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Snapdragon 8cx
General Info
Designer	Qualcomm, ARM Holdings
Manufacturer	TSMC
Model Number	8cx
Part Number	SC8180X
Market	Mobile
Introduction	December 6, 2018 (announced) Q3, 2019 (launched)
General Specs
Family	Snapdragon 800, Snapdragon 8
Series	800
Locked	No
Frequency	1.8 GHz, 2.84 GHz
Bus speed	100 MHz
Clock multiplier	28x
Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A55, Cortex-A76
Core Name	Kryo 495 Silver, Kryo 495 Gold
Process	7 nm
Technology	CMOS
Word Size	64 bit
Cores	8
Threads	8
Max Memory	16 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Electrical
Vcore	0.5 V-0.95 V
TDP	7 W
Packaging
Succession
Snapdragon 850 Snapdragon 865
Contemporary
Snapdragon 8cx (Gen 2) Snapdragon 8cx (Gen 3)

Snapdragon 8cx (Snapdragon 8 Compute eXtreme) is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018.

Fabricated on TSMC's 7nm process, the 8cx features four Kryo 495 Silver high-efficiency cores operating at 1.8 GHz along with four high-performance Kryo 495 Gold operating at 2.84 GHz.

The Snapdragon 8cx integrates the Adreno 680 GPU operation at 585 MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of octa-channel LPDDR4X-4266 memory.

Models

• Snapdragon 8cx (SC8180X) • 7 nm (TSMC N7)

Kryo 495 Gold/Silver: 4x @2.84GHz Cortex-A76 + 4x @1.80GHz Cortex-A55)

• Adreno 680 @585 MHz • Hexagon 690 (9 TOPS) • Spectra 390 • Q3 2019

• Snapdragon 8cx (Gen 2 5G) (SC8180XP) • 7 nm (TSMC N7)

Kryo 495 4 + 4 cores (@3.15GHz Cortex-A76 + @1.8GHz Cortex-A55)

• Adreno 690 @660MHz • Hexagon 690 (9 TOPS) • Spectra 390 • Q3 2020

• Snapdragon 8cx (Gen 3) (SC8280) • 5 nm (Samsung 5LPE)

Kryo 4 + 4 cores (@3.0GHz Cortex-X1 + @2.40GHz Cortex-A78)

• Adreno 695 @900MHz • Hexagon (15 TOPS) • Spectra • Q1 2022

Overview

Block Diagram

The Snapdragon 8cx was announced by Qualcomm on December 6, 2018. The chip is what Qualcomm considers a new high tier Snapdragon aimed at always-connected PCs with higher performance and thermal headroom over traditional smartphone devices. The chip comprise of a quad-core cluster of Kryo 495 Gold (Cortex-A76) big cores and a quad-core cluster of Kryo 495 Silver (Cortex-A55) little cores.

Images

Cache

Main articles: Cortex-A76 § Cache and Cortex-A55

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L3$ 10 MiB 10,240 KiB 10,485,760 B 0.00977 GiB     1x10 MiB

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4X-4266 Supports ECC No Max Mem 16 GiB Frequency 2133 MHz Controllers 1 Channels 8 Width 16 bit Max Bandwidth 63.58 GiB/s 65,105.92 MiB/s 68.269 GB/s 68,268.505 MB/s 0.0621 TiB/s 0.0683 TB/s Bandwidth Single 7.95 GiB/s Double 15.89 GiB/s Quad 31.79 GiB/s Octa 63.58 GiB/s

• SSD: NVME SSD
• UFS: UFS 3.0

DSP

This chip features Qualcomm's Hexagon 685 DSP.

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Adreno 680 GPU Designer Qualcomm Max Displays 2 Frequency 585 MHz 0.585 GHz 585,000 KHz Burst Frequency 690 MHz 0.69 GHz 690,000 KHz Standards DirectX 12 OpenCL 2.0 OpenGL ES 3.2 Vulkan 1.1

• Codec Support: H.265 (HEVC), H.264 (AVC), VP9
• Playback: Up 4K HDR decode at 120fps
• Capture:
  • 4K Video Capture for Ultra HD Premium Displays (4K@30fps)
  • Slow Motion video capture (720p@480fps)

Camera

• ISP
  • Dual 14-bit ISPs
  • Qualcomm Spectra 390 image signal processor
  • Up to 16 MP dual camera
  • Up to 32 MP single camera

Connectivity

• X24 LTE modem
  • LTE Category 20
  • Downlink:
    • 2 Gbps peak
    • 7x20 MHz carrier aggregation
    • Up to 256-QAM
    • Up to 4x4 MIMO on five carriers
    • Full-Dimension MIMO (FD-MIMO)
    • Maximum 20 spatial streams
  • Uplink:
    • 316 Mbps peak
    • 3x20 MHz carrier aggregation
    • Up to 2x 106Mbps LTE streams
    • Up to 256-QAM
    • Uplink data compression
• LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

• WiFi
  • Standards: 802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
  • Spectral Bands: 2.4 GHz, 5 GHz, 60 GHz
  • MIMO Configuration: 2x2 (2-stream)

• Bluetooth
  • Bluetooth 5.0

Location

• Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Utilizing devices

Snapdragon 8cx • Q3 2019

• Lenovo Flex 5G
• Lenovo Yoga 5G
• Lenovo IdeaPad 5G
• Samsung Galaxy Book S

Snapdragon 8cx Gen 2 • Q3 2020

• Acer Spin 7
• Dell Inspiron 14
• HP Elite Folio
• Huawei MateBook E Go (LTE)
• Samsung Galaxy Book Go (5G)
• Xiaomi Book S

Snapdragon 8cx Gen 3 • Q4 2021

• Huawei MateBook E Go (Performance)
• Huawei MateBook E Go (2023) (2.69 GHz)
• Lenovo ThinkPad X13s
• Samsung Galaxy Book 2 Pro 360

Documents

• Product Brief