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Socket AM5
General Info
Designer	AMD
Market	Desktop
Microarchitecture	Zen 4
TDP	170 W 170,000 mW 0.228 hp 0.17 kW
Package
Name	AM5
Type	FC-OLGA
Contacts	1718
Dimension	40 mm 4 cm 1.575 in × 40 mm 4 cm 1.575 in
Pitch	0.81 mm 0.0319 in × 0.94 mm 0.037 in
Socket
Name	Socket AM5
Type	SM-LGA
Succession
Socket AM4

Socket AM5 is a microprocessor socket designed by AMD for their fifth generation Ryzen desktop processors with CPU cores based on the Zen 4 microarchitecture, the successor to Socket AM4. It has counterparts in Socket SP5 for servers and the FP7 package for the mobile market.

Overview

Socket AM5 is a zero insertion force, lever actuated, surface-mount land grid array socket for use with a 1718-contact, 0.81 mm × 0.94 mm interstitial pitch, organic land grid array CPU package.

The following AMD processor families use Socket AM5:

	x86 CPU Family	Microarch.	Process	Products
Type 1	Family 19h Models 40h–4Fh
Type 2	Family 19h Models 60h–6Fh
Type 3	Family 19h Models 70h–7Fh

Socket AM5 supports two channels of DDR5 memory with two 36-bit subchannels (32 bit data + 4 bit ECC) and up to 2 DIMMs per channel, up to 28 lanes PCIe Gen 4/5, four of which are reserved to attach the chipset, four USB 3.2 Gen 2 or USB4 ports, one USB 2.0 port, and four digital display interfaces. SATA ports are provided by the chipset.

This compares to two DDR4 channels, 20 + 4 lanes PCIe Gen 3/4, four USB3 ports, and three DDIs on its predecessor Socket AM4.

Package Description

The AM5 CPU package is lidded, has a 40 mm × 40 mm organic substrate with flip chip die attachment, and 1718 land pads. The socket is not designed to be functional with unlidded packages.

The substrate has two keying notches preventing it from being inserted rotated into the socket, or incidentally into Socket F or Socket C32, two much older AMD sockets for LGA packages of the same size. Different keying options for future models are not evident, in any case AM5 packages are also electrically keyed by pin AM5R1 and Socket AM5 motherboards are not supposed to power up the socket if an incompatible processor is installed. A triangular symbol on both sides of the substrate marks the location of pin A1, with corresponding markings on the socket.

Owing to the increase of contacts from 1331 on Socket AM4 to 1718, AM5 packages have a higher contact density with the same pitch as Socket SP5, no components on the bottom side, and a redesigned lid a.k.a. integrated heat spreader which arcs over some of the top side decoupling capacitors providing more space for components.

AM5 processors are SoCs with an integrated controller hub so Socket AM5 pins out various low speed interfaces. The LPC interface present on the prior generation was deprecated in favor of SPI/ESPI. These busses are generally used to access firmware (PSP ROM and BIOS) i.e. flash memory, and a TPM. It is worth noting that the PSP can also provide TPM services. Added were I³C, and DMIC e.g. for Wake-On-Voice.

AM5 processors implement a USB BIOS update function enabled by a momentary switch on the motherboard during boot-up.

Socket Description

Socket AM5 has a 67 mm × 106 mm footprint and consists of the following components:

• Force Frame
• Socket Housing
• Cam Actuation Lever
• Stiffener Frame
• Insulators
• Backplate

Socket AM5 processors also require a heatsink.

The force frame, stiffener frame, and cam lever constitute the Socket Actuation Mechanism for toolless installation of the CPU. The heatsink, CPU, SAM, housing, and backplate are separately orderable parts, the latter three motherboard components for OEMs. Socket AM5 suppliers are TBD.

LGA sockets use cantilever springs in the socket housing to make electrical contact with flat pads on the bottom of the CPU package. The SAM creates the Z-axis compression load between the CPU package and the housing soldered to the motherboard, and to this end is attached to the backplate on the bottom side of the motherboard.

The force frame and stiffener frame are stamped out of 1.2 mm thick stainless steel sheets. The cam lever is made from 2.5 mm stainless steel wire. The force frame has a window allowing the top of the CPU package lid to protrude for contact with the heatsink. When closed and actuated with the cam lever it applies a load to the flanges on the sides of the lid. Markings include the name of the socket, supplier, a triangular pin A1 identifier, and a lot code on the force frame or stiffener frame. The force frame is hinged to the stiffener frame.

The stiffener frame has a window fitting the socket housing and incorporates a latch securing the lever in the actuated position. Four captive screws with #6-32 thread and Torx drive mount the stiffener frame to self-clinching PEM nuts protruding up from the backplate through holes in the PCB. Backplates with different nut heights are available to account for different PCB thicknesses. Two 0.18 mm thick insulating sheets in the shape of these parts separate them from the PCB.

Like Socket SP3 and SP5 the SAM apparently includes an external cap protecting the contact springs when no processor is installed.

The socket housing is an injection-molded plastic part, likely made of black liquid-crystal polymer, and ships with a cover cap made of the same material which protects the contact springs and facilitates pick-and-place operation with a vacuum nozzle during board assembly. The housing outline is asymmetric, preventing the SAM and cover cap from being installed rotated. The walls have finger access cut-outs, keying features matching those on the CPU package, and a chamfered corner locating pin A1. Four undercut steps on the outside and an alignment hole suggest corresponding latches and an alignment peg on the cover cap. The springs extend into a J-lead at the bottom of the housing with solder balls attached for surface mounting. Standoffs limit the distance to the PCB.

Heatsink

The heatsink can be clipped onto a two-part retention frame made of plastic. The two-part design permits components closer to the socket and smaller boards. Each of the identical parts has an alignment peg preventing it from being installed rotated on the PCB which has correspondingly shaped through-holes. Two screws with #6-32 thread (like PC case screws; the closest metric substitute is the non-standard M3.5×0.8 thread) mount each part to a second set of taller PEM nuts, spaced 54 mm × 90 mm apart, which protrude up through the PCB from the backplate. Their height is some 5 mm leaving 4.34 mm headroom to the top of the package lid in the actuated socket. Heavier heatsinks can be attached directly to the backplate with four captive spring screws on the heatsink after removal of the retention frame. The positions of the retention frame latches and heatsink nuts are symmetric so the heatsink can be rotated 180 degrees.

The heatsink attachment facilities and the height of the processor in the actuated socket, 7.98 ± 0.60 mm from the top of the PCB to the top of the lid, are in line with Socket AM4 so heatsinks for that socket can be used.

Feature Summary

• Lidded land grid array package, 40 mm × 40 mm
  • 1718 contacts in a 44 × 41 grid, 0.81 mm × 0.94 mm interstitial pitch
  • Organic substrate, flip chip die attachment

• 2 × 64/72 bit DDR5 SDRAM interface
  • Data rate up to ?
  • Two DDR5 subchannels per DRAM channel, 32 bit data + 4 bit ECC
  • Up to 2 DIMMs/channel, up to 4 DIMMs total
  • SR/DR UDIMM or SO-DIMM types
  • Max. total memory capacity ? GiB using four ? GiB DIMMs

• PCIe Gen 4/5 (32 GT/s)
  • 16 lane graphics card interface, configurable 1x16, 2x8
  • 2 × 4 lanes general purpose (e.g. for M.2 NVME, PCIe slot, USB4 PCIe tunneling)
  • 4 lane chipset interface

• Up to four digital display interfaces
  • DP, eDP, SL DVI, HDMI protocols; LVDS and VGA via external DP to LVDS and DP to VGA translator
  • DP1-DP3 internally multiplexed with USBC0-USBC2 for DP Alt Mode

• Five USB ports from three or four USB controllers
  • 2 × USB 2.0, 3.2 Gen 1/2, USB4 (40 Gb/s), Type-C support, DP Alt Mode
  • 1 × USB 2.0, 3.2 Gen 1/2 (10 Gb/s), Type-C, DP Alt Mode
  • 1 × USB 2.0, 3.2 Gen 1/2 (10 Gb/s), Type-A
  • 1 × USB 2.0

• Low speed interfaces (some sharing pins):
  • HDA/SoundWire/DMIC
  • 2 × 1/2/4-bit SPI/eSPI
  • 4 × I³C/I²C
  • 2 × SMBus
  • Up to 55 GPIOs
  • Sideband Interface (SB-TSI)
  • Serial VID Interface (SVI3)
  • JTAG

Note some processor models support only a subset of these features.

Chipsets

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Processors using Socket AM5

Model	Family	Microarch.	Cores	Threads	L2$	L3$	Base	Turbo	Memory	TDP	Launched	Price	OPN
7700	Ryzen 7	Zen 4	8	16	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	3.8 GHz 3,800 MHz 3,800,000 kHz	5.3 GHz 5,300 MHz 5,300,000 kHz		65 W 65,000 mW 0.0872 hp 0.065 kW	10 January 2023	$ 339.00 € 305.10 £ 274.59 ¥ 35,028.87	100-000000592, 100-100000592BOX
7700X	Ryzen 7	Zen 4	8	16	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	4.5 GHz 4,500 MHz 4,500,000 kHz	5.4 GHz 5,400 MHz 5,400,000 kHz		105 W 105,000 mW 0.141 hp 0.105 kW	27 September 2022	$ 399.00 € 359.10 £ 323.19 ¥ 41,228.67	100-000000591, 100-100000591WOF
7950X3D	Ryzen 9	Zen 4	16	32	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	4.2 GHz 4,200 MHz 4,200,000 kHz	5.7 GHz 5,700 MHz 5,700,000 kHz		120 W 120,000 mW 0.161 hp 0.12 kW	28 February 2023	$ 699.00 € 629.10 £ 566.19 ¥ 72,227.67	100-000000908, 100-000000908WOF
Count: 3

Photos

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Package Diagrams

AM5 package. All dimensions in millimeters.

Socket Diagrams

Socket AM5 housing (AMD). All dimensions in millimeters.

Socket AM5 backplate. All dimensions in millimeters.

Socket AM5 PCB layout. NPTH = Non-Plated Through Hole. All dimensions in millimeters.

Pin Map

Socket AM5 pinout, top view. Click to flip and rotate.

Pin Description

Signal	Description
MA/MB_ALERT_L	DRAM Channel A/B Alert (CRC error and Command/Address parity error)
MA/MB_RESET_L	DRAM Channel A/B DIMM Reset
MAA/MAB/MBA/MBB_CA[13:0]	DRAM Channel A/B Subchannel A/B Command/Address Bus
MAA/MAB/MBA/MBB_CHECK[3:0]	DRAM Channel A/B Subchannel A/B ECC Check Byte
MAA/MAB/MBA/MBB_DATA[31:0]	DRAM Channel A/B Subchannel A/B Data Bus
MAA/MAB/MBA/MBB_DM[3:0]	DRAM Channel A/B Subchannel A/B Data Mask
MAA/MAB/MBA/MBB_DQS_H/L[4:0]	DRAM Channel A/B Subchannel A/B Data Strobe Differential Pair
MAA0/MAB0/MBA0/MBB0_CLK_H/L[1:0] MAA1/MAB1/MBA1/MBB1_CLK_H/L[1:0]	DRAM Channel A/B DIMM 0/1 Subchannel A/B Differential Clock
MAA0/MAB0/MBA0/MBB0_CS_L[1:0] MAA1/MAB1/MBA1/MBB1_CS_L[1:0]	DRAM Channel A/B DIMM 0/1 Subchannel A/B Chip Select
PCIE_RXP/RXN[27:0]	PCIe Receive Data Differential Pairs
PCIE_TXP/TXN[27:0]	PCIe Transmit Data Differential Pairs
PCIE_RST0_L	Reset for PCIe devices or SPI TPM
DP0-DP3_TXP/TXN[3:0]	DisplayPort 0-3 Main Link Differential Transmitter Lane 0-3 or DVI/HDMI Channel 2, 1, 0, Clock
DP0-DP3_AUXP/AUXN	DisplayPort 0-3 Auxiliary Channel or DVI/HDMI DDC Clock, Data
DP0-DP3_HPD	DisplayPort 0-3 Hot Plug Detect Input
DP0_BLON	Display Panel Backlight Enable
DP0_DIGON	Display Panel Power Enable
DP0_VARY_BL	Display Backlight Brightness Control
DP_STEREOSYNC	StereoSync output for shutter glasses
USBC(0-2)_RX1P/RX1N	USB Port 0-2 USB-C Receive Differential Pairs or DisplayPort Transmitter Lane 3
USBC(0-2)_TX1P/TX1N	USB Port 0-2 USB-C Transmit Differential Pairs or DisplayPort Transmitter Lane 2
USBC(0-2)_RX2P/RX2N	USB Port 0-2 USB-C Receive Differential Pairs or DisplayPort Transmitter Lane 0
USBC(0-2)_TX2P/TX2N	USB Port 0-2 USB-C Transmit Differential Pairs or DisplayPort Transmitter Lane 1
USB(0-3)_RXP/RXN	USB Port 0-3 USB3 Super Speed Receive Differential Pairs
USB(0-3)_TXP/TXN	USB Port 0-3 USB3 Super Speed Transmit Differential Pairs
USBC(0-2)_DP/DN USB(0-4)_DP/DN	USB Port 0-4 USB2 I/O Differential Pairs
USBC(0-1)_SBRX/SBTX	USB Port 0-1 USB4 Sideband Interface (alt. func. of DP1_AUX, DP2_AUX)
USBC_I2C_SCL	I2C Clock for USB-C PD Control
USBC_I2C_SDA	I2C Data for USB-C PD Control
USBC_PD_INT	USB-C Power Delivery Interrupt
USB_BIOS_UPDATE	USB BIOS Update Function (momentary switch)
USB_OC(0-3)_L	USB Over Current signal from USB connector
AZ_BITCLK	Azalia HD Audio Interface Bit Clock
AZ_RST_L	HDA Reset
AZ_SDIN(0-2)	HDA Serial Data Input from Codec 0-2
AZ_SDOUT	HDA Serial Data Output to Codec
AZ_SYNC	HDA Sync signal to Codec
DMIC_CLK	Digital Microphone Clock Output
DMIC_DATA0	DMIC Data Input (2 ch PDM)
DMIC_DATA1	DMIC Data (alt. func. of AZ_BITCLK or AZ_SDIN1)
DMIC_DATA2	DMIC Data (AZ_SYNC or AZ_SDIN2)
SW0_MCLK	SoundWire Interface 0 Clock (AZ_SDIN1)
SW0_MDATA(0-3)	SW0 Data (AZ_SDIN2, AZ_RST_L, AZ_SDOUT, AZ_SDIN0)
SW1_MCLK	SoundWire Interface 1 Clock (AZ_BITCLK)
SW1_MDATA0	SW1 Data (AZ_SYNC)
SPKR	PC speaker/beeper PWM output
SPI/SPI1_CLK	SPI Clock Output
SPI/SPI1_DAT[0]	SPI Data 0 for multi-I/O device or Data Out
SPI/SPI1_DAT[1]	SPI Data 1 for multi-I/O device or Data In
SPI/SPI1_DAT[3:2]	SPI Data 2, 3 for multi-I/O device
SPI/SPI1_CS(1-2)_L	Chip Select for SPI ROM
SPI_TPM_CS_L	Chip Select for SPI TPM
SPI_ROM_REQ	SPI ROM Request
SPI_ROM_GNT	SPI ROM Grant
ESPI_CLK	ESPI Clock Output
ESPI_DAT[3:0]	ESPI Data[0], Data[1:0], Data[3:0] Input/Output
ESPI_CS_L	ESPI Chip Select
ESPI_ALERT_L	ESPI Alert Input
ESPI_RESET_L	ESPI Reset Input (ESPI_RESET_L/KBRST_L)
I3C(0-3)_SCL	I3C Bus 0-3 Clock
I3C(0-3)_SDA	I3C Bus 0-3 Data
I2C(0-3)_SCL	I2C Bus 0-3 Clock (alt. func. of I3C0-I3C3)
I2C(0-3)_SDA	I2C Bus 0-3 Data
SMBUS(0-1)_SCL	SMBus 0-1 Clock (I3C2, I3C3)
SMBUS(0-1)_SDA	SMBus Data
AGPIO*	Advanced GPIO pin for interrupt, wake, or I/O
EGPIO*	Enhanced GPIO for I/O only
GENINT(1-2)_L	Generic Interrupt Request
GPP_CLK(0-5)P/N	100 MHz Differential PCIe Reference Clock Outputs
CLK_REQ(0-5)_L	PCIe Clock Request
X32K_X1/X2	32768 Hz Real Time Clock XTAL
X48M_X1/X2	48 MHz clock XTAL for the integrated clock generator
X48M_OSC	48 MHz clock output for devices requiring a single-ended OSC input
RTCCLK	32768 Hz Real Time Clock output for a device requiring an RTC clock
BLINK	Blink LED S-state Indicator
KBRST_L	Keyboard Controller Reset Input (warm reset)
PWR_GOOD	Power Good Input; Asserted when all voltages are within specification
PWR_BTN_L	Power Button Input; Requests sleep state or causes wake event
PWROK
RESET_L	Reset signal
RSMRST_L	Resume Reset; Asserted on power up, deasserted when S5 power supplies are within specification
S0A3_GPIO
SLP_S3/S5_L	S3/S5 Sleep State Power Plane Control Signals for voltage regulator
SYS_RESET_L	System Reset Input (reset button)
WAKE(0-3)_L	PCIe WAKE_L signal, wake system out of sleep state
WAKE(4-5)_L	PCIe WAKE_L signal (alt. func. of USB_OC1, USB_OC2)
ALERT_L	SB-TSI Interrupt
FANIN0	Fan 0 tachometer input
FANOUT0	Fan 0 PWM output
PROCHOT_L	Asserted to force the processor into HTC-active state
SIC	Sideband Interface (SB-TSI) Clock
SID	Sideband Interface Data
THERMTRIP_L	Temperature Trip Output
DBREQ_L	Debug Request input to JTAG controller
TCK	JTAG Clock
TDI	JTAG Data Input
TDO	JTAG Data Output
TMS	JTAG Mode Select
TRST_L	JTAG Reset
TEST*	Test/Debug signals
CCD_ANALOG_TEST
PCC_L
SVC	Serial VID Clock; (SVI3) interface to VDDCR/VDDCR_SOC regulator
SVD	Serial VID Data
SVT	Serial VID Telemetry
VDDBT_RTC_G	Integrated Real Time Clock battery power supply
VDDCR	Core power supply
VDDCR_SENSE	Differential (with VSS_SENSE_A) feedback for VDDCR regulator
VDDCR_SOC	Power supply for integrated Northbridge
VDDCR_SOC_SENSE	Differential (with VSS_SENSE_A) feedback for VDDCR_SOC regulator
VDDIO_AUDIO
VDDIO_MEM_S3
VDDIO_MEM_S3_SENSE
VDD_18	1.8 V supply voltage for analog circuits
VDD_18_S5	Always on 1.8 V supply voltage for analog circuits
VDD_33	3.3 V supply voltage
VDD_33_S5	Always on 3.3 V supply voltage
VDD_MISC	Power supply for DisplayPort and PCIe PHY logic
VDD_MISC_SENSE	Differential feedback for VDD_MISC regulator
VDD_MISC_S5	Power supply for USB physical layer
VDD_MISC_S5_SENSE	Differential (with VSS_SENSE_B) feedback for VDD_MISC_S5 regulator
VSS	Ground
VSS_SENSE_A	VSS Sense pin for VDDCR/VDDCR_SOC regulator
VSS_SENSE_B	VSS Sense pin for VDD_MISC regulator
AM5R1	Processor family revision identifier; NC = Not connected, VSS = connected to VSS on the package Processor AM5R1 Type-1/2/3 NC
AUX(0-5)_RST_L
OSCIN
RSVD	Reserved
SMU_ZVDD_ODPR(0-2)
TMU_CLK_OUT

See also

• Socket AM4
• Socket SP5