This is a quantity property representing the width of an integrated circuit die.

Units:

• 1 mm,milimeters
• 0.1 cm,centimeters
• 0.03937 in,inches
• 1000 µm,micrometers

See Also

• Property:die dimensions
• Property:die length
• Property:die area

Pages using the property "die width"

Showing 25 pages using this property.

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P
POWER9 02AA986 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY089 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY227 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY228 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY230 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY296 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY297 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY414 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY415 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY416 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY489 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
POWER9 02CY771 - IBM +	27.484 mm 2.748 cm 1.082 in 27,484.16 µm   +
R
R-Car H3 (SiP) - Renesas +	8.61 mm 0.861 cm 0.339 in 8,610 µm   +
R-Car H3 - Renesas +	8.61 mm 0.861 cm 0.339 in 8,610 µm   +
S
Snapdragon 855 - Qualcomm +	8.64 mm 0.864 cm 0.34 in 8,640 µm   +
Snapdragon 855 Plus - Qualcomm +	8.64 mm 0.864 cm 0.34 in 8,640 µm   +
SpiNNaker - APT - The University of Manchester +	9.786 mm 0.979 cm 0.385 in 9,786 µm   +
V
VC2588 - VTI +	7 mm 0.7 cm 0.276 in 7,000 µm   +
Vector Engine Type 10A - NEC +	33 mm 3.3 cm 1.299 in 33,000 µm   +
Vector Engine Type 10AE - NEC +	33 mm 3.3 cm 1.299 in 33,000 µm   +
Vector Engine Type 10B - NEC +	33 mm 3.3 cm 1.299 in 33,000 µm   +
Vector Engine Type 10BE - NEC +	33 mm 3.3 cm 1.299 in 33,000 µm   +
Vector Engine Type 10C - NEC +	33 mm 3.3 cm 1.299 in 33,000 µm   +
Vector Engine Type 10CE - NEC +	33 mm 3.3 cm 1.299 in 33,000 µm   +
VL2333 - VTI +	5.5 mm 0.55 cm 0.217 in 5,500 µm   +