Duron - AMD

AMD Duron

Duron Logo
Developer	AMD
Manufacturer	AMD
Type	Microprocessors
Introduction	April 27, 2000 (announced) June 19, 2000 (launch)
Production	2000-2005
Architecture	K7-derived processor for budget computers
ISA	IA-32
µarch	K7
Word size	32 bit 4 octets 8 nibbles
Process	180 nm 0.18 μm 1.8e-4 mm , 130 nm 0.13 μm 1.3e-4 mm
Technology	CMOS
Clock	600 MHz-1,800 MHz
Package	CPGA-453
Socket	Socket A
Succession
←	→
K6-III	Sempron

Duron was a family of 32-bit x86 microprocessors developed by AMD and introduced in early 2000. Duron, a low-budget derivative of Athlon (K7-based), was introduced as a way for AMD to aggressively compete against Intel's Celeron in the ultra-cheap PC segment. Announced in April of 2000, Duron processors offered the best price-performance ratio providing Celeron with stiff competition.

Overview

In April of 1998 Intel introduced their Celeron family of processors - a family specifically designed to target the ultra-cheaper computer segment. Duron (still nameless at the time) was marked on AMD's roadmap during the Microprocessor Forum in 1998. Almost a year after the introduction of Athlon, AMD introduced the Duron family. With Celeron, Intel opted to using a single socket (Socket 370) for both the Pentium III and Celeron families. This allowed simplification for OEMs and opens the door for the end user to future upgrades. AMD moved in the same direction, using Socket A for Athlon and the new Duron family.

Unlike original Celeron processor models which were artificially slowed down by Intel (e.g. slower bus speed), Duron processors shared the same specs as Athlon - including a higher speed of 100 MHz bus DDR (200 MT/s). Additionally, Intel used the same production for both Celeron and Pentium III, disabling various features as needed during the manufacturing process. Unlike Intel, AMD gave Duron a design of its own, the reduced cache for example directly resulted in smaller die size and thus cheaper manufacturing. These differences played fairly well in AMD's advantage - Duron models were cheaper and had superior performance over their Celeron counterparts.

Architecture

Main article: K7 Microarchitecture

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Die Shot

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Model Identification

Duron processors follow AMD's Ordering Part Number (OPN):

Identification

D

950

A

U

T

1

B

D

HD

600

D

L

V

1

C

Max FSB

B	200 MT/s
C	266 MT/s

L2$ Size

1

64 KB

T_CASE Range

V	0 °C – 85 °C		S	0 °C – 95 °C
T	0 °C – 90 °C		Q	0 °C – 100 °C

Core Voltage

V	1.4 V ± 0.1 V
Q	1.45 V ± 0.1 V
S	1.5 V ± 0.1 V
L	1.5 V ± 0.1 V
U	1.6 V ± 0.1 V
M	1.75 V ± 0.1 V

Package Designation

A	CPGA-453
D	OPGA

Frequency (MHz)

Model Variation

(none)	Original Desktop Processor
M	Original Mobile Desktop Processor
HD	High-Performance Desktop Processor
HM	High-Performance Mobile Processor

Family Designation

D	Duron Processor

Members

Desktop Processors

Spitfire Core

Spitfire-based processors incorporated MMX, Extended MMX, 3DNow!, and Extended 3DNow!.

,,,,,,,,,,,,,,

Spitfire-based Desktop Models
Model	Launched	Process	Freq	Mult.	Bus	Max Mem	V_CORE	Package	Min T_case	Max T_case
Duron 550	19 June 2000	180 nm 0.18 μm 1.8e-4 mm	550 MHz 0.55 GHz 550,000 kHz	5.5	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.6 V 16 dV 160 cV 1,600 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 600	19 June 2000	180 nm 0.18 μm 1.8e-4 mm	600 MHz 0.6 GHz 600,000 kHz	6	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.5 V 15 dV 150 cV 1,500 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 600	19 June 2000	180 nm 0.18 μm 1.8e-4 mm	600 MHz 0.6 GHz 600,000 kHz	6	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.6 V 16 dV 160 cV 1,600 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 650	19 June 2000	180 nm 0.18 μm 1.8e-4 mm	550 MHz 0.55 GHz 550,000 kHz	6.5	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.6 V 16 dV 160 cV 1,600 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 650	19 June 2000	180 nm 0.18 μm 1.8e-4 mm	650 MHz 0.65 GHz 650,000 kHz	6.5	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.5 V 15 dV 150 cV 1,500 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 700	19 June 2000	180 nm 0.18 μm 1.8e-4 mm	700 MHz 0.7 GHz 700,000 kHz	7	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.5 V 15 dV 150 cV 1,500 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 700	19 June 2000	180 nm 0.18 μm 1.8e-4 mm	700 MHz 0.7 GHz 700,000 kHz	7	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.6 V 16 dV 160 cV 1,600 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 700	17 October 2000	180 nm 0.18 μm 1.8e-4 mm	700 MHz 0.7 GHz 700,000 kHz	7	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.4 V 14 dV 140 cV 1,400 mV		0 °C 273.15 K 32 °F 491.67 °R	95 °C 368.15 K 203 °F 662.67 °R
Duron 750	5 September 2000	180 nm 0.18 μm 1.8e-4 mm	750 MHz 0.75 GHz 750,000 kHz	7.5	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.5 V 15 dV 150 cV 1,500 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 750	5 September 2000	180 nm 0.18 μm 1.8e-4 mm	750 MHz 0.75 GHz 750,000 kHz	7.5	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.6 V 16 dV 160 cV 1,600 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 800	2 April 2001	180 nm 0.18 μm 1.8e-4 mm	800 MHz 0.8 GHz 800,000 kHz	8	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.5 V 15 dV 150 cV 1,500 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 800	17 October 2000	180 nm 0.18 μm 1.8e-4 mm	800 MHz 0.8 GHz 800,000 kHz	8	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.6 V 16 dV 160 cV 1,600 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 850	8 January 2001	180 nm 0.18 μm 1.8e-4 mm	850 MHz 0.85 GHz 850,000 kHz	8.5	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.6 V 16 dV 160 cV 1,600 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 900	2 April 2001	180 nm 0.18 μm 1.8e-4 mm	900 MHz 0.9 GHz 900,000 kHz	9	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.6 V 16 dV 160 cV 1,600 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 950	6 June 2001	180 nm 0.18 μm 1.8e-4 mm	950 MHz 0.95 GHz 950,000 kHz	9.5	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.6 V 16 dV 160 cV 1,600 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Count: 15

Morgan Core

Morgan-based processors incorporated MMX, Extended MMX, 3DNow!, Extended 3DNow!, and SSE.

,,,,,

Morgan-based Desktop Models
Model	Launched	Process	Freq	Mult.	Bus	Max Mem	V_CORE	Package	Min T_case	Max T_case
Duron 1000	20 August 2001	180 nm 0.18 μm 1.8e-4 mm	1,000 MHz 1 GHz 1,000,000 kHz	10	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.75 V 17.5 dV 175 cV 1,750 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 1100	1 October 2001	180 nm 0.18 μm 1.8e-4 mm	1,100 MHz 1.1 GHz 1,100,000 kHz	11	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.75 V 17.5 dV 175 cV 1,750 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 1200	15 November 2001	180 nm 0.18 μm 1.8e-4 mm	1,200 MHz 1.2 GHz 1,200,000 kHz	12	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.75 V 17.5 dV 175 cV 1,750 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 1300	21 January 2002	180 nm 0.18 μm 1.8e-4 mm	1,300 MHz 1.3 GHz 1,300,000 kHz	13	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.75 V 17.5 dV 175 cV 1,750 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 900	2 April 2001	180 nm 0.18 μm 1.8e-4 mm	900 MHz 0.9 GHz 900,000 kHz	9	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.75 V 17.5 dV 175 cV 1,750 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Duron 950	12 July 2001	180 nm 0.18 μm 1.8e-4 mm	950 MHz 0.95 GHz 950,000 kHz	9.5	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.75 V 17.5 dV 175 cV 1,750 mV		0 °C 273.15 K 32 °F 491.67 °R	90 °C 363.15 K 194 °F 653.67 °R
Count: 6

Applebred Core

Applebred-based processors incorporated MMX, Extended MMX, 3DNow!, Extended 3DNow!, and SSE.

,,

Applebred-based Desktop Models
Model	Launched	Process	Freq	Mult.	Bus	Max Mem	V_CORE	Package	Min T_case	Max T_case
Duron 1400	15 August 2003	130 nm 0.13 μm 1.3e-4 mm	1,400 MHz 1.4 GHz 1,400,000 kHz	10.5	133.33 MHz 0.133 GHz 133,330 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.5 V 15 dV 150 cV 1,500 mV		0 °C 273.15 K 32 °F 491.67 °R	85 °C 358.15 K 185 °F 644.67 °R
Duron 1600	15 August 2003	130 nm 0.13 μm 1.3e-4 mm	1,600 MHz 1.6 GHz 1,600,000 kHz	12	133.33 MHz 0.133 GHz 133,330 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.5 V 15 dV 150 cV 1,500 mV		0 °C 273.15 K 32 °F 491.67 °R	85 °C 358.15 K 185 °F 644.67 °R
Duron 1800	15 August 2003	130 nm 0.13 μm 1.3e-4 mm	1,800 MHz 1.8 GHz 1,800,000 kHz	13.5	133.33 MHz 0.133 GHz 133,330 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.5 V 15 dV 150 cV 1,500 mV		0 °C 273.15 K 32 °F 491.67 °R	85 °C 358.15 K 185 °F 644.67 °R
Count: 3

Mobile Processors

Spitfire Core

Spitfire-based processors incorporated MMX, Extended MMX, 3DNow!, and Extended 3DNow!.

,,

Spitfire-based Mobile Models
Model	Launched	Process	Freq	Mult.	Bus	Max Mem	V_CORE	Package	Min T_case	Max T_case
Duron 600	15 January 2001	180 nm 0.18 μm 1.8e-4 mm	600 MHz 0.6 GHz 600,000 kHz	6	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.4 V 14 dV 140 cV 1,400 mV		0 °C 273.15 K 32 °F 491.67 °R	95 °C 368.15 K 203 °F 662.67 °R
Duron 650	15 January 2001	180 nm 0.18 μm 1.8e-4 mm	650 MHz 0.65 GHz 650,000 kHz	6.5	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.4 V 14 dV 140 cV 1,400 mV		0 °C 273.15 K 32 °F 491.67 °R	95 °C 368.15 K 203 °F 662.67 °R
Duron 700	15 January 2001	180 nm 0.18 μm 1.8e-4 mm	700 MHz 0.7 GHz 700,000 kHz	7	100 MHz 0.1 GHz 100,000 kHz	4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB	1.4 V 14 dV 140 cV 1,400 mV		0 °C 273.15 K 32 °F 491.67 °R	95 °C 368.15 K 203 °F 662.67 °R
Count: 3

Camaro Core

Camaro-based processors incorporated MMX, Extended MMX, 3DNow!, Extended 3DNow!, and SSE.

Camaro-based Mobile Models
Model	Launched	Process	Freq	Mult.	Bus	Max Mem	V_CORE	Package	Min T_case	Max T_case
Count: 0

Motherboards

Vendor	Model	Form	Chipset
Abit	KD7	ATX	VIA KT400
Abit	KR7A	ATX	VIA KT266A
Acorp	7KT266A	ATX	VIA KT266A
Albatron	KX400+	ATX	VIA KT333
Albatron	KX400+ Pro	ATX	VIA KT333
Albatron	KX400-8X	ATX	VIA KT400
AOpen	AK77-333	ATX	VIA KT333
AOpen	AK77-8X Max	ATX	VIA KT400
AOpen	AK77-8XN	ATX	VIA KT400
Asus	A7N266-VM	µATX	NVIDIA nForce 220D
Asus	A7N266-VM	µATX	NVIDIA nForce 220D
Asus	A7N266-VM/AA	µATX	NVIDIA nForce 220D
Asus	A7N8X	ATX	NVIDIA nForce2
Asus	A7V266-E	ATX	VIA KT266A
Asus	A7V333	ATX	VIA KT333
Asus	A7V333	ATX	VIA KT333
Asus	A7V8X	ATX	VIA KT400
AZZA	KT33F-ANB	ATX	VIA KT333
Biostar	M7VIF	ATX	VIA KT333
Biostar	M7VIG	µATX	VIA KM266
Biostar	M7VIK	ATX	VIA KT400
Biostar	M7VIP	ATX	VIA KT333
Chaintech	7AIV5	µATX	VIA KM133A
Chaintech	7SIF	µATX	SiS 740
Chaintech	7VIA	µATX	VIA KT333
Chaintech	7VJDA	ATX	VIA KT266A
Chaintech	7VJS	ATX	VIA KT400
DFI	AD73PRO	ATX	VIA KT266A
ECS	K7S5A	ATX	SiS 735
ECS	K7S6A	ATX	SiS 745
ECS	K7SOM/M841LR	ATX	SiS 740
ECS	K7VTA3	ATX	VIA KT266
ECS	K7VTA3	ATX	VIA KT333
ECS	L7VMM	µATX	VIA KM266
ECS	L7VTA	ATX	VIA KT400
ECS	M825ULR	µATX	VIA KM266
EPoX	8KHA+	ATX	VIA KT266A
EPoX	8KMM+	µATX	VIA KM266
EPoX	EP-8K3A	ATX	VIA KT333
EPoX	EP-8K9A2	ATX	VIA KT400
EPoX	EP-8KMM+	µATX	VIA KM266
FIC	AM-35	µATX	VIA KM266
FIC	AM37	µATX	VIA KM266
FIC	AN-17	ATX	VIA KT333
FIC	AN11	ATX	VIA KT266A
FIC	AN19C	ATX	VIA KT400
FIC	AN19E	ATX	VIA KT400
Gigabyte	GA-7DX	ATX	AMD-761
Gigabyte	GA-7DX+	ATX	AMD-761
Gigabyte	GA-7DXE	ATX	AMD-761
Gigabyte	GA-7DXR+	ATX	AMD-761
Gigabyte	GA-7VA	ATX	VIA KT400
Gigabyte	GA-7VAX	ATX	VIA KT400
Gigabyte	GA-7VAXP	ATX	VIA KT400
Gigabyte	GA-7VAXP Ultra	ATX	VIA KT400
Gigabyte	GA-7VKML	µATX	VIA KM266
Gigabyte	GA-7VR	ATX	VIA KT333
Gigabyte	GA-7VRX	ATX	VIA KT333
Gigabyte	GA-7VRX	ATX	VIA KT333
Gigabyte	GA-7VRXP	ATX	VIA KT333
Gigabyte	GA-7VTXE+	ATX	VIA KT266A
Gigabyte	GA-7VTXH+	ATX	VIA KT266A
Jetway	866AS-Ultra	ATX	VIA KT266A
Jetway	V333DA	ATX	VIA KT333
Leadtek	7350KDA	ATX	SiS 735
Leadtek	K7N415DA	ATX	NVIDIA nForce 415D
Mach Speed Technologies	MZ333DA	ATX	VIA KT333
Mach Speed Technologies	MZ866AS	ATX	VIA KT266A
MSI	K7N2	ATX	NVIDIA nForce2
MSI	K7T Turbo2	ATX	VIA KT133A
MSI	K7T266 Pro2	ATX	VIA KT266A
MSI	KT3 Ultra	ATX	VIA KT333
MSI	KT3 Ultra2	ATX	VIA KT333
MSI	KT4 Ultra	ATX	VIA KT333
MSI	KT4M	µATX	VIA KT400
MSI	KT4V	ATX	VIA KT400
MSI	MS-6340M	µATX	VIA KM133A
MSI	MS-6367	µATX	nVidia nForce 420D
MSI	MS-6382E	ATX	VIA KT333
MSI	MS-6390	µATX	VIA KM266
MSI	MS-6568	µATX	SiS 740
MSI	MS-6593	ATX	VIA KT333
QDI	KD7X	ATX	VIA KT400
QDI	KuDoZ 7E/333	ATX	VIA KT333
QDI	KuDoz 7	ATX	VIA KT266A
Shuttle	AK35GTR	ATX	VIA KT266A
Shuttle	AK35GTR	ATX	VIA KT333
Shuttle	AK37GTR	ATX	VIA KT400
Shuttle	AK38	ATX	VIA KT333
Shuttle	AK39N	ATX	VIA KT400
Shuttle	FS40	FlexATX	SiS 740
Shuttle	FX41	FlexATX	VIA KM266
Soltek	SL-75DRV5	ATX	VIA KT333
Soyo	K7V Dragon Plus	ATX	VIA KT266A
Soyo	SY-KT333 Dragon Lite	ATX	VIA KT333
Soyo	SY-KT333 Dragon Ultra	ATX	VIA KT333
XFX	KT33F-ANB	ATX	VIA KT333

designer	AMD +
first announced	April 27, 2000 +
first launched	June 19, 2000 +
full page name	amd/duron +
instance of	microprocessor family +
instruction set architecture	IA-32 +
main designer	AMD +
manufacturer	AMD +
microarchitecture	K7 +
name	AMD Duron +
package	CPGA-453 +
process	180 nm (0.18 μm, 1.8e-4 mm) + and 130 nm (0.13 μm, 1.3e-4 mm) +
socket	Socket A +
technology	CMOS +
word size	32 bit (4 octets, 8 nibbles) +

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Contents

Overview

Architecture

Die Shot

Model Identification

Members

Desktop Processors

Spitfire Core

Morgan Core

Applebred Core

Mobile Processors

Spitfire Core

Camaro Core

Motherboards

See Also