From WikiChip
Property:package type
965
U
This property describes a integrated circuit package type. Examples are:
- Flip-Chip Organic Land Grid Array (FC-OLGA)
- Organic Micro Ball Grid Array
- Ceramic Pin Grid Array (CPGA)
Only an abbreviation may be specified.
See also
- Property:socket
- Property:package
- Property:package type
- Property:package length
- Property:package width
- Property:package height
- Property:package contacts
- Property:package pitch
Pages using the property "package type"
Showing 25 pages using this property.
C | |
---|---|
Core i7-9700F - Intel#package + | LGA + |
Core i7-9700K - Intel#package + | LGA + |
Core i7-9700KF - Intel#package + | LGA + |
Core i7-9700T - Intel#package + | LGA + |
Core i7-9750H - Intel#package + | BGA + |
Core i7-9850H - Intel#package + | BGA + |
Core i9-8950HK - Intel#package + | BGA + |
Core i9-9880H - Intel#package + | BGA + |
Core i9-9900 - Intel#package + | LGA + |
Core i9-9900K - Intel#package + | LGA + |
Core i9-9900KF - Intel#package + | LGA + |
Core i9-9900KS - Intel#package + | LGA + |
Core i9-9900T - Intel#package + | LGA + |
Core i9-9980HK - Intel#package + | BGA + |
D | |
Denverton - Cores - Intel#package + | BGA + |
E | |
eMAG 8180 - Ampere#package + | BGA + |
G | |
GAP8 - GreenWaves#package + | aQFN + |
Gemini Lake - Cores - Intel#package + | BGA + |
K | |
K3V1 - HiSilicon#package + | TFBGA + |
K3V2 - HiSilicon#package + | TFBGA + |
K3V2E - HiSilicon#package + | TFBGA + |
Kaby Lake R - Cores - Intel#package + | BGA + |
Kaby Lake U - Cores - Intel#package + | BGA + |
M | |
Matrix-2000 - NUDT#package + | CLGA + |
P | |
Package ASB1 - AMD + | Organic Micro Ball Grid Array + |
Facts about "package type"
Has type "Has type" is a predefined property that describes the datatype of a property and is provided by Semantic MediaWiki. | Text + |