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Snapdragon 670
General Info
Designer	Qualcomm, ARM Holdings
Manufacturer	Samsung
Model Number	SDM670
Market	Mobile
Introduction	August 8, 2018 (announced) August 8, 2018 (launched)
General Specs
Family	Snapdragon 600
Frequency	2,200 MHz, 1,700 MHz
Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A75, Cortex-A55
Core Name	Kryo 360 Gold, Kryo 360 Silver
Process	10 nm
Technology	CMOS
Word Size	64 bit
Cores	8
Threads	8
Max Memory	8 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)

Snapdragon 670 is a mid-range 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in mid-2018. Fabricated on Samsung's 10nm LPP process, the 670 features six Kryo 360 Silver high-efficiency cores operating at 1.7 GHz along with two high-performance Kryo 360 Gold operating at 2 GHz. The Snapdragon 670 integrates the Adreno 615 GPU and features an X12 LTE modem supporting Cat 13 uplink and Cat 15 downlink. This chip supports up to 8 GiB of dual-channel LPDDR4X-3733 memory.

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4X-3733 Supports ECC No Max Mem 8 GiB Frequency 1866 MHz Controllers 1 Channels 2 Width 16 bit Max Bandwidth 13.91 GiB/s 14,243.84 MiB/s 14.936 GB/s 14,935.749 MB/s 0.0136 TiB/s 0.0149 TB/s Bandwidth Single 6.95 GiB/s Double 13.91 GiB/s

DSP

This chip features Qualcomm's Hexagon 685 DSP with a Hexagon Vector Processor.

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Adreno 615 Designer Qualcomm Output DSI Standards DirectX 12 OpenCL 2.0 OpenGL ES 3.2 Vulkan 1.0

• Hardware Acceleration
• 4K HDR video playback (10-bit color depth, Rec. 2020 color gamut)
• Decode: H.264 (AVC), H.265 (HEVC) and VP9

• Up to 4K Ultra HD video capture @ 30FPS
• Up to 1080p video capture @120 FPS

Audio

• Aqstic audio codec and Aqstic smart speaker amplifier
  • Up to native DSD support, PCM up to 384 kHz/32-bit
• Qualcomm aptX audio playback with support for aptX Classic and HD

ISP

• Qualcomm Spectra 250 image sensor processor

• 2x Image Sensor Processor (ISP)
• 14-bit

Megapixel:

• Up to 16 MP dual camera
• Up to 25 MP single camera

Connectivity

• WiFi
  • Integrated 802.11ac 2 x 2 with MU-MIMO
  • Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual Band Simultaneous (DBS) + 60 GHz
• Bluetooth 5.0
• RF Front End
• LTE Modem
  • Snapdragon X15
    • Downlink:
      • Category 15 up to 800 Mbps
      • 3 x 20 MHz carrier aggregation, up to 256-QAM
      • Up to 4 x 4 MIMO on two aggregated carriers
    • Uplink:
      • Category 13 up to 150 Mbps
      • 2 x 20 MHz carrier aggregation, up to 64-QAM

Location

• GPS
  • Glonass, BeiDou, Galileo, QZSS, and SBAS
• Low power geofencing and tracking, sensor assisted navigation

Utilizing devices

This list is incomplete; you can help by expanding it.

Documents

• Product Brief