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Difference between revisions of "amd/ryzen 3/pro 3200g"
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Revision as of 10:28, 3 October 2019
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Ryzen 3 PRO 3200G | |
General Info | |
Designer | AMD |
Manufacturer | GlobalFoundries |
Model Number | PRO 3200G |
Market | Mobile |
Introduction | September 30, 2019 (announced) September 30, 2019 (launched) |
Shop | Amazon |
General Specs | |
Family | Ryzen 3 |
Series | 3000 |
Frequency | 3,600 MHz |
Turbo Frequency | 4,000 MHz |
Bus type | PCIe 3.0 |
Clock multiplier | 36 |
Microarchitecture | |
ISA | x86-64 (x86) |
Microarchitecture | Zen+ |
Core Name | Picasso |
Process | 12 nm |
Transistors | 4,940,000,000 |
Technology | CMOS |
Die | 209.78 mm² |
Word Size | 64 bit |
Cores | 4 |
Threads | 4 |
Max Memory | 64 GiB |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Electrical | |
TDP | 65 W |
cTDP down | 45 W |
OP Temperature | 0° C – 95 °C |
Packaging | |
Package | OPGA-1331 |
Package Type | Organic Micro Pin Grid Array |
Dimension | 40 mm × 40 mm |
Pitch | 1 mm |
Contacts | 1331 |
Socket | Socket AM4 |
Ryzen 3 PRO 3200G is a 64-bit quad-core entry-level performance x86 mobile microprocessor introduced by AMD in mid 2019. This processor is based on AMD's Zen+ microarchitecture and is fabricated on a 12 nm process. The PRO 3200G operates at a base frequency of 3.6 GHz with a TDP of 65 W and a Boost frequency of 4 GHz. This APU supports up to 64 GiB of dual-channel DDR4-2933 memory and incorporates Radeon Vega 8 Graphics operating at up to 1.25 GHz.
This model supports a configurable TDP-down of 45 W.
Cache
- Main article: Zen+ § Cache
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Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller
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Integrated Memory Controller
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Expansions
The 3200G includes 20 PCIe lanes - 16 for a discrete graphics processor and 4 for storage (NVMe or 2 ports SATA Express).
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Expansion Options
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Graphics
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Integrated Graphics Information
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[Edit] Zen with Radeon Vega Hardware Accelerated Video Capabilities | |||||
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Codec | Encode | Decode | |||
Max FPS | @1080p | @1440p | @2160p | @1080p 4:2:0 | @2160p 4:2:0 |
MPEG-2 (H.262) | 60 FPS | N/A | |||
VC-1 | |||||
VP9 8bpc | 240 FPS | 60 FPS | |||
VP9 10bpc | |||||
MPEG-4 AVC (H.264) 8bpc | 120 FPS | 60 FPS | 30 FPS | ||
MPEG-4 AVC (H.264) 10bpc | |||||
HEVC (H.265) 8bpc | 120 FPS | 60 FPS | 30 FPS | ||
HEVC (H.265) 10bpc | |||||
JPEG/MJPEG 8bpc |
Features
[Edit/Modify Supported Features]
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Supported x86 Extensions & Processor Features
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Die
- Further information: Zen+ § Die
- 12 nm process
- 4,940,000,000 transistors
- 209.78 mm² die size
Facts about "Ryzen 3 PRO 3200G - AMD"
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | Ryzen 3 PRO 3200G - AMD#io + |
base frequency | 3,600 MHz (3.6 GHz, 3,600,000 kHz) + |
bus type | PCIe 3.0 + |
clock multiplier | 36 + |
core count | 4 + |
core name | Picasso + |
designer | AMD + |
die area | 209.78 mm² (0.325 in², 2.098 cm², 209,780,000 µm²) + |
family | Ryzen 3 + |
first announced | September 30, 2019 + |
first launched | September 30, 2019 + |
full page name | amd/ryzen 3/pro 3200g + |
has advanced vector extensions | true + |
has advanced vector extensions 2 | true + |
has amd amd-v technology | true + |
has amd amd-vi technology | true + |
has amd sensemi technology | true + |
has ecc memory support | true + |
has feature | Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology + |
has simultaneous multithreading | true + |
has x86 advanced encryption standard instruction set extension | true + |
instance of | microprocessor + |
integrated gpu | Radeon Vega 8 + |
integrated gpu designer | AMD + |
integrated gpu execution units | 8 + |
integrated gpu max frequency | 1,250 MHz (1.25 GHz, 1,250,000 KHz) + |
isa | x86-64 + |
isa family | x86 + |
l1$ size | 384 KiB (393,216 B, 0.375 MiB) + |
l1d$ description | 8-way set associative + |
l1d$ size | 128 KiB (131,072 B, 0.125 MiB) + |
l1i$ description | 4-way set associative + |
l1i$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l2$ description | 8-way set associative + |
l2$ size | 2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) + |
l3$ size | 4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) + |
ldate | September 30, 2019 + |
manufacturer | GlobalFoundries + |
market segment | Mobile + |
max cpu count | 1 + |
max memory | 65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) + |
max memory bandwidth | 43.71 GiB/s (44,759.04 MiB/s, 46.933 GB/s, 46,933.255 MB/s, 0.0427 TiB/s, 0.0469 TB/s) + |
max memory channels | 2 + |
max operating temperature | 95 °C + |
max pcie lanes | 20 + |
microarchitecture | Zen+ + |
min operating temperature | 0° C + |
model number | PRO 3200G + |
name | Ryzen 3 PRO 3200G + |
package | OPGA-1331 + |
process | 12 nm (0.012 μm, 1.2e-5 mm) + |
series | 3000 + |
smp max ways | 1 + |
socket | Socket AM4 + |
supported memory type | DDR4-2933 + |
tdp | 65 W (65,000 mW, 0.0872 hp, 0.065 kW) + |
tdp down | 45 W (45,000 mW, 0.0603 hp, 0.045 kW) + |
technology | CMOS + |
thread count | 4 + |
transistor count | 4,940,000,000 + |
turbo frequency | 4,000 MHz (4 GHz, 4,000,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |