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Ryzen 3 PRO 3300U - AMD
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Ryzen 3 PRO 3300U
General Info
DesignerAMD
ManufacturerGlobalFoundries
Model NumberPRO 3300U
Part NumberYM330BC4T4MFG
MarketMobile
IntroductionApril 8, 2019 (announced)
April 8, 2019 (launched)
ShopAmazon
General Specs
FamilyRyzen 3
Series3000
Frequency2,100 MHz
Turbo Frequency3,500 MHz
Bus typePCIe 3.0
Clock multiplier21
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureZen+
Core NamePicasso
Process12 nm
Transistors4,940,000,000
TechnologyCMOS
Die209.78 mm²
Word Size64 bit
Cores4
Threads4
Max Memory32 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP15 W
cTDP down12 W
cTDP up25 W
OP Temperature0° C – 95 °C
Packaging
PackageFP5
Package TypeOrganic Micro Ball Grid Array
Dimension35 mm × 25 mm
Pitch0.7 mm
Contacts1140

Ryzen 3 PRO 3300U is a 64-bit quad-core entry-level performance x86 mobile microprocessor introduced by AMD in early 2019. This processor is based on AMD's Zen+ microarchitecture and is fabricated on a 12 nm process. The PRO 3300U operates at a base frequency of 2.1 GHz with a TDP of 15 W and a Boost frequency of 3.5 GHz. This APU supports up to 32 GiB of dual-channel DDR4-2400 memory and incorporates Radeon Vega 6 Graphics operating at up to 1.2 GHz.

This model supports a configurable TDP-down of 12 W and TDP-up of 25 W.


Cache[edit]

Main article: Zen+ § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$384 KiB
393,216 B
0.375 MiB
L1I$256 KiB
262,144 B
0.25 MiB
4x64 KiB4-way set associative 
L1D$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associativewrite-back
L2$2 MiB
2,048 KiB
2,097,152 B
0.00195 GiB
  4x512 KiB8-way set associativewrite-back
L3$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  1x4 MiB  

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2400
Supports ECCYes
Max Mem32 GiB
Controllers2
Channels2
Max Bandwidth35.76 GiB/s
36,618.24 MiB/s
38.397 GB/s
38,397.008 MB/s
0.0349 TiB/s
0.0384 TB/s
Bandwidth
Single 17.88 GiB/s
Double 35.76 GiB/s

Expansions[edit]

This processor has 12 PCIe lanes, 1x8 typically designated for a GPU and 4 additional lanes for storage (e.g., NVMe).

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 3.0
Max Lanes: 12
Configuration: 1x8+1x4, 2x4+1x4


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPURadeon Vega 6
DesignerAMD
Execution Units6Max Displays4
Unified Shaders384
Burst Frequency1,200 MHz
1.2 GHz
1,200,000 KHz
OutputDP, HDMI
Standards
DirectX12
OpenGL4.6
OpenCL2.2

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
SSE4aStreaming SIMD Extensions 4a
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
SHASHA Extensions
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
SMTSimultaneous Multithreading
AMD-ViAMD-Vi (I/O MMU virtualization)
AMD-VAMD Virtualization
TSMETransparent SME
SenseMISenseMI Technology

Die[edit]

Further information: Zen+ § Die


raven ridge die.png


raven ridge die (annotated).png
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Facts about "Ryzen 3 PRO 3300U - AMD"
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Ryzen 3 PRO 3300U - AMD#pcie +
base frequency2,100 MHz (2.1 GHz, 2,100,000 kHz) +
bus typePCIe 3.0 +
clock multiplier21 +
core count4 +
core namePicasso +
designerAMD +
die area209.78 mm² (0.325 in², 2.098 cm², 209,780,000 µm²) +
familyRyzen 3 +
first announcedApril 8, 2019 +
first launchedApril 8, 2019 +
full page nameamd/ryzen 3/pro 3300u +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has amd amd-v technologytrue +
has amd amd-vi technologytrue +
has amd sensemi technologytrue +
has amd transparent secure memory encryption technologytrue +
has ecc memory supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuRadeon Vega 6 +
integrated gpu designerAMD +
integrated gpu execution units6 +
integrated gpu max frequency1,200 MHz (1.2 GHz, 1,200,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size384 KiB (393,216 B, 0.375 MiB) +
l1d$ description8-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description4-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description8-way set associative +
l2$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateApril 8, 2019 +
manufacturerGlobalFoundries +
market segmentMobile +
max cpu count1 +
max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
max memory bandwidth35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels2 +
max operating temperature95 °C +
microarchitectureZen+ +
min operating temperature0° C +
model numberPRO 3300U +
nameRyzen 3 PRO 3300U +
packageFP5 +
part numberYM330BC4T4MFG +
process12 nm (0.012 μm, 1.2e-5 mm) +
series3000 +
smp max ways1 +
supported memory typeDDR4-2400 +
tdp15 W (15,000 mW, 0.0201 hp, 0.015 kW) +
tdp down12 W (12,000 mW, 0.0161 hp, 0.012 kW) +
tdp up25 W (25,000 mW, 0.0335 hp, 0.025 kW) +
technologyCMOS +
thread count4 +
transistor count4,940,000,000 +
turbo frequency3,500 MHz (3.5 GHz, 3,500,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +