This is a quantity property representing the total area of an integrated circuit die. This value is the result of the product of property:die length * property:die width

Units:

• 1 mm²,square milimeters
• 0.01 cm²,square centimeters
• 0.00155 in²,square inches
• 1000000 µm²,square micrometers

See Also

• Property:die dimensions
• Property:die length
• Property:die width

Pages using the property "die area"

Showing 25 pages using this property.

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Ryzen 7 PRO 4750GE - AMD +	156 mm² 0.242 in² 1.56 cm² 156,000,000 µm²   +
Ryzen 7 PRO 4750U - AMD +	156 mm² 0.242 in² 1.56 cm² 156,000,000 µm²   +
Ryzen 9 4900H - AMD +	156 mm² 0.242 in² 1.56 cm² 156,000,000 µm²   +
Ryzen 9 4900HS - AMD +	156 mm² 0.242 in² 1.56 cm² 156,000,000 µm²   +
Ryzen Embedded V1202B - AMD +	209.78 mm² 0.325 in² 2.098 cm² 209,780,000 µm²   +
Ryzen Embedded V1605B - AMD +	209.78 mm² 0.325 in² 2.098 cm² 209,780,000 µm²   +
Ryzen Embedded V1756B - AMD +	209.78 mm² 0.325 in² 2.098 cm² 209,780,000 µm²   +
Ryzen Embedded V1807B - AMD +	209.78 mm² 0.325 in² 2.098 cm² 209,780,000 µm²   +
Ryzen Threadripper 1900X - AMD +	213 mm² 0.33 in² 2.13 cm² 213,000,000 µm²   +
Ryzen Threadripper 1920X - AMD +	213 mm² 0.33 in² 2.13 cm² 213,000,000 µm²   +
Ryzen Threadripper 1950X - AMD +	213 mm² 0.33 in² 2.13 cm² 213,000,000 µm²   +
Ryzen Threadripper 2920X - AMD +	213 mm² 0.33 in² 2.13 cm² 213,000,000 µm²   +
Ryzen Threadripper 2950X - AMD +	213 mm² 0.33 in² 2.13 cm² 213,000,000 µm²   +
Ryzen Threadripper 2970WX - AMD +	213 mm² 0.33 in² 2.13 cm² 213,000,000 µm²   +
Ryzen Threadripper 2990WX - AMD +	213 mm² 0.33 in² 2.13 cm² 213,000,000 µm²   +
S
Scorpio Engine - Microsoft +	359 mm² 0.556 in² 3.59 cm² 359,000,000 µm²   +
Snapdragon 845 - Qualcomm +	95 mm² 0.147 in² 0.95 cm² 95,000,000 µm²   +
Snapdragon 855 - Qualcomm +	73.27 mm² 0.114 in² 0.733 cm² 73,270,000 µm²   +
Snapdragon 855 Plus - Qualcomm +	73.27 mm² 0.114 in² 0.733 cm² 73,270,000 µm²   +
SpiNNaker - APT - The University of Manchester +	102 mm² 0.158 in² 1.02 cm² 102,000,000 µm²   +
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Tegra Xavier - Nvidia +	350 mm² 0.543 in² 3.5 cm² 350,000,000 µm²   +
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UltraSPARC-I 143MHz - Sun Microsystems +	310 mm² 0.481 in² 3.1 cm² 310,000,000 µm²   +
UltraSPARC-I 167MHz - Sun Microsystems +	310 mm² 0.481 in² 3.1 cm² 310,000,000 µm²   +
UltraSPARC-I 182MHz - Sun Microsystems +	310 mm² 0.481 in² 3.1 cm² 310,000,000 µm²   +
UltraSPARC-I 200MHz - Sun Microsystems +	310 mm² 0.481 in² 3.1 cm² 310,000,000 µm²   +