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Difference between revisions of "intel/xeon e/e-2276m"
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Revision as of 09:22, 2 June 2019

Edit Values
Xeon E-2276M
coffee lake e (front).png
General Info
DesignerIntel
ManufacturerIntel
Model NumberE-2276M
Part NumberCL8068404068806
S-SpecSRFCK
MarketWorkstation, Server
IntroductionMay 27, 2019 (announced)
May 27, 2019 (launched)
Release Price$450.00 (tray)
ShopAmazon
General Specs
FamilyXeon E
SeriesE-2200
LockedYes
Frequency2,800 MHz
Turbo Frequency4,700 MHz (1 core)
Bus typeDMI 3.0
Bus rate4 × 8 GT/s
Clock multiplier28
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureCoffee Lake
PlatformMehlow
ChipsetCannon Point
Core NameCoffee Lake HR
Core Family6
Core SteppingR0
Process14 nm
TechnologyCMOS
Die149.6 mm²
Word Size64 bit
Cores6
Threads12
Max Memory128 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP45 W
cTDP down35 W
Tjunction0 °C – 100 °C
Packaging
PackageFCBGA-1440 (BGA)
Dimension42 mm × 28 mm × 1.46 mm
Contacts1440

Xeon E-2276M is a 64-bit hexa-core high-end performance x86 workstation microprocessor introduced by Intel in early 2019. This processor, which is based on the Coffee Lake microarchitecture, is manufactured on Intel's 3rd generation enhanced 14nm++ process. The E-2276M operates at 2.8 GHz with a TDP of 45 W and a turbo boost of up to 4.7 GHz. This chip integrates Intel's UHD Graphics P630 GPU operating at 350 MHz with a burst frequency of up to 1.2 GHz and supports up to 128 GiB of dual-channel DDR4-2666 memory.

This model has a configurable TDP-down of 35 W.


Cache

Main article: Coffee Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$384 KiB
393,216 B
0.375 MiB
L1I$192 KiB
196,608 B
0.188 MiB
6x32 KiB8-way set associative 
L1D$192 KiB
196,608 B
0.188 MiB
6x32 KiB8-way set associativewrite-back

L2$1.5 MiB
1,536 KiB
1,572,864 B
0.00146 GiB
  6x256 KiB4-way set associativewrite-back

L3$12 MiB
12,288 KiB
12,582,912 B
0.0117 GiB
  6x2 MiB16-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2666, LPDDR3-2133
Supports ECCYes
Max Mem128 GiB
Controllers1
Channels2
Max Bandwidth39.74 GiB/s
40,693.76 MiB/s
42.671 GB/s
42,670.5 MB/s
0.0388 TiB/s
0.0427 TB/s
Bandwidth
Single 19.87 GiB/s
Double 39.74 GiB/s

Expansions

[Edit/Modify Expansions Info]

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Expansion Options
PCIeRevision: 3.0
Max Lanes: 16
Configuration: 1x16, 2x8, 1x8+2x4


Graphics

[Edit/Modify IGP Info]

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Integrated Graphics Information
GPUUHD Graphics P630
DesignerIntelDevice ID0x3E94
Execution Units24Max Displays3
Max Memory64 GiB
65,536 MiB
67,108,864 KiB
68,719,476,736 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,200 MHz
1.2 GHz
1,200,000 KHz
OutputDP, eDP, HDMI, DVI

Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz

Standards
DirectX12
OpenGL4.5
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a

Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features

[Edit/Modify Supported Features]

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Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
TXTTrusted Execution Technology (SMX)
vProIntel vPro
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
TSXTransactional Synchronization Extensions
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
MWTMy WiFi Technology
SIPPStable Image Platform Program
IPTIdentity Protection Technology
Facts about "Xeon E-2276M - Intel"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Xeon E-2276M - Intel#pcie +
base frequency2,800 MHz (2.8 GHz, 2,800,000 kHz) +
bus links4 +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetCannon Point +
clock multiplier28 +
core count6 +
core family6 +
core nameCoffee Lake HR +
core steppingR0 +
designerIntel +
device id0x3E94 +
die area149.6 mm² (0.232 in², 1.496 cm², 149,600,000 µm²) +
familyXeon E +
first announcedMay 27, 2019 +
first launchedMay 27, 2019 +
full page nameintel/xeon e/e-2276m +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Transactional Synchronization Extensions +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, My WiFi Technology +, Stable Image Platform Program + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel speed shift technologytrue +
has intel stable image platform program supporttrue +
has intel supervisor mode execution protectiontrue +
has intel trusted execution technologytrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has transactional synchronization extensionstrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuUHD Graphics P630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,200 MHz (1.2 GHz, 1,200,000 KHz) +
integrated gpu max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isax86-64 +
isa familyx86 +
l1$ size384 KiB (393,216 B, 0.375 MiB) +
l1d$ description8-way set associative +
l1d$ size192 KiB (196,608 B, 0.188 MiB) +
l1i$ description8-way set associative +
l1i$ size192 KiB (196,608 B, 0.188 MiB) +
l2$ description4-way set associative +
l2$ size1.5 MiB (1,536 KiB, 1,572,864 B, 0.00146 GiB) +
l3$ description16-way set associative +
l3$ size12 MiB (12,288 KiB, 12,582,912 B, 0.0117 GiB) +
ldateMay 27, 2019 +
main imageFile:coffee lake e (front).png +
manufacturerIntel +
market segmentWorkstation + and Server +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory131,072 MiB (134,217,728 KiB, 137,438,953,472 B, 128 GiB, 0.125 TiB) +
max memory bandwidth39.74 GiB/s (40,693.76 MiB/s, 42.671 GB/s, 42,670.5 MB/s, 0.0388 TiB/s, 0.0427 TB/s) +
max memory channels2 +
microarchitectureCoffee Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberE-2276M +
nameXeon E-2276M +
packageFCBGA-1440 +
part numberCL8068404068806 +
platformMehlow +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 450.00 (€ 405.00, £ 364.50, ¥ 46,498.50) +
release price (tray)$ 450.00 (€ 405.00, £ 364.50, ¥ 46,498.50) +
s-specSRFCK +
seriesE-2200 +
smp max ways1 +
supported memory typeDDR4-2666 + and LPDDR3-2133 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count12 +
turbo frequency (1 core)4,700 MHz (4.7 GHz, 4,700,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +