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Ryzen 3 PRO 3200G - AMD
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Ryzen 3 PRO 3200G
General Info
DesignerAMD
ManufacturerGlobalFoundries
Model NumberPRO 3200G
Part NumberYD320BC5M4MFH
MarketMobile
IntroductionSeptember 30, 2019 (announced)
September 30, 2019 (launched)
General Specs
FamilyRyzen 3
Series3000
Frequency3,600 MHz
Turbo Frequency4,000 MHz
Bus typePCIe 3.0
Clock multiplier36
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureZen+
Core NamePicasso
Process12 nm
Transistors4,940,000,000
TechnologyCMOS
Die209.78 mm²
Word Size64 bit
Cores4
Threads4
Max CPUs1 (Uniprocessor)
Max Memory64 GiB
Electrical
TDP65 W
cTDP down45 W
OP Temperature0° C – 95 °C
Packaging
PackageµOPGA-1331
Contacts1331
SocketSocket AM4

Ryzen 3 PRO 3200G is a 64-bit quad-core entry-level performance x86 mobile microprocessor introduced by AMD in mid 2019. This processor is based on AMD's Zen+ microarchitecture and is fabricated on a 12 nm process. The PRO 3200G operates at a base frequency of 3.6 GHz with a TDP of 65 W and a Boost frequency of 4 GHz. This APU supports up to 64 GiB of dual-channel DDR4-2933 memory and incorporates Radeon Vega 8 Graphics operating at up to 1.25 GHz.

This model supports a configurable TDP-down of 45 W.

Cache[edit]

Main article: Zen+ § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$384 KiB
0.375 MiB
393,216 B
3.662109e-4 GiB
L1I$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
4x64 KiB4-way set associative 
L1D$128 KiB
0.125 MiB
131,072 B
1.220703e-4 GiB
4x32 KiB8-way set associativewrite-back

L2$2 MiB
2,048 KiB
2,097,152 B
0.00195 GiB
  4x512 KiB8-way set associativewrite-back

L3$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  1x4 MiB  

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2933
Supports ECCYes
Max Mem64 GiB
Controllers2
Channels2
Max Bandwidth43.71 GiB/s
76.055 GB/s
44,759.04 MiB/s
0.0427 TiB/s
0.0469 TB/s
Bandwidth
Single 21.86 GiB/s
Double 43.71 GiB/s

Expansions[edit]

The 3200G includes 20 PCIe lanes - 16 for a discrete graphics processor and 4 for storage (NVMe or 2 ports SATA Express).

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes20
Configs1x16+1x4
USB
Revision3.0, 2.0
Ports4
Rate5 Gbit/s
SATA
Revision3.0
Ports4

Graphics[edit]

[Edit/Modify IGP Info]

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Integrated Graphics Information
GPURadeon Vega 8
DesignerAMD
Execution Units8Max Displays3
Unified Shaders512
Burst Frequency1,250 MHz
1.25 GHz
1,250,000 KHz
OutputDisplayPort, HDMI

Standards
DirectX12
OpenGL4.6
OpenCL2.2

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
SSE4aStreaming SIMD Extensions 4a
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
SHASHA Extensions
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
SMTSimultaneous Multithreading
AMD-ViAMD-Vi (I/O MMU virtualization)
AMD-VAMD Virtualization
SenseMISenseMI Technology

Die[edit]

Further information: Zen+ § Die


raven ridge die.png


raven ridge die (annotated).png
base frequency3,600 MHz (3.6 GHz, 3,600,000 kHz) +
bus typePCIe 3.0 +
clock multiplier36 +
core count4 +
core namePicasso +
designerAMD +
die area209.78 mm² (0.325 in², 2.098 cm², 209,780,000 µm²) +
familyRyzen 3 +
first announcedSeptember 30, 2019 +
first launchedSeptember 30, 2019 +
full page nameamd/ryzen 3/pro 3200g +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has amd amd-v technologytrue +
has amd amd-vi technologytrue +
has amd sensemi technologytrue +
has ecc memory supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuRadeon Vega 8 +
integrated gpu designerAMD +
integrated gpu max frequency1,250 MHz (1.25 GHz, 1,250,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size0.375 MiB (384 KiB, 393,216 B, 3.662109e-4 GiB) +
l1d$ description8-way set associative +
l1d$ size0.125 MiB (128 KiB, 131,072 B, 1.220703e-4 GiB) +
l1i$ description4-way set associative +
l1i$ size0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) +
l2$ description8-way set associative +
l2$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateSeptember 30, 2019 +
manufacturerGlobalFoundries +
market segmentMobile +
max cpu count1 +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth43.71 GiB/s (76.055 GB/s, 44,759.04 MiB/s, 0.0427 TiB/s, 0.0469 TB/s) +
max memory channels2 +
max operating temperature95 °C +
max pcie lanes20 +
microarchitectureZen+ +
min operating temperature0° C +
model numberPRO 3200G +
nameRyzen 3 PRO 3200G +
packageµOPGA-1331 +
part numberYD320BC5M4MFH +
process12 nm (0.012 μm, 1.2e-5 mm) +
series3000 +
socketSocket AM4 +
supported memory typeDDR4-2933 +
tdp65 W (65,000 mW, 0.0872 hp, 0.065 kW) +
tdp down45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
technologyCMOS +
thread count4 +
transistor count4,940,000,000 +
turbo frequency4,000 MHz (4 GHz, 4,000,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +