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Xeon E-2276M - Intel
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Xeon E-2276M
coffee lake e (front).png
General Info
DesignerIntel
ManufacturerIntel
Model NumberE-2276M
Part NumberCL8068404068806
S-SpecSRFCK
MarketWorkstation, Server
IntroductionMay 27, 2019 (announced)
May 27, 2019 (launched)
Release Price$450.00 (tray)
ShopAmazon
General Specs
FamilyXeon E
SeriesE-2200
LockedYes
Frequency2,800 MHz
Turbo Frequency4,700 MHz (1 core)
Bus typeDMI 3.0
Bus rate4 × 8 GT/s
Clock multiplier28
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureCoffee Lake
PlatformMehlow
ChipsetCannon Point
Core NameCoffee Lake HR
Core Family6
Core SteppingR0
Process14 nm
TechnologyCMOS
Die149.6 mm²
Word Size64 bit
Cores6
Threads12
Max Memory128 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP45 W
cTDP down35 W
Tjunction0 °C – 100 °C
Packaging
PackageFCBGA-1440 (BGA)
Dimension42 mm × 28 mm × 1.46 mm
Contacts1440

Xeon E-2276M is a 64-bit hexa-core high-end performance x86 workstation microprocessor introduced by Intel in early 2019. This processor, which is based on the Coffee Lake microarchitecture, is manufactured on Intel's 3rd generation enhanced 14nm++ process. The E-2276M operates at 2.8 GHz with a TDP of 45 W and a turbo boost of up to 4.7 GHz. This chip integrates Intel's UHD Graphics P630 GPU operating at 350 MHz with a burst frequency of up to 1.2 GHz and supports up to 128 GiB of dual-channel DDR4-2666 memory.

This model has a configurable TDP-down of 35 W.


Cache

Main article: Coffee Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$384 KiB
393,216 B
0.375 MiB
L1I$192 KiB
196,608 B
0.188 MiB
6x32 KiB8-way set associative 
L1D$192 KiB
196,608 B
0.188 MiB
6x32 KiB8-way set associativewrite-back

L2$1.5 MiB
1,536 KiB
1,572,864 B
0.00146 GiB
  6x256 KiB4-way set associativewrite-back

L3$12 MiB
12,288 KiB
12,582,912 B
0.0117 GiB
  6x2 MiB16-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2666, LPDDR3-2133
Supports ECCYes
Max Mem128 GiB
Controllers1
Channels2
Max Bandwidth39.74 GiB/s
40,693.76 MiB/s
42.671 GB/s
42,670.5 MB/s
0.0388 TiB/s
0.0427 TB/s
Bandwidth
Single 19.87 GiB/s
Double 39.74 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 3.0
Max Lanes: 16
Configuration: 1x16, 2x8, 1x8+2x4
Facts about "Xeon E-2276M - Intel"
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Xeon E-2276M - Intel#pcie +
base frequency2,800 MHz (2.8 GHz, 2,800,000 kHz) +
bus links4 +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetCannon Point +
clock multiplier28 +
core count6 +
core family6 +
core nameCoffee Lake HR +
core steppingR0 +
designerIntel +
die area149.6 mm² (0.232 in², 1.496 cm², 149,600,000 µm²) +
familyXeon E +
first announcedMay 27, 2019 +
first launchedMay 27, 2019 +
full page nameintel/xeon e/e-2276m +
has ecc memory supporttrue +
has locked clock multipliertrue +
instance ofmicroprocessor +
isax86-64 +
isa familyx86 +
l1$ size384 KiB (393,216 B, 0.375 MiB) +
l1d$ description8-way set associative +
l1d$ size192 KiB (196,608 B, 0.188 MiB) +
l1i$ description8-way set associative +
l1i$ size192 KiB (196,608 B, 0.188 MiB) +
l2$ description4-way set associative +
l2$ size1.5 MiB (1,536 KiB, 1,572,864 B, 0.00146 GiB) +
l3$ description16-way set associative +
l3$ size12 MiB (12,288 KiB, 12,582,912 B, 0.0117 GiB) +
ldateMay 27, 2019 +
main imageFile:coffee lake e (front).png +
manufacturerIntel +
market segmentWorkstation + and Server +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory131,072 MiB (134,217,728 KiB, 137,438,953,472 B, 128 GiB, 0.125 TiB) +
max memory bandwidth39.74 GiB/s (40,693.76 MiB/s, 42.671 GB/s, 42,670.5 MB/s, 0.0388 TiB/s, 0.0427 TB/s) +
max memory channels2 +
microarchitectureCoffee Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberE-2276M +
nameXeon E-2276M +
packageFCBGA-1440 +
part numberCL8068404068806 +
platformMehlow +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 450.00 (€ 405.00, £ 364.50, ¥ 46,498.50) +
release price (tray)$ 450.00 (€ 405.00, £ 364.50, ¥ 46,498.50) +
s-specSRFCK +
seriesE-2200 +
smp max ways1 +
supported memory typeDDR4-2666 + and LPDDR3-2133 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count12 +
turbo frequency (1 core)4,700 MHz (4.7 GHz, 4,700,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +