• cambricon/mlu/mlu100
  Cambricon also sells the MLU100 in a PCIe [[accelerator card]] form factor. The x16 PCIe card comes in two versions with a 16 GiB and a 32 GiB of DDR4
  2 KB (261 words) - 11:06, 21 April 2019
• supercomputers/summit
  ...cket. There are three V100 GPUs per POWER9 socket. Those use the SXM2 form factor and come with 16 GiB of HBM2 memory for a total of 48 GiB of HBM2 and 2.7 T
  9 KB (1,496 words) - 20:39, 21 July 2019
• nec/microarchitectures/sx-aurora
  ...bandwidth, and thus high [[bytes per FLOP]], while moving a smaller [[form factor]], it was necessary to drop the large amount of DDR memory channels. Instea
  16 KB (2,497 words) - 13:30, 15 May 2020
• nervana/nnp
  ...tecture from there. The inference chips use low-power PCIe, M.2, and ruler form factors designed for servers, workstations, and embedded applications. ...with 32 GiB of four [[HBM2]] stacks in a [[CoWoS]] package and come in two form factors: [[PCIe Gen 3]] and an [[OCP OAM]] [[accelerator card]].
  8 KB (1,145 words) - 12:42, 1 February 2020
• tesla (car company)/fsd chip
  ...o existing Tesla models and is therefore largely the same in terms of form factor and I/O. The computer itself fits just behind the glove compartment of the ...both FSD chips simultaneously for processing. The two chips independently form a future plan for the car - a detailed plan of what the car should do next.
  13 KB (1,952 words) - 20:34, 16 September 2023
• intel/microarchitectures/lakefield
  ...new class of compute devices with high performance in a mobile phone form factor. To that end, Lakefield barrows requirements from both desktop/laptop and s
  5 KB (769 words) - 06:44, 14 August 2021
• intel/microarchitectures/spring hill
  ...ght PCIe-driven [[accelerator card]] form factor such as [[M.2]]. The form factor and power envelope is selected for its ease of integration into existing in Spring Hill comes in a PCIe [[accelerator card]] form factor.
  9 KB (1,292 words) - 08:41, 26 March 2020
• habana/hl
  ...itecture. This chip ships in a number of products in a [[PCIe cards]] form factor. ...p ships in a number of products in both a [[PCIe card]] and an [[OCP OAM]] form factors. Habana also designed the HLS-1 system which incorporates eight HL-
  3 KB (362 words) - 12:32, 28 December 2019
• nervana/nnp/nnp-t 1300
  ...at up to 950 MHz. This chip comes in a PCIe 4.0 [[accelerator card]] form factor and incorporates 32 GiB of [[HBM2]] memory. This NPU exposes 16 {{nervana|S
  2 KB (294 words) - 10:51, 1 February 2020
• nervana/nnp/nnp-t 1400
  ...o 1.1 GHz. This chip comes in an [[OPC OAM|OAM]] [[accelerator card]] form factor and incorporates 32 GiB of [[HBM2]] memory. This NPU exposes 16 {{nervana|S
  2 KB (305 words) - 10:51, 1 February 2020
• nervana/nnp/nnp-i 1300
  ...itecture, the NNP-I 1300 comes in a PCIe Gen 3.0 [[accelerator card]] form factor with two NPU chips, each with all 24 {{intel|Spring Hill#Inference Compute
  2 KB (220 words) - 12:49, 1 February 2020
• nervana/nnp/nnp-i 1100
  ...at a TDP of 12 W. This chip comes in an [[M.2]] [[accelerator card]] form factor.
  2 KB (227 words) - 12:48, 1 February 2020
• amd/List of AMD publications
  ...System Considerations for Dual AMD Athlon™ MP Processors in Tower and 1U Form Factors]||2002-08-27|| ...s.amd.com/assets/pdf/amd_sff_whitepaper_final2.pdf White Paper: Small Form Factor Board Designs]||||R-Series Platform
  181 KB (24,861 words) - 16:02, 17 April 2022
• amd/packages/socket am2
  ...{{\\|Socket F}} for the server and workstation market. For the small form factor desktop, mobile and embedded market AMD developed package {{\\|ASB1}}. Sock
  7 KB (1,029 words) - 18:40, 22 February 2020
• amd/packages/socket am2+
  ...{{\\|Socket F}} for the server and workstation market. For the small form factor desktop, mobile and embedded market AMD developed package {{\\|ASB1}}. Sock
  8 KB (1,212 words) - 19:01, 22 February 2020
• amd/packages/socket am3
  ...{\\|Socket G34}} for the server and workstation market. For the small form factor desktop, mobile and embedded market AMD developed package {{\\|ASB2}}. Sock
  12 KB (1,960 words) - 12:23, 18 July 2020
• amd/packages/socket am3+
  ...{\\|Socket G34}} for the server and workstation market. For the small form factor desktop, mobile and embedded market AMD developed package {{\\|ASB2}}. Sock
  6 KB (822 words) - 15:01, 9 December 2022
• amd/packages/asb1
  integrated DDR2 memory controller targeting the small form factor desktop, mobile and embedded market.
  3 KB (481 words) - 16:24, 16 March 2023
• amd/packages/asb2
  integrated DDR3 memory controller targeting the small form factor desktop, mobile and embedded market.
  4 KB (527 words) - 16:25, 16 March 2023
• amd/packages/fp3
  * "White Paper: Small Form Factor Board Designs", AMD Publ. #54507, Rev. A
  5 KB (630 words) - 23:22, 25 March 2023

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