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Socket TR4 (sTR4) - Packages - AMD
Edit Values | |
Socket TR4 | |
General Info | |
Designer | AMD |
Introduction | May 16, 2017 (announced) August 10, 2017 (launched) |
Market | Desktop |
Microarchitecture | Zen, Zen+ |
TDP | 180 W 180,000 mW , 250 W0.241 hp 0.18 kW 250,000 mW 0.335 hp 0.25 kW |
Package | |
Name | FCLGA-4094 |
Type | Organic Flip-Chip Land Grid Array |
Contacts | 4094 |
Dimension | 58.5 mm 5.85 cm × 75.4 mm2.303 in 7.54 cm 2.969 in |
Pitch | 1.00 mm 0.0394 in |
Socket | |
Name | Socket TR4, sTR4, Socket SP3r2 |
Type | LGA |
Socket TR4 (sTR4) also Socket SP3r2 is a land grid array microprocessor socket designed by AMD for their Threadripper family supported by the Zen and Zen+ microarchitectures. This socket is designed for ICs with a 4094-contact FCLGA packages.
Contents
Overview
sTR4 is a socket specifically designed by AMD for their Threadripper family of HEDT processors and is supported by processors based on the Zen and Zen+ microarchitectures. Physically, the package is identical to the one used for Socket SP3 for their EPYC processors, however the features are much reduced.
Supported Processors
Package Diagram
Pin Map
Socket SP3/TR4 Differences
Pin | Socket SP3r1 | Socket SP3r2/TR4 |
---|---|---|
E25 | AGPIO23_1/SGPIO1_LOAD/MDIO3_SDA | RSVD |
E28 | AGPIO23_2/SGPIO2_LOAD/MDIO5_SDA | EGPIO23_1/SGPIO1_LOAD/MDIO3_SDA |
CY42 | AGPIO23_3/SGPIO3_LOAD/MDIO7_SDA | RSVD |
D24 | AGPIO40_1/SGPIO1_DATAIN/MDIO2_SDA | RSVD |
D27 | AGPIO40_2/SGPIO2_DATAIN/MDIO4_SDA | EGPIO40_1/SGPIO1_DATAIN/MDIO2_SDA |
DB44 | AGPIO40_3/SGPIO3_DATAIN/MDIO6_SDA | RSVD |
D25 | AGPIO9_1/SGPIO1_DATAOUT/MDIO3_SCL | RSVD |
D28 | AGPIO9_2/SGPIO2_DATAOUT/MDIO5_SCL | EGPIO9_1/SGPIO1_DATAOUT/MDIO3_SCL |
CY41 | AGPIO9_3/SGPIO3_DATAOUT/MDIO7_SCL | RSVD |
E40 | BP0 | TEST14 |
E41 | BP1 | TEST15 |
D21 | BP2 | TEST16 |
C20 | BP3 | TEST17 |
C22 | BP4 | RSVD |
C23 | BP5 | RSVD |
misc. | G1 interface | All pins RSVD |
P29 | G1B_ZVSS | USB_1_3_ZVSS |
misc. | G2 interface | G1 interface |
misc. | G3 interface | All pins RSVD |
K28 | G3A_ZVSS | USB_1_2_ZVSS |
DB20 | GPP_CLK0BN | GPP_CLK01N |
DA19 | GPP_CLK0BP | GPP_CLK01P |
DB18 | GPP_CLK0TN | GPP_CLK10N |
DA18 | GPP_CLK0TP | GPP_CLK10P |
B42 | GPP_CLK1BN | GPP_CLK13N |
A41 | GPP_CLK1BP | GPP_CLK13P |
C41 | GPP_CLK1TN | GPP_CLK12N |
C40 | GPP_CLK1TP | GPP_CLK12P |
A37 | GPP_CLK2BN | GFX_CLK11N |
B37 | GPP_CLK2BP | GFX_CLK11P |
C38 | GPP_CLK2TN | GFX_CLK10N |
C37 | GPP_CLK2TP | GFX_CLK10P |
DB35 | GPP_CLK3BN | GPP_CLK03N |
DA34 | GPP_CLK3BP | GPP_CLK03P |
CY36 | GPP_CLK3TN | GPP_CLK02N |
CY35 | GPP_CLK3TP | GPP_CLK02P |
misc. | Memory channel B | All pins RSVD with the following exceptions |
AR40 | MB0_CKE[0] (DRAM Clock Enable) | VSS |
AP41 | MB0_CKE[1] | VSS |
AT39 | MB1_CKE[0] | VSS |
AR39 | MB1_CKE[1] | VSS |
BB43 | MB_ANALOGOUT | USB_0_OC3_L/AGPIO24_0 |
AP39 | MB_RESET_L | VSS |
misc. | Memory channel C | All pins RSVD with the following exceptions |
AN47 | MC0_CKE[0] | VSS |
AM48 | MC0_CKE[1] | VSS |
AP46 | MC1_CKE[0] | VSS |
AN46 | MC1_CKE[1] | VSS |
BB46 | MC_ANALOGOUT | USB_0_OC2_L/AGPIO18_0 |
A47 | MC_DATA[0] | GPP_CLK11P |
CM46 | MC_DATA[49] | FANIN0/AGPIO84_0/NMI |
CT48 | MC_DATA[50] | CLK_REQ0_0_L/AGPIO92_0 |
CT46 | MC_DATA[51] | SATA_ACT_0_L/AGPIO130_0 |
CR47 | MC_DATA[54] | CLK_REQ2_0_L/AGPIO116_0 |
CR46 | MC_DATA[55] | CLK_REQG_0_L/OSCIN/EGPIO132_0 |
CV48 | MC_DATA[56] | SPKR/AGPIO91 |
CV46 | MC_DATA[57] | AZ_SDOUT |
DA46 | MC_DATA[58] | AZ_SYNC |
DB46 | MC_DATA[59] | AGPIO8 |
A46 | MC_DATA[5] | GPP_CLK11N |
DA47 | MC_DATA[62] | AZ_BITCLK |
CN47 | MC_DQS_H[15] | FANOUT0/AGPIO85_0 |
CW47 | MC_DQS_H[16] | AZ_SDIN2 |
CP46 | MC_DQS_H[6] | CLK_REQ3_0_L/EGPIO131_0 |
CY46 | MC_DQS_H[7] | AZ_RST_L |
CP48 | MC_DQS_L[15] | CLK_REQ1_0_L/AGPIO115_0 |
CY48 | MC_DQS_L[16] | AZ_SDIN0 |
CN46 | MC_DQS_L[6] | GENINT2_L/AGPIO90 |
CW46 | MC_DQS_L[7] | AZ_SDIN1 |
AM46 | MC_RESET_L | VSS |
misc. | Memory channel D | Memory channel B |
misc. | Memory channel E | Memory channel C |
misc. | Memory channel F | All pins RSVD with the following exceptions |
BH16 | MF0_CKE[0] | VSS |
BJ15 | MF0_CKE[1] | VSS |
BG17 | MF1_CKE[0] | VSS |
BH17 | MF1_CKE[1] | VSS |
BA13 | MF_ANALOGOUT | USB_1_OC3_L/EGPIO24_1 |
BJ17 | MF_RESET_L | VSS |
misc. | Memory channel G | All pins RSVD with the following exceptions |
BK9 | MG0_CKE[0] | VSS |
BL8 | MG0_CKE[1] | VSS |
BJ10 | MG1_CKE[0] | VSS |
BK10 | MG1_CKE[1] | VSS |
BA10 | MG_ANALOGOUT | USB_1_OC2_L/EGPIO18_1 |
DB9 | MG_DATA[0] | USB_0_HSD3N |
CL10 | MG_DATA[10] | CLK_REQG_1_L/EGPIO132_1 |
CL8 | MG_DATA[11] | SATA_ACT_1_L/EGPIO130_1 |
CT10 | MG_DATA[12] | CLK_REQ3_1_L/EGPIO131_1 |
CT9 | MG_DATA[13] | EGPIO92_1 |
CM10 | MG_DATA[14] | CLK_REQ2_1_L/EGPIO116_1 |
CM9 | MG_DATA[15] | CLK_REQ1_1_L/EGPIO115_1 |
DA8 | MG_DATA[1] | USB_0_HSD3P |
DA10 | MG_DATA[4] | USB_0_HSD2P |
B10 | MG_DATA[58] | USB_1_HSD2P |
A10 | MG_DATA[59] | USB_1_HSD2N |
DB10 | MG_DATA[5] | USB_0_HSD2N |
F9 | MG_DATA[60] | FANIN1/EGPIO84_1 |
F10 | MG_DATA[61] | FANOUT1/EGPIO85_1 |
B9 | MG_DATA[62] | USB_1_HSD3P |
A9 | MG_DATA[63] | USB_1_HSD3N |
CW8 | MG_DQS_H[0] | USB_0_SS_3TXP |
CP10 | MG_DQS_H[10] | USB_0_SS_2RXP |
K9 | MG_DQS_H[15] | USB_1_SS_2RXN |
D9 | MG_DQS_H[16] | USB_1_SS_2TXP |
CN8 | MG_DQS_H[1] | USB_0_SS_3RXN |
J10 | MG_DQS_H[6] | USB_1_SS_3RXP |
C10 | MG_DQS_H[7] | USB_1_SS_3TXN |
CY10 | MG_DQS_H[9] | USB_0_SS_2TXN |
CY9 | MG_DQS_L[0] | USB_0_SS_3TXN |
CN10 | MG_DQS_L[10] | USB_0_SS_2RXN |
J8 | MG_DQS_L[15] | USB_1_SS_2RXP |
C8 | MG_DQS_L[16] | USB_1_SS_2TXN |
CP9 | MG_DQS_L[1] | USB_0_SS_3RXP |
K10 | MG_DQS_L[6] | USB_1_SS_3RXN |
D10 | MG_DQS_L[7] | USB_1_SS_3TXP |
CW10 | MG_DQS_L[9] | USB_0_SS_2TXP |
BL10 | MG_RESET_L | VSS |
misc. | Memory channel H | Memory channel D |
misc. | P1 interface | All pins RSVD |
CF29 | P1A_ZVSS | USB_0_3_ZVSS |
misc. | P2 interface | P1 interface |
misc. | P3 interface | All pins RSVD |
CT28 | P3B_ZVSS | USB_0_2_ZVSS |
A23 | PCIE_RST1_L/EGPIO26_1 | RSVD |
B28 | PCIE_RST2_L/EGPIO26_2 | PCIE_RST1_L/EGPIO26_1 |
DB21 | PCIE_RST3_L/EGPIO26_3 | RSVD |
CY44 | PM_INTR_L/AGPIO89 | GENINT1_L/AGPIO89 |
AY28 | REFCLK100SSC_N | GPP_CLK00N |
BA27 | REFCLK100SSC_P | GPP_CLK00P |
E23 | S0A3_GPIO_1/AGPIO10_1/SGPIO1_CLK/MDIO2_SCL | RSVD |
E26 | S0A3_GPIO_2/AGPIO10_2/SGPIO2_CLK/MDIO4_SCL | S0A3_GPIO_1/EGPIO10_1/SGPIO1_CLK/MDIO2_SCL |
DA43 | S0A3_GPIO_3/AGPIO10_3/SGPIO3_CLK/MDIO6_SCL | RSVD |
D34 | TEST41[1] | RSVD |
B16 | TEST41[2] | TEST41[1] |
CY20 | TEST41[3] | RSVD |
CW36 | TEST47[0] | BLINK/AGPIO11 |
E29 | TEST47[1] | RSVD |
D18 | TEST47[2] | TEST47[0] |
CW21 | TEST47[3] | TEST47[1] |
AC33 | TEST4[1] | RSVD |
AC23 | TEST4[2] | TEST4[1] |
CA21 | TEST4[3] | RSVD |
AB34 | TEST5[1] | RSVD |
AB24 | TEST5[2] | TEST5[1] |
BY22 | TEST5[3] | RSVD |
DB12 | USB0_0_ZVSS | USB_0_0_ZVSS |
CY12 | USB1_0_ZVSS | USB_0_1_ZVSS |
D16 | USB2_1_ZVSS | USB_1_0_ZVSS |
E16 | USB3_1_ZVSS | USB_1_1_ZVSS |
C17 | USB_1_HSD2N | USB_1_HSD0N |
C16 | USB_1_HSD2P | USB_1_HSD0P |
B18 | USB_1_HSD3N | USB_1_HSD1N |
A17 | USB_1_HSD3P | USB_1_HSD1P |
E13 | USB_1_SS_2RXN | USB_1_SS_0RXN |
D13 | USB_1_SS_2RXP | USB_1_SS_0RXP |
A13 | USB_1_SS_2TXN | USB_1_SS_0TXN |
B13 | USB_1_SS_2TXP | USB_1_SS_0TXP |
D15 | USB_1_SS_3RXN | USB_1_SS_1RXN |
E14 | USB_1_SS_3RXP | USB_1_SS_1RXP |
B15 | USB_1_SS_3TXN | USB_1_SS_1TXN |
A14 | USB_1_SS_3TXP | USB_1_SS_1TXP |
CY15 | USB_OC0_L/AGPIO16_0 | USB_0_OC0_L/AGPIO16_0 |
CY14 | USB_OC1_L/AGPIO17_0 | USB_0_OC1_L/AGPIO17_0 |
C13 | USB_OC2_L/EGPIO16_1 | USB_1_OC0_L/EGPIO16_1 |
C14 | USB_OC3_L/EGPIO17_1 | USB_1_OC1_L/EGPIO17_1 |
misc. | VDDIO_MEM_S3_ABCD | VDDIO_MEM_S3_AB |
AP38 | VDDIO_MEM_S3_ABCD_FB_H | VDDIO_MEM_S3_AB_FB_H |
AN38 | VDDIO_MEM_S3_ABCD_FB_L | VDDIO_MEM_S3_AB_FB_L |
misc. | VDDIO_MEM_S3_EFGH | VDDIO_MEM_S3_CD |
BJ18 | VDDIO_MEM_S3_EFGH_FB_H | VDDIO_MEM_S3_CD_FB_H |
BK18 | VDDIO_MEM_S3_EFGH_FB_L | VDDIO_MEM_S3_CD_FB_L |
AG18 | VDD_18_S5_1 | VDDIO_AUDIO |
F12 | VSS | SP3R2 |
A16 | WAFL1_ZVSS | RSVD |
C28 | WAFL2_ZVSS | WAFL1_ZVSS |
DB17 | WAFL3_ZVSS | RSVD |
E43 | X156M_H[1] | RSVD |
F44 | X156M_L[1] | RSVD |
D19 | X156M_H[2] | X156M_H[1] |
E19 | X156M_L[2] | X156M_L[1] |
CW19 | X156M_H[3] | RSVD |
CV20 | X156M_L[3] | RSVD |
Bibliography
- David. S. (March 2018). "ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging"
- "Thermal Design Guide for Socket SP3 Processors", AMD Publ. #55423, Rev. 3.00, November 2017
See also
Facts about "Socket TR4 (SP3r2, sTR4) - Packages - AMD"
designer | AMD + |
first announced | May 16, 2017 + |
first launched | August 10, 2017 + |
instance of | package + |
market segment | Desktop + |
microarchitecture | Zen + and Zen+ + |
name | Socket TR4 + |
package | FCLGA-4094 + |
package contacts | 4,094 + |
package length | 58.5 mm (5.85 cm, 2.303 in) + |
package pitch | 1 mm (0.0394 in) + |
package type | Organic Flip-Chip Land Grid Array + |
package width | 75.4 mm (7.54 cm, 2.969 in) + |
socket | Socket TR4 +, sTR4 + and Socket SP3r2 + |
tdp | 180 W (180,000 mW, 0.241 hp, 0.18 kW) + and 250 W (250,000 mW, 0.335 hp, 0.25 kW) + |