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Difference between revisions of "nervana/microarchitectures/spring crest"
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== Overview ==
 
== Overview ==
Spring Crest is the successor to {{\\|Knights Crest}} and is first commercial [[neural processor]] designed by Intel Nervana that made it to mass production. The chip itself is designed for training at the data center. Spring Crest is a data center training [[accelerator]], optimized for the fastest time-to-train and highest power efficiency.  
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Spring Crest is the successor to {{\\|Knights Crest}} and is first commercial [[neural processor]] designed by Intel Nervana that made it to mass production. The chip itself is designed for training at the data center. Spring Crest is a data center training [[accelerator]], optimized for the fastest time-to-train and highest power efficiency.
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== Tensor Processing Cluster (TPC) ==
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=== MAC Processing Unit (MPU) ===
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=== Memory Subsystem ===
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=== Network-on-Chip (NoC) ===
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== Scalability ==
 
== Scalability ==

Revision as of 19:31, 9 November 2019

Edit Values
Spring Crest µarch
General Info
Arch TypeNPU
DesignerNervana
ManufacturerIntel
Introduction2019
Process16 nm
PE Configs24
Succession

Spring Crest (SCR) is the successor to Lake Crest, a planned neural processor microarchitecture designed by Intel Nervana.

Produces based on Spring Crest are branded as the NNP L-1000 series.

Process Technology

Spring Crest is fabricated on TSMC's 16 nm process.

Architecture

Spring Crest largely builds on the prior generation but introduces more enhancements and compute.

Key changes from Lake Crest

This list is incomplete; you can help by expanding it.

Block Diagram

Chip

spring crest block diagram.svg

TCP

spring crest tpc block diagram.svg

Overview

Spring Crest is the successor to Knights Crest and is first commercial neural processor designed by Intel Nervana that made it to mass production. The chip itself is designed for training at the data center. Spring Crest is a data center training accelerator, optimized for the fastest time-to-train and highest power efficiency.

Tensor Processing Cluster (TPC)

New text document.svg This section is empty; you can help add the missing info by editing this page.

MAC Processing Unit (MPU)

New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory Subsystem

New text document.svg This section is empty; you can help add the missing info by editing this page.

Network-on-Chip (NoC)

New text document.svg This section is empty; you can help add the missing info by editing this page.

Scalability

New text document.svg This section is empty; you can help add the missing info by editing this page.

Package

  • 60 mm x 60 mm package
    • 6-2-6 layer stackup (BGA)
    • 3,325 pins
  • 1 die, 4 HBM 8 GiB stacks
intel nnp-l chip.png

Die


spring crest floorplan.png
codenameSpring Crest +
designerNervana +
first launched2019 +
full page namenervana/microarchitectures/spring crest +
instance ofmicroarchitecture +
manufacturerIntel +
nameSpring Crest +
process16 nm (0.016 μm, 1.6e-5 mm) +
processing element count24 +