Revision as of 13:47, 26 April 2019

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FSD Chip
General Info
Designer	Tesla (car company)
Manufacturer	Samsung
Market	Automotive
Introduction	April 22, 2019 (announced) March 10, 2019 (launched)
Microarchitecture
Process	14 nm
Transistors	6,000,000,000
Technology	CMOS
Die	260 mm² 20 mm × 13 mm
Packaging
Package	FCBGA-2116 (BGA)
Dimension	37.5 mm × 37.5 mm
Contacts	2116

Full Self-Driving Chip (FSD Chip, previously Autopilot Hardware 3.0) is an autonomous driving chip designed by Tesla and announced and introduced in early 2019. Fabricated on Samsung's 14 nm process technology, this chip meets AEC-Q100 automotive quality standards.

History

Design and planning for the FSD chip started in 2016 when Tesla claims they saw no alternative solution that fits their problem of addressing autonomous driving. The FSD chip project was led by Pete Bannon. The design team was formed in February 2016. Development was done over the course of 18 months. In August 2017, the chip was released for manufacturing with first silicon coming back in December 2017 fully working. A number of additional modifications were done to the design, requiring respinning. B0 stepping was released to manufacturing in April 2018. Full production of B0 started shortly after qualifications in July 2018. In December 2018, Tesla started retrofitting employee cars with the new hardware and software stack. In March 2019, Tesla began volume shipping the FSD chip and computer in their Model S and Model X cars. Production shipment in the Tesla Model 3 started in April 2019.

Overview

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Full self-driving computer (FSD Computer)

The FSD computer is designed to be retrofitted into existing Tesla models and is therefore largely the same in terms of form factor and I/O. The computer itself fits just behind the glove compartment of the car. The FSD Computer can be installed by a technician in the same slot as the prior Autopilot Hardware 2.5 board. The board itself incorporates two fully independent FSD chips along with their own power subsystem, DRAM, and flash memory for full redundancy. Each chip boots up from its own storage memory and runs its own independent operating system. On the right of the board (shown below) are the eight camera connectors. The power supply and controls are on the left side of the board. The board sits on two independent power supplies - one for one of the FSD chips and one for the other. Additionally, half of the cameras sit on one power supply and the other half sit on the second power supply (note that the video input itself is received by both chips).

The computer itself intakes inputs from a variety of sources including current car readings such as acceleration and speed, radar, GPS, IMU, ultrasonic sensors, wheel ticks, steering angle, and maps data. Data is fed to both FSD chips simultaneously for processing. The two chips independently form a future plan for the car which is then consequently compared between the two chips to ensure an agreement was reached. Once the two plans from both chips agree on the calculated plan, the car can proceed and drive. The drive commands are then validated and sensory information is used as feedback for ensuring the commands executed the desired operations.

Die

SoC

• Samsung 14 nm process
• 12 metal layers
• 260 mm² die size
  • ~20 mm x 13 mm die size
• 6,000,000,000 transistors
  • 250,000,000 gates

Top bumps

• Samsung 14 nm process
• 12 metal layers
• 12,464 C4 bumps

See also

• Nvidia Tegra Xavier
• Mobileye EyeQ

Bibliography

• Tesla Autonomy Day, Apr 22, 2019
• Tesla, personal communication, April 25, 2019