This is a quantity property representing the length of an integrated circuit die.

Units:

• 1 mm,milimeters
• 0.1 cm,centimeters
• 0.03937 in,inches]
• 1000 µm,micrometers

See Also

• Property:die dimensions
• Property:die width
• Property:die area

Pages using the property "die length"

Showing 25 pages using this property.

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P
POWER9 02AA986 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY089 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY227 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY228 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY230 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY296 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY297 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY414 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY415 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY416 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY417 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY489 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
POWER9 02CY771 - IBM +	25.228 mm 2.523 cm 0.993 in 25,228 µm   +
R
R-Car H3 (SiP) - Renesas +	12.94 mm 1.294 cm 0.509 in 12,940 µm   +
R-Car H3 - Renesas +	12.94 mm 1.294 cm 0.509 in 12,940 µm   +
S
Snapdragon 855 - Qualcomm +	8.48 mm 0.848 cm 0.334 in 8,480 µm   +
Snapdragon 855 Plus - Qualcomm +	8.48 mm 0.848 cm 0.334 in 8,480 µm   +
SpiNNaker - APT - The University of Manchester +	10.386 mm 1.039 cm 0.409 in 10,386 µm   +
V
VC2588 - VTI +	7 mm 0.7 cm 0.276 in 7,000 µm   +
Vector Engine Type 10A - NEC +	14.96 mm 1.496 cm 0.589 in 14,960 µm   +
Vector Engine Type 10AE - NEC +	14.96 mm 1.496 cm 0.589 in 14,960 µm   +
Vector Engine Type 10B - NEC +	14.96 mm 1.496 cm 0.589 in 14,960 µm   +
Vector Engine Type 10BE - NEC +	14.96 mm 1.496 cm 0.589 in 14,960 µm   +
Vector Engine Type 10C - NEC +	14.96 mm 1.496 cm 0.589 in 14,960 µm   +
Vector Engine Type 10CE - NEC +	14.96 mm 1.496 cm 0.589 in 14,960 µm   +