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Difference between revisions of "qualcomm/msm1"
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| Line 7: | Line 7: | ||
| developer = Qualcomm | | developer = Qualcomm | ||
| manufacturer = | | manufacturer = | ||
| − | | type = | + | | type = System On Chips |
| first announced = March 1993 | | first announced = March 1993 | ||
| first launched = 1993 | | first launched = 1993 | ||
| Line 13: | Line 13: | ||
| production end = | | production end = | ||
| arch = Modem implementing CDMA | | arch = Modem implementing CDMA | ||
| − | | isa = | + | | isa = x86-16 |
| − | | microarch = | + | | microarch = 80186 |
| − | | word = | + | | word = 16 bit |
| proc = 800 nm | | proc = 800 nm | ||
| tech = CMOS | | tech = CMOS | ||
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| successor link = qualcomm/msm2 | | successor link = qualcomm/msm2 | ||
}} | }} | ||
| − | '''MSM1''' ('''Mobile Station Modem 1''') was [[ | + | '''MSM1''' ('''Mobile Station Modem 1''') was a second generation family of mobile [[system on chip]]s with [[CDMA]] [[modem]] capabilities designed by [[Qualcomm]] and introduced in [[1993]]. This chip is based on their first generation which was an R&D version only. |
== Overview == | == Overview == | ||
| Line 44: | Line 44: | ||
* Max power consumption 350 mW | * Max power consumption 350 mW | ||
* 5 V | * 5 V | ||
| + | |||
| + | |||
| + | {{stub}} | ||
Latest revision as of 16:55, 2 January 2017
| Qualcomm MSM1 | |
| Developer | Qualcomm |
| Type | System On Chips |
| Introduction | March 1993 (announced) 1993 (launch) |
| Architecture | Modem implementing CDMA |
| ISA | x86-16 |
| µarch | 80186 |
| Word size | 16 bit 2 octets
4 nibbles |
| Process | 800 nm 0.8 μm
8.0e-4 mm |
| Technology | CMOS |
| Package | QFP |
| Succession | |
| → | |
| MSM2 | |
MSM1 (Mobile Station Modem 1) was a second generation family of mobile system on chips with CDMA modem capabilities designed by Qualcomm and introduced in 1993. This chip is based on their first generation which was an R&D version only.
Overview[edit]
MSM1 was designed as a complete solution for portable or mobile cellular telephones implementing CDMA. The chip is a combined design of what was originally three independent integrated circuits that were fabricated in 1.2 µm. MSM1 supported full-duplex voice and data communication
- Die
- Package: Quad-flat-pack
- Die Size: 10.41 mm x 10.67 mm
- 450,000 transistors
- 28,000 bits of SRAM
- 70,000 logic gates
- Fabricated on a double-metal 0.8 µm CMOS process
- Max power consumption 350 mW
- 5 V
 |
This article is still a stub and needs your attention. You can help improve this article by editing this page and adding the missing information. |
Facts about "MSM1 - Qualcomm"
| designer | Qualcomm + |
| first announced | March 1993 + |
| first launched | 1993 + |
| full page name | qualcomm/msm1 + |
| instance of | system on a chip family + |
| instruction set architecture | x86-16 + |
| main designer | Qualcomm + |
| microarchitecture | 80186 + |
| name | Qualcomm MSM1 + |
| package | QFP + |
| process | 800 nm (0.8 μm, 8.0e-4 mm) + |
| technology | CMOS + |
| word size | 16 bit (2 octets, 4 nibbles) + |
