/40Mbps)
  • MPEG-4 SP/ASP decoder (1080p @ 60fps/40Mbps)
  • DIVX4/DIVX5/DIVX6/DIVX HD/XVID decoder (1080p @ 60fps/40Mbps)
  • VP8 / VC-1 decoders
  • MPEG-4 / H.263 / H.264 / HEVC encoders

Audio[edit]

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices[edit]

  • Meizu Blue Charm Metal
  • Meizu MX5E
  • HTC Desire 830
  • HTC One S9
  • HTC One ME
  • Sony Xperia M5
  • Gionee Elife E8
  • Elephone Vowney
  • LeEco Le1 X600
  • LeEco Le 1s
  • PPTV King 7
  • Xiaomi Redmi Note 2
  • LG G3 (Silk White, 16GB)
  • Xiaomi Redmi Note 3
  • Canvas 6 pro
  • Meitu V4
  • Meitu V4S
  • Lumigon T3

This list is incomplete; you can help by expanding it.

base frequency2,000 MHz (2 GHz, 2,000,000 kHz) +
bus typeAMBA 4 AXI +
core count8 +
core nameCortex-A53 +
core voltage1 V (10 dV, 100 cV, 1,000 mV) +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedJuly 15, 2014 +
first launchedMarch 27, 2015 +
full page namemediatek/helio/mt6795 +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuPowerVR G6200 +
integrated gpu base frequency700 MHz (0.7 GHz, 700,000 KHz) +
integrated gpu designerImagination Technologies +
io voltage1.8 V (18 dV, 180 cV, 1,800 mV) +, 2.8 V (28 dV, 280 cV, 2,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) +
isaARMv8 +
isa familyARM +
l1$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l1d$ description4-way set associative +
l1d$ size0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) +
l1i$ description2-way set associative +
l1i$ size0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) +
l2$ description16-way set associative +
l2$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
ldateMarch 27, 2015 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max junction temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory channels2 +
max operating temperature80 °C +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureCortex-A53 +
min operating temperature-20 °C +
min storage temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberHelio X10 +
nameMediaTek Helio X10 +
part numberMT6795 + and MTK6795 +
process28 nm (0.028 μm, 2.8e-5 mm) +
seriesHelio X +
supported memory typeLPDDR3-1866 +
technologyCMOS +
thread count8 +
used byMeizu Blue Charm Metal +, Meizu MX5E +, HTC Desire 830 +, HTC One S9 +, HTC One ME +, Sony Xperia M5 +, Gionee Elife E8 +, Elephone Vowney +, LeEco Le1 X600 +, LeEco Le 1s +, PPTV King 7 +, Xiaomi Redmi Note 2 +, LG G3 +, Xiaomi Redmi Note 3 +, Canvas 6 pro +, Meitu V4 +, Meitu V4S + and Lumigon T3 +
user equipment category4 +
word size64 bit (8 octets, 16 nibbles) +