Snapdragon 8cx - Qualcomm

	Edit Values
	Snapdragon 8cx
	General Info
Designer	Qualcomm,; ARM Holdings
Manufacturer	TSMC
Model Number	8cx
Market	Mobile
Introduction	December 6, 2018 (announced); Q3, 2019 (launched)
	General Specs
Family	Snapdragon 800
Series	800
	Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A76, Cortex-A55
Core Name	Kryo 495 Gold, Kryo 495 Silver
Process	7 nm
Technology	CMOS
Word Size	64 bit
Cores	8
Threads	8
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Electrical
TDP	7 W
	Packaging
	Succession
	Snapdragon 850

Snapdragon 8cx (Snapdragon 8 Compute eXtreme) is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018. Fabricated on TSMC's 7nm process, the 8cx features four Kryo 495 Silver high-efficiency cores operating at ? GHz along with four high-performance Kryo 495 Gold operating at ? GHz. The Snapdragon 8cx integrates the Adreno 680 GPU operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to ? GiB of octa-channel LPDDR4X-4266 memory.

Overview

Block Diagram

The Snapdragon 8cx was announced by Qualcomm on December 6, 2018. The chip is what Qualcomm considers a new high tier Snapdragon aimed at always-connected PCs with higher performance and thermal headroom over traditional smartphone devices. The chip comprise of a quad-core cluster of Kryo 495 Gold (Cortex-A76) big cores and a quad-core cluster of Kryo 495 Silver (Cortex-A55) little cores.

Cache

Main articles: Cortex-A76 § Cache and Cortex-A55

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L3$

10 MiB

10,240 KiB
10,485,760 B
0.00977 GiB

		1x10 MiB

Memory controller

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	LPDDR4X-4266
Supports ECC	No
Max Mem	16 GiB
Frequency	2133 MHz
Controllers	1
Channels	8
Width	16 bit
Max Bandwidth	63.58 GiB/s 65,105.92 MiB/s 68.269 GB/s 68,268.505 MB/s 0.0621 TiB/s 0.0683 TB/s
Bandwidth	Single 7.95 GiB/s Double 15.89 GiB/s Quad 31.79 GiB/s Octa 63.58 GiB/s

SSD: NVME SSD
UFS: UFS 3.0

DSP

This chip features Qualcomm's Hexagon 685 DSP.

Graphics

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

Adreno 680 GPU

Designer

Qualcomm

Max Displays

2

Frequency

? MHz

"? MHz" is not a number.

Standards

DirectX	12
OpenCL	2.0
OpenGL ES	3.2
Vulkan	1.1

Codec Support: H.265 (HEVC), H.264 (AVC), VP9
Playback: Up 4K HDR decode at 120fps
Capture:
- 4K Video Capture for Ultra HD Premium Displays (4K@30fps)
- Slow Motion video capture (720p@480fps)

Camera

ISP
- Dual 14-bit ISPs
- Qualcomm Spectra 390 image signal processor
- Up to 16 MP dual camera
- Up to 32 MP single camera

Connectivity

X24 LTE modem
- LTE Category 20
- Downlink:
  - 2 Gbps peak
  - 7x20 MHz carrier aggregation
  - Up to 256-QAM
  - Up to 4x4 MIMO on five carriers
  - Full-Dimension MIMO (FD-MIMO)
  - Maximum 20 spatial streams
- Uplink:
  - 316 Mbps peak
  - 3x20 MHz carrier aggregation
  - Up to 2x 106Mbps LTE streams
  - Up to 256-QAM
  - Uplink data compression
LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

WiFi
- Standards: 802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
- Spectral Bands: 2.4 GHz, 5 GHz, 60 GHz
- MIMO Configuration: 2x2 (2-stream)

Bluetooth
- Bluetooth 5.0

Location

Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Utilizing devices

Galaxy Book S

Documents

Product Brief

back image	+
base frequency	1,800 MHz (1.8 GHz, 1,800,000 kHz) +, 2,840 MHz (2.84 GHz, 2,840,000 kHz) + and 3,020 MHz (3.02 GHz, 3,020,000 kHz) +
bus speed	100 MHz (0.1 GHz, 100,000 kHz) +
core count	8 +
core name	Kryo 495 Gold + and Kryo 495 Silver +
core voltage (max)	0.95 V (9.5 dV, 95 cV, 950 mV) +
core voltage (min)	0.5 V (5 dV, 50 cV, 500 mV) +
designer	Qualcomm + and ARM Holdings +
dsp	Hexagon 685 DSP +
family	Snapdragon 800 +
first announced	December 6, 2018 +
first launched	March 2019 +
full page name	qualcomm/snapdragon 800/8cx +
has ecc memory support	false +
has locked clock multiplier	false +
instance of	microprocessor +
integrated gpu	Adreno 680 GPU +
integrated gpu designer	Qualcomm +
isa	ARMv8 +
isa family	ARM +
l3$ size	10 MiB (10,240 KiB, 10,485,760 B, 0.00977 GiB) +
ldate	3000 +
main image	+
manufacturer	TSMC +
market segment	Mobile +
max cpu count	1 +
max memory bandwidth	63.58 GiB/s (65,105.92 MiB/s, 68.269 GB/s, 68,268.505 MB/s, 0.0621 TiB/s, 0.0683 TB/s) +
max memory channels	8 +
microarchitecture	Cortex-A76 + and Cortex-A55 +
model number	8cx +
name	Snapdragon 8cx +
process	7 nm (0.007 μm, 7.0e-6 mm) +
series	800 +
smp max ways	1 +
supported memory type	LPDDR4X-4266 +
tdp	7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
technology	CMOS +
thread count	8 +
used by	Galaxy Book S +
word size	64 bit (8 octets, 16 nibbles) +

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