Qualcomm MSM1
Developer	Qualcomm
Introduction	March 1993 (announced) 1993 (launch)
Architecture	Modem implementing CDMA
Process	800 nm 0.8 μm 8.0e-4 mm
Technology	CMOS
Package	QFP
Succession
	→
	MSM2

MSM1 (Mobile Station Modem 1) was Qualcomm's second generation of mobile chipsets implementing a CDMA modem on a chip. This chip is based on their first generation which was an R&D version only (composed of multiple chips).

Overview

MSM1 was designed as a complete solution for portable or mobile cellular telephones implementing CDMA. The chip is a combined design of what was originally three independent integrated circuits that were fabricated in 1.2 µm. MSM1 supported full-duplex voice and data communication

• Die
  • Package: Quad-flat-pack
  • Die Size: 10.41 mm x 10.67 mm
  • 450,000 transistors
    • 28,000 bits of SRAM
    • 70,000 logic gates
  • Fabricated on a double-metal 0.8 µm CMOS process
• Max power consumption 350 mW
• 5 V