From WikiChip
Difference between revisions of "intel/core i3/i3-1000g4"
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|isa=x86-64 | |isa=x86-64 | ||
|isa family=x86 | |isa family=x86 | ||
− | |microarch=Ice Lake | + | |microarch=Ice Lake (Client) |
|platform=Ice Lake | |platform=Ice Lake | ||
|core name=Ice Lake Y | |core name=Ice Lake Y |
Revision as of 22:48, 5 August 2019
Edit Values | |
Core i3-1000G4 | |
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Package, front | |
General Info | |
Designer | Intel |
Manufacturer | Intel |
Model Number | i3-1000G4 |
Market | Mobile |
Introduction | August 1, 2019 (announced) August 1, 2019 (launched) |
Shop | Amazon |
General Specs | |
Family | Core i3 |
Series | i3-10000 |
Locked | Yes |
Frequency | 1,100 MHz |
Turbo Frequency | 3,200 MHz (1 core), 3,200 MHz (2 cores) |
Bus type | OPI |
Bus rate | 4 × 4 GT/s |
Clock multiplier | 11 |
Microarchitecture | |
ISA | x86-64 (x86) |
Microarchitecture | Ice Lake (Client) |
Platform | Ice Lake |
Core Name | Ice Lake Y |
Core Family | 6 |
Process | 10 nm |
Technology | CMOS |
Word Size | 64 bit |
Cores | 2 |
Threads | 4 |
Max Memory | 32 GiB |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Electrical | |
TDP | 9 W |
cTDP down | 8 W |
cTDP down frequency | 800 MHz |
cTDP up | 12 W |
Tjunction | 0 °C – 100 °C |
Packaging | |
Package | FCBGA-1377 (BGA) |
Dimension | 26.5 mm × 18.5 mm × 1.0 mm |
Pitch | 0.43 mm |
Contacts | 1377 |
Socket | Type 3 |
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Core i3-1000G4 is a 64-bit dual-core high-end performance ultra-low power x86 mobile microprocessor introduced by Intel in mid-2019. This chip, which is based on the Ice Lake microarchitecture, is fabricated on Intel's 10 nm process. The i3-1000G4 operates at 1.1 GHz with a TDP of 9 W supporting a Turbo Boost frequency of up to 3.2 GHz. The processor supports up to 32 GiB of quad-channel LPDDR4X-3733 memory and incorporates Intel's UHG Graphics IGP operating at 300 MHz with a burst frequency of 900 MHz.
Cache
- Main article: Ice Lake § Cache
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Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller
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Integrated Memory Controller
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Expansions
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Expansion Options |
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Graphics
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Integrated Graphics Information
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Features
[Edit/Modify Supported Features]
Die
- Main article: Ice Lake SoC Die
Facts about "Core i3-1000G4 - Intel"
back image | ![]() |
base frequency | 1,100 MHz (1.1 GHz, 1,100,000 kHz) + |
bus links | 4 + |
bus rate | 4,000 MT/s (4 GT/s, 4,000,000 kT/s) + |
bus type | OPI + |
clock multiplier | 11 + |
core count | 2 + |
core family | 6 + |
core name | Ice Lake Y + |
designer | Intel + |
device id | 0x8A51 + |
family | Core i3 + |
first announced | August 1, 2019 + |
first launched | August 1, 2019 + |
full page name | intel/core i3/i3-1000g4 + |
has advanced vector extensions | true + |
has advanced vector extensions 2 | true + |
has advanced vector extensions 512 | true + |
has ecc memory support | false + |
has extended page tables support | true + |
has feature | Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Vector Extensions 512 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard + and Flex Memory Access + |
has intel enhanced speedstep technology | true + |
has intel flex memory access support | true + |
has intel secure key technology | true + |
has intel speed shift technology | true + |
has intel supervisor mode execution protection | true + |
has intel turbo boost technology 2 0 | true + |
has intel vt-d technology | true + |
has intel vt-x technology | true + |
has locked clock multiplier | true + |
has second level address translation support | true + |
has simultaneous multithreading | true + |
has x86 advanced encryption standard instruction set extension | true + |
instance of | microprocessor + |
integrated gpu | UHD Graphics + |
integrated gpu base frequency | 300 MHz (0.3 GHz, 300,000 KHz) + |
integrated gpu designer | Intel + |
integrated gpu execution units | 32 + |
integrated gpu max frequency | 900 MHz (0.9 GHz, 900,000 KHz) + |
integrated gpu max memory | 32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB) + |
isa | x86-64 + |
isa family | x86 + |
l1$ size | 160 KiB (163,840 B, 0.156 MiB) + |
l1d$ description | 12-way set associative + |
l1d$ size | 96 KiB (98,304 B, 0.0938 MiB) + |
l1i$ description | 8-way set associative + |
l1i$ size | 64 KiB (65,536 B, 0.0625 MiB) + |
l2$ description | 8-way set associative + |
l2$ size | 1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + |
l3$ description | 16-way set associative + |
l3$ size | 4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) + |
ldate | August 1, 2019 + |
main image | ![]() |
main image caption | Package, front + |
manufacturer | Intel + |
market segment | Mobile + |
max cpu count | 1 + |
max junction temperature | 373.15 K (100 °C, 212 °F, 671.67 °R) + |
max memory | 32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) + |
max memory bandwidth | 55.63 GiB/s (56,965.12 MiB/s, 59.732 GB/s, 59,732.258 MB/s, 0.0543 TiB/s, 0.0597 TB/s) + |
max memory channels | 4 + |
max usb ports | 4 + |
microarchitecture | Ice Lake (Client) + |
min junction temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
model number | i3-1000G4 + |
name | Core i3-1000G4 + |
package | FCBGA-1377 + |
platform | Ice Lake + |
process | 10 nm (0.01 μm, 1.0e-5 mm) + |
series | i3-10000 + |
smp max ways | 1 + |
socket | Type 3 + |
supported memory type | LPDDR4X-3733 + and DDR4-3200 + |
tdp | 9 W (9,000 mW, 0.0121 hp, 0.009 kW) + |
tdp down | 8 W (8,000 mW, 0.0107 hp, 0.008 kW) + |
tdp down frequency | 800 MHz (0.8 GHz, 800,000 kHz) + |
tdp up | 12 W (12,000 mW, 0.0161 hp, 0.012 kW) + |
technology | CMOS + |
thread count | 4 + |
turbo frequency (1 core) | 3,200 MHz (3.2 GHz, 3,200,000 kHz) + |
turbo frequency (2 cores) | 3,200 MHz (3.2 GHz, 3,200,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |
x86/has memory protection extensions | true + |
x86/has software guard extensions | true + |