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POWER9 02CY230 - IBM
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02CY230
General Info
DesignerIBM
ManufacturerGlobalFoundries
Model Number02CY230
Part Number02CY230
MarketServer, Workstation
IntroductionNovember, 2017 (announced)
November, 2017 (launched)
General Specs
FamilyPOWER
SeriesPOWER9
Frequency2.90 GHz
Turbo Frequency3.80 GHz
Microarchitecture
ISAPower ISA v3.0B (Power ISA)
MicroarchitecturePOWER9
Core NameSforza
Process14 nm
Transistors8,000,000,000
TechnologyCMOS
Die693.37 mm²
25.228 mm × 27.48416 mm
Word Size64 bit
Cores16
Threads64
Max CPUs2 (Multiprocessor)
Max Memory2 TiB
Electrical
TDP190 W
Tjunction0 °C – 85 °C
Packaging
PackageFCLGA-2601 (PLGA)
Dimension50 mm × 50 mm
Pitch1.016 mm
Contacts2601

POWER9 02CY230 is a 16-core POWER server and workstation microprocessor designed by IBM and introduced in late 2017. This chip is based on the POWER9 microarchitecture and is fabricated on GlobalFoundries 14nm SOI Process. The 02CY230 has a base frequency of 2.90 GHz with a bost frequency of 3.80 GHz and a TDP of 190 W.

Cache[edit]

Main article: POWER9 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
L1I$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
16x32 KiB8-way set associative 
L1D$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
16x32 KiB8-way set associative 

L2$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  8x512 KiB8-way set associative 

L3$80 MiB
81,920 KiB
83,886,080 B
0.0781 GiB
  8x10 MiB20-way set associative 

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2666
Supports ECCNo
Max Mem2 TiB
Controllers2
Channels8
Max Bandwidth158.95 GiB/s
Bandwidth
Single 19.87 GiB/s
Double 39.74 GiB/s
Quad 79.47 GiB/s
Octa 158.95 GiB/s
[Edit] Memory Configurations
Configuration Speed
One DIMM per channel 2666 MHz
Two DIMMs per channel 2400 MHz

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 4.0
Max Lanes: 48
Configuration: x16, x8, x4


Die[edit]

See also: POWER9 § Die

A die shot of IBM's 22-core server microprocessor used in this part:

power9 so die.png


power9 so die (annotated).png
Facts about "POWER9 02CY230 - IBM"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
POWER9 02CY230 - IBM#pcie +
base frequency2,900 MHz (2.9 GHz, 2,900,000 kHz) +
core count16 +
core nameSforza +
designerIBM +
die area693.37 mm² (1.075 in², 6.934 cm², 693,370,000 µm²) +
die length25.228 mm (2.523 cm, 0.993 in, 25,228 µm) +
die width27.484 mm (2.748 cm, 1.082 in, 27,484.16 µm) +
familyPOWER +
first announcedNovember 2017 +
first launchedNovember 2017 +
full page nameibm/power/02cy230 +
has ecc memory supportfalse +
instance ofmicroprocessor +
isaPower ISA v3.0B +
isa familyPower ISA +
l1$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l1d$ description8-way set associative +
l1d$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l1i$ description8-way set associative +
l1i$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l2$ description8-way set associative +
l2$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
l3$ description20-way set associative +
l3$ size80 MiB (81,920 KiB, 83,886,080 B, 0.0781 GiB) +
ldateNovember 2017 +
manufacturerGlobalFoundries +
market segmentServer + and Workstation +
max cpu count2 +
max junction temperature358.15 K (85 °C, 185 °F, 644.67 °R) +
max memory2,097,152 MiB (2,147,483,648 KiB, 2,199,023,255,552 B, 2,048 GiB, 2 TiB) +
max memory channels8 +
microarchitecturePOWER9 +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model number02CY230 +
name02CY230 +
packageFCLGA-2601 +
part number02CY230 +
process14 nm (0.014 μm, 1.4e-5 mm) +
seriesPOWER9 +
supported memory typeDDR4-2666 +
tdp190 W (190,000 mW, 0.255 hp, 0.19 kW) +
technologyCMOS +
thread count64 +
transistor count8,000,000,000 +
turbo frequency3,800 MHz (3.8 GHz, 3,800,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +