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Difference between revisions of "hisilicon/kirin/980"
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|thread count=8
 
|thread count=8
 
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'''Kirin 980''' is a {{arch|64}} high-performance mobile [[ARM]] [[LTE]] SoC designed by [[HiSilicon]] and introduced in late 2018. Fabricated on TSMC's [[7 nm process]], the 980 incorporates four [[big cores|big]] {{armh|Cortex-A76|l=arch}} cores along with four [[little cores|little]] {{armh|Cortex-A55|l=arch}} cores operating at up to 2.8 GHz. This chip incorporates an ARM {{armh|Mali-G76}} and LPDDR4X-4266 memory.
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'''Kirin 980''' is a {{arch|64}} high-performance mobile [[ARM]] [[LTE]] SoC designed by [[HiSilicon]] and introduced in late 2018. Fabricated on TSMC's [[7 nm process]], the 980 incorporates four [[big cores|big]] {{armh|Cortex-A76|l=arch}} cores operating at up to 2.6 GHz along with four [[little cores|little]] {{armh|Cortex-A55|l=arch}} cores operating at up to 1.8 GHz. This chip incorporates an ARM {{armh|Mali-G76}} and LPDDR4X-4266 memory.
  
 
== Overview ==
 
== Overview ==
−
Introduced at the 2018 IFA, the overall core organization is identical to the {{\\|970|Kirin 970}} which was introduced the previous year, but features 40% power efficiency and 62.5% smaller [[die area]] due to the [[process shrink]]. The 980 ballooned to over 25% more transistors from 5.5 billion in the {{\\|970}} to 6.9 billion. The 980 adds many enhancements, including a more powerful {{armh|Mali G76}} GPU and incorporates a new dual-[[neural processor]] designed for [[AI]] acceleration. The 970 has two improved [[image signal processor|ISP]]s and a more powerful LTE modem supporting up to [[User Equipment]] (UE) category 21 capable of reaching a maximum downlink of 1.4 Gbps.
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Introduced at the 2018 IFA, the overall core organization has changed from the {{\\|970|Kirin 970}} which was introduced the previous year. The 970 features two high-performance [[big cores|big]] {{armh|Cortex-A76|l=arch}} core operating at 2.6 GHz, 2 medium-performance [[big cores|big]] {{armh|Cortex-A76|l=arch}} operating at 1.92 GHz, and four [[little cores|little]] {{armh|Cortex-A55|l=arch}} cores operating at 1.8 GHz. Compard to the {{\\|970|970}}, the 980 features 40% power efficiency and 62.5% smaller [[die area]] due to the [[process shrink]]. The 980 ballooned to over 25% more transistors from 5.5 billion in the {{\\|970}} to 6.9 billion. The 980 adds many enhancements, including a more powerful {{armh|Mali G76}} GPU and incorporates a new dual-[[neural processor]] designed for [[AI]] acceleration. The 970 has two improved [[image signal processor|ISP]]s and a more powerful LTE modem supporting up to [[User Equipment]] (UE) category 21 capable of reaching a maximum downlink of 1.4 Gbps.
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== Memory controller ==
 +
The Kirin 980 supports 4-channel LPDDR4X up to 2133 MHz. Each channel supports at most two ranks.
 +
 
 +
{{memory controller
 +
|type=LPDDR4X-4266
 +
|ecc=No
 +
|max mem=8 GiB
 +
|controllers=1
 +
|channels=4
 +
|width=16 bit
 +
|max bandwidth=31.78 GiB/s
 +
|bandwidth dchan=15.89 GiB/s
 +
|bandwidth qchan=31.78 GiB/s
 +
}}
 +
 
 +
== Graphics ==
 +
{{integrated graphics
 +
| gpu                = Mali-G76
 +
| designer            = ARM Holdings
 +
| execution units    = 10
 +
| max displays        = 2
 +
| max memory          =
 +
| frequency          = ? MHz
 +
| max frequency      =
 +
 
 +
| output crt          =
 +
| output sdvo        =
 +
| output dsi          = Yes
 +
| output edp          =
 +
| output dp          =
 +
| output hdmi        =
 +
| output vga          =
 +
| output dvi          =
 +
 
 +
| directx ver        = 12
 +
| opengl es ver      = 3.2
 +
| openvg ver        = 1.1
 +
| opencl ver        = 1.2
 +
| vulkan ver        = 1.0
 +
}}
 +
 
 +
== Wireless ==
 +
* LTE Modem
 +
** Up to [[User Equipment]] (UE) category 21
 +
*** Downlink of up to 1.4 Gbps
 +
*** Uplink of up to ?
 +
* Wi-Fi 802.11 ac Dual Band
 +
* Bluetooth 4.2
 +
* NFC
 +
* GPS / A-GPS / GLONASS / BDS
  
 
== Bibliography ==
 
== Bibliography ==
 
* Huawei Kirin 980 Keynote, 2018 IFA
 
* Huawei Kirin 980 Keynote, 2018 IFA

Revision as of 08:37, 31 August 2018

Edit Values
Kirin 980
General Info
DesignerHiSilicon,
ARM Holdings
ManufacturerTSMC
Model Number980
MarketMobile
IntroductionAugust 31, 2018 (announced)
August 31, 2018 (launched)
General Specs
FamilyKirin
Frequency2,600 MHz
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A76, Cortex-A55
Core NameCortex-A76, Cortex-A55
Process7 nm
Transistors6,900,000,000
TechnologyCMOS
Word Size64 bit
Cores8
Threads8

Kirin 980 is a 64-bit high-performance mobile ARM LTE SoC designed by HiSilicon and introduced in late 2018. Fabricated on TSMC's 7 nm process, the 980 incorporates four big Cortex-A76 cores operating at up to 2.6 GHz along with four little Cortex-A55 cores operating at up to 1.8 GHz. This chip incorporates an ARM Mali-G76 and LPDDR4X-4266 memory.

Overview

Introduced at the 2018 IFA, the overall core organization has changed from the Kirin 970 which was introduced the previous year. The 970 features two high-performance big Cortex-A76 core operating at 2.6 GHz, 2 medium-performance big Cortex-A76 operating at 1.92 GHz, and four little Cortex-A55 cores operating at 1.8 GHz. Compard to the 970, the 980 features 40% power efficiency and 62.5% smaller die area due to the process shrink. The 980 ballooned to over 25% more transistors from 5.5 billion in the 970 to 6.9 billion. The 980 adds many enhancements, including a more powerful Mali G76 GPU and incorporates a new dual-neural processor designed for AI acceleration. The 970 has two improved ISPs and a more powerful LTE modem supporting up to User Equipment (UE) category 21 capable of reaching a maximum downlink of 1.4 Gbps.

Memory controller

The Kirin 980 supports 4-channel LPDDR4X up to 2133 MHz. Each channel supports at most two ranks.

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-4266
Supports ECCNo
Max Mem8 GiB
Controllers1
Channels4
Width16 bit
Max Bandwidth31.78 GiB/s
32,542.72 MiB/s
34.124 GB/s
34,123.515 MB/s
0.031 TiB/s
0.0341 TB/s
Bandwidth
Double 15.89 GiB/s
Quad 31.78 GiB/s

Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUMali-G76
DesignerARM Holdings
Execution Units10Max Displays2
Frequency? MHz
"? MHz" is not a number.
OutputDSI
Standards
DirectX12
OpenCL1.2
OpenGL ES3.2
OpenVG1.1
Vulkan1.0

Wireless

  • LTE Modem
    • Up to User Equipment (UE) category 21
      • Downlink of up to 1.4 Gbps
      • Uplink of up to ?
  • Wi-Fi 802.11 ac Dual Band
  • Bluetooth 4.2
  • NFC
  • GPS / A-GPS / GLONASS / BDS

Bibliography

  • Huawei Kirin 980 Keynote, 2018 IFA
Retrieved from "https://en.wikichip.org/w/index.php?title=hisilicon/kirin/980&oldid=82024"
Facts about "Kirin 980 - HiSilicon"
RDF feed
base frequency2,600 MHz (2.6 GHz, 2,600,000 kHz) +
core count8 +
core nameCortex-A76 + and Cortex-A55 +
designerHiSilicon + and ARM Holdings +
familyKirin +
first announcedAugust 31, 2018 +
first launchedAugust 31, 2018 +
full page namehisilicon/kirin/980 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuMali-G76 +
integrated gpu designerARM Holdings +
integrated gpu execution units10 +
isaARMv8 +
isa familyARM +
ldate3000 +
manufacturerTSMC +
market segmentMobile +
max memory bandwidth31.78 GiB/s (32,542.72 MiB/s, 34.124 GB/s, 34,123.515 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels4 +
microarchitectureCortex-A76 + and Cortex-A55 +
model number980 +
nameKirin 980 +
process7 nm (0.007 μm, 7.0e-6 mm) +
supported memory typeLPDDR4X-4266 +
technologyCMOS +
thread count8 +
transistor count6,900,000,000 +
word size64 bit (8 octets, 16 nibbles) +