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Difference between revisions of "hisilicon/microarchitectures/taishan v110"
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|designer=HiSilicon | |designer=HiSilicon | ||
|manufacturer=TSMC | |manufacturer=TSMC | ||
| − | |introduction= | + | |introduction=2019 |
|process=7 nm | |process=7 nm | ||
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'''TaiShan''' is a high-performance [[ARM]] server microarchitecture designed by [[HiSilicon]] for [[Huawei]]'s own TaiShan servers. | '''TaiShan''' is a high-performance [[ARM]] server microarchitecture designed by [[HiSilicon]] for [[Huawei]]'s own TaiShan servers. | ||
| + | |||
| + | == Brands == | ||
| + | TaiShan-based CPUs are branded as the {{hisilicon|hi16xx#920_Series|Kunpeng 920 series}}. | ||
| + | |||
| + | == Release Dates == | ||
| + | Kunpeng 920 CPUs were officially launched in early 2019. | ||
| + | |||
| + | == Architecture == | ||
| + | * [[TSMC]] [[7 nm|7 nm HPC process]] | ||
| + | {{expand list}} | ||
| + | |||
| + | === Block Diagram === | ||
| + | ==== Entire Chip ==== | ||
| + | {{empty section}} | ||
| + | |||
| + | === Memory Hierarchy === | ||
| + | {{empty section}} | ||
| + | |||
| + | == Overview == | ||
| + | {{empty section}} | ||
| + | |||
| + | == Core == | ||
| + | {{empty section}} | ||
| + | |||
| + | == Scalability == | ||
| + | {{empty section}} | ||
| + | |||
| + | == Die == | ||
| + | * TSMC [[7 nm|7 nm HPC]] | ||
| + | * 20,000,000,000 transistors | ||
| + | |||
| + | == All TaiShan Chips == | ||
| + | {{empty section}} | ||
| + | |||
| + | == Bibliography == | ||
| + | * Huawei. ''Personal Communication''. 2019 | ||
| + | * Huawei Connect 2018. October 2018 | ||
| + | * HiSilicon Event. January 7, 2019 | ||
Revision as of 13:03, 2 May 2019
| Edit Values | |
| TaiShan µarch | |
| General Info | |
| Arch Type | CPU |
| Designer | HiSilicon |
| Manufacturer | TSMC |
| Introduction | 2019 |
| Process | 7 nm |
| Core Configs | 32, 48, 64 |
| Pipeline | |
| Type | Superscalar, Superpipeline |
| OoOE | Yes |
| Speculative | Yes |
| Reg Renaming | Yes |
| Decode | 4-way |
| Instructions | |
| ISA | ARMv8.2-A |
| Extensions | NEON |
| Cache | |
| L1I Cache | 64 KiB/core |
| L1D Cache | 64 KiB/core |
| L2 Cache | 512 KiB/core |
| L3 Cache | 1 MiB/core |
| Cores | |
| Core Names | TaiShan |
TaiShan is a high-performance ARM server microarchitecture designed by HiSilicon for Huawei's own TaiShan servers.
Contents
Brands
TaiShan-based CPUs are branded as the Kunpeng 920 series.
Release Dates
Kunpeng 920 CPUs were officially launched in early 2019.
Architecture
This list is incomplete; you can help by expanding it.
Block Diagram
Entire Chip
 |
This section is empty; you can help add the missing info by editing this page. |
Memory Hierarchy
| |
This section is empty; you can help add the missing info by editing this page. |
Overview
| |
This section is empty; you can help add the missing info by editing this page. |
Core
| |
This section is empty; you can help add the missing info by editing this page. |
Scalability
| |
This section is empty; you can help add the missing info by editing this page. |
Die
- TSMC 7 nm HPC
- 20,000,000,000 transistors
All TaiShan Chips
| |
This section is empty; you can help add the missing info by editing this page. |
Bibliography
- Huawei. Personal Communication. 2019
- Huawei Connect 2018. October 2018
- HiSilicon Event. January 7, 2019
Facts about "TaiShan v110 - Microarchitectures - HiSilicon"
| codename | TaiShan + |
| core count | 32 +, 48 + and 64 + |
| designer | HiSilicon + |
| first launched | 2019 + |
| full page name | hisilicon/microarchitectures/taishan v110 + |
| instance of | microarchitecture + |
| instruction set architecture | ARMv8.2-A + |
| manufacturer | TSMC + |
| microarchitecture type | CPU + |
| name | TaiShan + |
| process | 7 nm (0.007 μm, 7.0e-6 mm) + |