From WikiChip
Difference between revisions of "hisilicon/microarchitectures/taishan v110"
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− | {{hisilicon|TaiShan| | + | {{hisilicon title|TaiShan|arch}} |
{{microarchitecture | {{microarchitecture | ||
|atype=CPU | |atype=CPU | ||
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|designer=HiSilicon | |designer=HiSilicon | ||
|manufacturer=TSMC | |manufacturer=TSMC | ||
− | |introduction= | + | |introduction=2019 |
|process=7 nm | |process=7 nm | ||
|cores=32 | |cores=32 | ||
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}} | }} | ||
'''TaiShan''' is a high-performance [[ARM]] server microarchitecture designed by [[HiSilicon]] for [[Huawei]]'s own TaiShan servers. | '''TaiShan''' is a high-performance [[ARM]] server microarchitecture designed by [[HiSilicon]] for [[Huawei]]'s own TaiShan servers. | ||
+ | |||
+ | == Brands == | ||
+ | TaiShan-based CPUs are branded as the {{hisilicon|hi16xx#920_Series|Kunpeng 920 series}}. | ||
+ | |||
+ | == Release Dates == | ||
+ | Kunpeng 920 CPUs were officially launched in early 2019. | ||
+ | |||
+ | == Architecture == | ||
+ | * [[TSMC]] [[7 nm|7 nm HPC process]] | ||
+ | {{expand list}} | ||
+ | |||
+ | === Block Diagram === | ||
+ | ==== Entire Chip ==== | ||
+ | {{empty section}} | ||
+ | |||
+ | === Memory Hierarchy === | ||
+ | {{empty section}} | ||
+ | |||
+ | == Overview == | ||
+ | {{empty section}} | ||
+ | |||
+ | == Core == | ||
+ | {{empty section}} | ||
+ | |||
+ | == Scalability == | ||
+ | {{empty section}} | ||
+ | |||
+ | == Die == | ||
+ | * TSMC [[7 nm|7 nm HPC]] | ||
+ | * 20,000,000,000 transistors | ||
+ | |||
+ | == All TaiShan Chips == | ||
+ | {{empty section}} | ||
+ | |||
+ | == Bibliography == | ||
+ | * Huawei. ''Personal Communication''. 2019 | ||
+ | * Huawei Connect 2018. October 2018 | ||
+ | * HiSilicon Event. January 7, 2019 |
Revision as of 12:03, 2 May 2019
Edit Values | |
TaiShan µarch | |
General Info | |
Arch Type | CPU |
Designer | HiSilicon |
Manufacturer | TSMC |
Introduction | 2019 |
Process | 7 nm |
Core Configs | 32, 48, 64 |
Pipeline | |
Type | Superscalar, Superpipeline |
OoOE | Yes |
Speculative | Yes |
Reg Renaming | Yes |
Decode | 4-way |
Instructions | |
ISA | ARMv8.2-A |
Extensions | NEON |
Cache | |
L1I Cache | 64 KiB/core |
L1D Cache | 64 KiB/core |
L2 Cache | 512 KiB/core |
L3 Cache | 1 MiB/core |
Cores | |
Core Names | TaiShan |
TaiShan is a high-performance ARM server microarchitecture designed by HiSilicon for Huawei's own TaiShan servers.
Contents
Brands
TaiShan-based CPUs are branded as the Kunpeng 920 series.
Release Dates
Kunpeng 920 CPUs were officially launched in early 2019.
Architecture
This list is incomplete; you can help by expanding it.
Block Diagram
Entire Chip
This section is empty; you can help add the missing info by editing this page. |
Memory Hierarchy
This section is empty; you can help add the missing info by editing this page. |
Overview
This section is empty; you can help add the missing info by editing this page. |
Core
This section is empty; you can help add the missing info by editing this page. |
Scalability
This section is empty; you can help add the missing info by editing this page. |
Die
- TSMC 7 nm HPC
- 20,000,000,000 transistors
All TaiShan Chips
This section is empty; you can help add the missing info by editing this page. |
Bibliography
- Huawei. Personal Communication. 2019
- Huawei Connect 2018. October 2018
- HiSilicon Event. January 7, 2019
Facts about "TaiShan v110 - Microarchitectures - HiSilicon"
codename | TaiShan + |
core count | 32 +, 48 + and 64 + |
designer | HiSilicon + |
first launched | 2019 + |
full page name | hisilicon/microarchitectures/taishan v110 + |
instance of | microarchitecture + |
instruction set architecture | ARMv8.2-A + |
manufacturer | TSMC + |
microarchitecture type | CPU + |
name | TaiShan + |
process | 7 nm (0.007 μm, 7.0e-6 mm) + |