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Difference between revisions of "hisilicon/microarchitectures/taishan v110"
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== Scalability == | == Scalability == | ||
− | + | There are three cache coherent ports on each SoC. Every port supports 240 Gb/s (30 GB/s) of peak bandwidth for a total aggregated bandwidth of 720 Gb/s (90 GB/s) in a 2-way [[symmetric multiprocessing]] configuration. | |
+ | |||
+ | :[[File:Kunpeng 920 2smp.svg|600px]] | ||
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+ | With all three links, there is also support for 4-way SMP. In this configuration, one link from each socket is connected to another socket for an all-for-all connection. | ||
+ | |||
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+ | :[[File:Kunpeng 920 4smp.svg|600px]] | ||
== Die == | == Die == |
Revision as of 12:38, 2 May 2019
Edit Values | |
TaiShan µarch | |
General Info | |
Arch Type | CPU |
Designer | HiSilicon |
Manufacturer | TSMC |
Introduction | 2019 |
Process | 7 nm |
Core Configs | 32, 48, 64 |
Pipeline | |
Type | Superscalar, Superpipeline |
OoOE | Yes |
Speculative | Yes |
Reg Renaming | Yes |
Decode | 4-way |
Instructions | |
ISA | ARMv8.2-A |
Extensions | NEON |
Cache | |
L1I Cache | 64 KiB/core |
L1D Cache | 64 KiB/core |
L2 Cache | 512 KiB/core |
L3 Cache | 1 MiB/core |
Cores | |
Core Names | TaiShan |
TaiShan is a high-performance ARM server microarchitecture designed by HiSilicon for Huawei's own TaiShan servers.
Contents
Brands
TaiShan-based CPUs are branded as the Kunpeng 920 series.
Release Dates
Kunpeng 920 CPUs were officially launched in early 2019.
Architecture
This list is incomplete; you can help by expanding it.
Block Diagram
Entire Chip
Memory Hierarchy
- Cache
- L1I Cache
- 64 KiB/core, private
- L1D Cache
- 64 KiB/core, private
- L2 Cache
- 512 KiB/core, private
- L3 Cache
- 1 MiB/core
- Shared by all cores
- System DRAM
- 1 TiB Max Memory / socket
- 8 Channels
- DDR4, up to 2933 MT/s
- 1 DPC and 2 DPC support
- 8 B/cycle/channel (@ memory clock)
- ECC, SDDC, DDDC
- L1I Cache
Overview
This section is empty; you can help add the missing info by editing this page. |
Core
This section is empty; you can help add the missing info by editing this page. |
Scalability
There are three cache coherent ports on each SoC. Every port supports 240 Gb/s (30 GB/s) of peak bandwidth for a total aggregated bandwidth of 720 Gb/s (90 GB/s) in a 2-way symmetric multiprocessing configuration.
With all three links, there is also support for 4-way SMP. In this configuration, one link from each socket is connected to another socket for an all-for-all connection.
Die
- TSMC 7 nm HPC
- 20,000,000,000 transistors
All TaiShan Chips
This section is empty; you can help add the missing info by editing this page. |
Bibliography
- Huawei. Personal Communication. 2019
- Huawei Connect 2018. October 2018
- HiSilicon Event. January 7, 2019
Facts about "TaiShan v110 - Microarchitectures - HiSilicon"
codename | TaiShan v110 + |
core count | 32 +, 48 + and 64 + |
designer | HiSilicon + |
first launched | 2019 + |
full page name | hisilicon/microarchitectures/taishan v110 + |
instance of | microarchitecture + |
instruction set architecture | ARMv8.2-A + |
manufacturer | TSMC + |
microarchitecture type | CPU + |
name | TaiShan v110 + |
process | 7 nm (0.007 μm, 7.0e-6 mm) + |