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- == [[Centaur Technology]] == == [[Cypress Semiconductor]] ==12 KB (1,182 words) - 13:35, 13 March 2022
- |technology=pMOS [[File:KL National INS4004.jpg|100px|thumbnail|left|A National Semiconductor version of the 4004, INS4004J]]5 KB (748 words) - 21:37, 21 November 2021
- ...aging]] solution that utilizes the [[controlled collapse chip connection]] technology, also known as [[flip chip]], for its [[die]] to [[substrate]] interconnect fcBGA packages is used in all main semiconductor manufacturers such as in the latest [[Intel]]'s [[Core i7]], [[Texas Instru2 KB (239 words) - 07:17, 17 December 2013
- [[Category:Semiconductor technology]]3 members (0 subcategories, 2 files) - 07:14, 17 December 2013
- ...of the incorporated [[central processing unit|CPU]], the [[semiconductor]] technology involved, and the properties of the overall system. Some common specificati * '''[[logic family|technology]]''' - the semiconductor technology used to create the MPU (e.g. [[CMOS]], [[BiCMOS]], and [[TTL]])24 KB (3,402 words) - 23:43, 6 September 2024
- * Godson-1 September 28, 2002 Godson-2/Godson-3 - Institute of Computing Technology, Chinese Academy of Sciences * [[MOS Technology 6502]]16 KB (2,259 words) - 00:59, 30 December 2023
- ...process''' was the [[semiconductor process]] technology used by the major semiconductor companies during the years of 1967 and 1973. This process had an effective |Technology2 KB (177 words) - 23:04, 20 May 2018
- ...vg|link=|75px|class=wikichip_ogimage]] Semiconductor lithography processes technology2 KB (263 words) - 03:40, 5 September 2021
- ...thography process''' was the semiconductor process technology used by some semiconductor companies during the early to mid 1970s. This process was later superseded |Technology1 KB (119 words) - 23:04, 20 May 2018
- ...thography process''' was the semiconductor process technology used by some semiconductor companies during the mid 1970s to the mid 1980s. <!-- VLSI Technology -->3 KB (314 words) - 23:04, 20 May 2018
- ...raphy process''' was the semiconductor process technology used by the some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replace | fab 10 name link = vlsi technology8 KB (969 words) - 12:31, 22 February 2019
- ...aphy process''' was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. This process had an effective channel length of3 KB (332 words) - 23:04, 20 May 2018
- ...aphy process''' was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990 |Technology1 KB (166 words) - 23:04, 20 May 2018
- |technology=CMOS In 1988, the NC4016 design was licensed and improved by Harris Semiconductor which later rebranded the chip as the [[RTX2000]], a radiation hardened ver2 KB (257 words) - 16:31, 13 December 2017
- ...the semiconductor process technology used for early FET devices by leading semiconductor companies during the late early 1970s. This process had a smallest feature | fab 4 name link = mos technology5 KB (632 words) - 23:04, 20 May 2018
- | developer = Fairchild Semiconductor | manufacturer = Fairchild Semiconductor2 KB (291 words) - 23:48, 10 July 2017
- XGC Technology offers a [[C]] and [[C++]] compiler and simulator for the F9450. The Compil [[Category:Fairchild Semiconductor microprocessors]]2 KB (253 words) - 16:27, 20 December 2015
- {{title|MOSFET - Metal-Oxide-Semiconductor Field-Effect-Transistor}} ...hat is fabricated by the [[thermal oxidation|controlled oxidation]] of a [[semiconductor]] (typically [[silicon]]) and utilizes an insulator (such as [[wikipedia:Si193 KB (26,874 words) - 18:01, 6 September 2024
- '''Intel Corporation''' is an American [[semiconductor]] company. While most notably known for their development of [[microprocess * {{\\|Process Technology}}9 KB (1,150 words) - 00:03, 2 October 2022
- | developer = National Semiconductor | manufacturer = National Semiconductor2 KB (274 words) - 18:29, 5 February 2016