...performance proved to be too much of a bottleneck on its own. Xeon D is a middle-tier family that's a step above {{intel|Atom}} in terms of performance, but {{main|intel/microarchitectures/broadwell (server)|intel/cores/broadwell de|l1=Broadwell (Server) µarch|l2=Broadwell DE Core}}

|cores=4 |cores 2=6

...grate four identical "Zeppelin" rev. ZP-B2 dies, each containing eight CPU cores and implementing one quarter of the processor's memory and I/O interfaces. ...die and 2, 4, 6, or 8 identical Core Complex Dies which contain eight CPU cores each, populated in order CCD2/CCD4, CCD0/CCD6, and CCD1/CCD7. This silicon

...nd 2 {{armh|Cortex-A75|l=arch}} [[middle cores]] and 4 Cortex-A55 [[little cores]]. This chip supports up to 12 GiB of quad-channel 16-bit LPDDR4X-3600 memo ...[DeePhi]] DLA. The new NPU features 1,024 MACs split between two execution cores. The new NPU is capable of a peaking compute of two teraOPS.

...}} [[middle cores]] at 2400 MHz, and 4 {{armh|Cortex-A55|l=arch}} [[little cores]] at 1950 to 2106 MHz. This chip supports up to 12 GiB of quad-channel 16-b

..., 2 {{armh|Cortex-A76|l=arch}} [[middle cores]], and 4 Cortex-A55 [[little cores]]. This chip supports up to 12 GiB of quad-channel 16-bit LPDDR5-5500 memor ...s 990 features Samsung's homegrown NPU. The new NPU features two execution cores. The new NPU is capable of a peaking compute of fifteen trillion operations

|cores=96 ...acked [[chiplets]]-based SoC technology. The project comprised 96 [[MIPS]] cores built using 6 [[chiplets]] [[3D stack]] on an active interposer in order to

...grating one I/O die and up to 12 Core Complex Dies which contain eight CPU cores each. A {{abbr|GMI}}3 link connects each CCD to the IOD. ...rically arranged so the heatsink can be installed 180 degrees rotated. The middle screws are supposed to be tightened first, then diagonally opposed corner s

...design similar to its predecessor, {{\\|Graviton3}}. This chip features 96 cores, 50% more than the prior generation. The core implementation was updated to ...ecture similar in design to the Graviton3. The compute SoC die sits in the middle with 4 DDR memory controller dies and 2 PCIe controller dies. Each DDR memo